This invention relates to a process for making a polycondensation pre-polyester, a polyester or both, comprising the following steps: A. Acylation of at least one diacid chloride with at least one alcohol to form at least one diester; B. Partial hydrolysis of the diester product of Step A to form at least one monoacid; C. Esterifying the monoacid of Step B with at least one diol to form a diester; D. Reacting the diester of Step C under acidic conditions to form a diacid; and subsequently, performing either Step E or Step F as follows: E. Bisalkylation of the diacid of Step D with at least one haloalcohol to form a pentamer, or F. Esterifiying the diacid of Step D under esterification conditions with at least one diol to form a pentamer, provided that the diol is not the same as the diol used in Step C.

A process for preparing a recycle content polyester and a recycle content polyester composition comprising at least one polyester having at least one residue in the polyester derived from a recycle propylene composition are provided.

A process for preparing a recycle content polyester and a recycle content polyester composition comprising at least one polyester having at least one residue in the polyester derived from a recycle propylene composition are provided.

The present disclosure relates to a polyester resin blend and a molded article formed therefrom. The polyester resin blend exhibits excellent processability even if it contains recycled polyethylene terephthalate as well as virgin polyethylene terephthalate, and can provide high-quality molded articles, especially by extrusion blow molding. In addition, it can be reused, and it is expected to be useful for providing continuously usable plastics that have been recently attracting attention.

A thermoplastic resin composition includes a first copolymer including a conjugated diene-based polymer, a unit derived from an aromatic vinyl-based monomer, and a unit derived from a vinyl cyan-based monomer; a second copolymer including a unit derived from an aromatic vinyl-based monomer and a unit derived from a vinyl cyan-based monomer; and, with respect to 100 parts by weight of the sum of the first copolymer and the second copolymer, 2.0 to 10 parts by weight of a third copolymer having a soft segment including a unit derived from a polyalkylene glycol and a hard segment including unit derived from an aromatic dicarboxylic acid or aromatic dicarboxylate and a unit derived from a linear aliphatic diol; and 2.5 to 10 parts by weight of a fourth copolymer including an aromatic dicarboxylic acid-derived unit, a unit derived from a linear aliphatic diol, and a unit derived from a cyclic aliphatic diol.

A thermoplastic resin composition includes a first copolymer including a conjugated diene-based polymer, a unit derived from an aromatic vinyl-based monomer, and a unit derived from a vinyl cyan-based monomer; a second copolymer including a unit derived from an aromatic vinyl-based monomer and a unit derived from a vinyl cyan-based monomer; and, with respect to 100 parts by weight of the sum of the first copolymer and the second copolymer, 2.0 to 10 parts by weight of a third copolymer having a soft segment including a unit derived from a polyalkylene glycol and a hard segment including unit derived from an aromatic dicarboxylic acid or aromatic dicarboxylate and a unit derived from a linear aliphatic diol; and 2.5 to 10 parts by weight of a fourth copolymer including an aromatic dicarboxylic acid-derived unit, a unit derived from a linear aliphatic diol, and a unit derived from a cyclic aliphatic diol.

The present invention relates to a polyester or polyurethane polymer comprising a biomass-derived 1,3-cyclopentanediol monomer, and a method for preparing same.

The present invention relates to a polyester or polyurethane polymer comprising a biomass-derived 1,3-cyclopentanediol monomer, and a method for preparing same.

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R.sup.2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

##STR00001##

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R.sup.2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

##STR00001##