C08G65/18

Method for Manufacturing Polarizing Plate and Adhesive Composition for Polarizing Plate
20210191020 · 2021-06-24 · ·

The present specification relates to a method for manufacturing a polarizing plate, and an adhesive composition for a polarizing plate.

Monomer mixture and curable composition containing same
11028225 · 2021-06-08 · ·

Provided is a monomer mixture that is rapidly cured to form a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture of the present invention is a monomer mixture containing at least: a compound represented by Formulas (a-1) and/or (a-2); a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by Formula (c-1).

Monomer mixture and curable composition containing same
11028224 · 2021-06-08 · ·

The present invention provides a monomer mixture that rapidly cures even in high humidity environments, and is useful as a raw material for a curable composition that forms a cured product having excellent adhesion to metals and glass, as well as of course to paper and plastic. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. The monomer mixture contains, as the cationically polymerizable monomers, a compound (A) having a vinyl ether group and a hydroxyl group; a compound (B) having an oxetanyl group and a hydroxyl group; and a compound (C) represented by Formula (c) below. A total content of the compound (A), the compound (B), and the compound (C) is 50 wt. % or greater of the total amount of the monomer mixture, and a content [A] of the compound (A) and a content [B] of the compound (B) satisfy Relationship (1) below.
A/(A+B)≥0.3  (1) ##STR00001##

Monomer mixture and curable composition containing same
11028224 · 2021-06-08 · ·

The present invention provides a monomer mixture that rapidly cures even in high humidity environments, and is useful as a raw material for a curable composition that forms a cured product having excellent adhesion to metals and glass, as well as of course to paper and plastic. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. The monomer mixture contains, as the cationically polymerizable monomers, a compound (A) having a vinyl ether group and a hydroxyl group; a compound (B) having an oxetanyl group and a hydroxyl group; and a compound (C) represented by Formula (c) below. A total content of the compound (A), the compound (B), and the compound (C) is 50 wt. % or greater of the total amount of the monomer mixture, and a content [A] of the compound (A) and a content [B] of the compound (B) satisfy Relationship (1) below.
A/(A+B)≥0.3  (1) ##STR00001##

Curable composition and cured product from same
10988569 · 2021-04-27 · ·

Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention is a curable composition for production of an optical component by molding using silicone molds. The curable composition contains curable compounds and a cationic initiator. The curable compounds include (A) a cycloaliphatic epoxy compound and (B) an oxetane compound. The oxetane compound (B) is present in a content of 10 to 45 weight percent of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 90 weight percent or more is a compound or compounds having a solubility parameter of 9.0 (cal/cm.sup.3).sup.½ or more as determined at 25° C. by the Fedors' method.

Curable composition and cured product from same
10988569 · 2021-04-27 · ·

Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention is a curable composition for production of an optical component by molding using silicone molds. The curable composition contains curable compounds and a cationic initiator. The curable compounds include (A) a cycloaliphatic epoxy compound and (B) an oxetane compound. The oxetane compound (B) is present in a content of 10 to 45 weight percent of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 90 weight percent or more is a compound or compounds having a solubility parameter of 9.0 (cal/cm.sup.3).sup.½ or more as determined at 25° C. by the Fedors' method.

CATIONICALLY CURABLE COMPOSITIONS WITH LATENT REDUCING AGENT DEMONSTRATING LOW CURE TEMPERATURE
20210107915 · 2021-04-15 ·

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Photopolymerizable composition for forming bezel pattern, method for forming bezel pattern using same, and bezel pattern manufactured thereby

A photopolymerizable composition for forming a bezel pattern developed to be applied on a display substrate, a method for forming a bezel pattern using the same, a bezel pattern manufactured thereby, a display substrate comprising a bezel pattern manufactured thereby, and a rework method for removing a bezel pattern having a defective printed pattern are disclosed herein. In some embodiments, the composition includes a colorant, an epoxy monomer, an oxetane monomer, a vinyl monomer, a cationic photopolymerization initiator, an adhesion promoter and a diluting solvent, the oxetane monomer comprises a monofunctional oxetane monomer and a difunctional oxetane monomer. The composition is suitable for manufacturing a bezel pattern that is easily removed, has sufficient adhesion to a display substrate, and good curing sensitivity and pencil hardness, without requiring a high-temperature heating process.

Photopolymerizable composition for forming bezel pattern, method for forming bezel pattern using same, and bezel pattern manufactured thereby

A photopolymerizable composition for forming a bezel pattern developed to be applied on a display substrate, a method for forming a bezel pattern using the same, a bezel pattern manufactured thereby, a display substrate comprising a bezel pattern manufactured thereby, and a rework method for removing a bezel pattern having a defective printed pattern are disclosed herein. In some embodiments, the composition includes a colorant, an epoxy monomer, an oxetane monomer, a vinyl monomer, a cationic photopolymerization initiator, an adhesion promoter and a diluting solvent, the oxetane monomer comprises a monofunctional oxetane monomer and a difunctional oxetane monomer. The composition is suitable for manufacturing a bezel pattern that is easily removed, has sufficient adhesion to a display substrate, and good curing sensitivity and pencil hardness, without requiring a high-temperature heating process.

Curable composition and cured product from same
10988568 · 2021-04-27 · ·

Provided is a curable composition which has chargeability into silicone molds and curability at excellent levels, less causes the silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition according to the present invention contains curable compounds and a cationic initiator and is used for production of an optical component by molding using silicone molds. The curable compounds include (A) a cycloaliphatic epoxy compound in a content of 10 weight percent or more of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 10 to 50 weight percent is a curable compound or compounds having a molecular weight of 400 or more.