A reversible crosslinking reactant composition is provided. The composition includes at least one furan-group-containing oligomer and a bismaleimide compound having a structure represented by Formula (II),

##STR00001##

wherein the furan-group-containing oligomer is an oligomer having a structure represented by Formula (IV), an oligomer having a structure represented by Formula (V), or an oligomer having a first repeating unit and a second repeating unit, wherein the first repeating unit has a structure represented by Formula (VI), the second repeating unit has a structure represented by Formula (VII),

##STR00002##

wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.12, R.sup.13, R.sup.14, R.sup.15, R.sup.16, R.sup.17, R.sup.18, R.sup.19, R.sup.20, R.sup.21, R.sup.22, R.sup.23, R.sup.24, R.sup.25, q, z and E are as defined in specification.

An antireflective coating composition, including a polymer, a photoacid generator having a crosslinkable group, a compound capable of crosslinking the polymer and the photoacid generator, a thermal acid generator, and an organic solvent.

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), ##STR00001##
(wherein X is a C.sub.1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C.sub.1-16 hydrocarbon group, Z is a divalent C.sub.1-4 linking group, the divalent linking group being bonded to an O group in formula (1), and R.sup.1 is a hydrogen atom or a methyl group.)

A resist underlayer composition includes a polymer including a structural unit represented by Chemical Formula 1; and a solvent and a method of forming patterns using the resist underlayer composition:

##STR00001##

In Chemical Formula 1, at least one of A.sup.1 and A.sup.2 is a group represented by Chemical Formula A:

##STR00002##

Provided are a polymer for an organic bottom anti-reflective coating and a bottom anti-reflective coating composition containing the same. More specifically, provided are a polymer for an organic bottom anti-reflective coating capable of relieving reflection of exposure light and irradiation light on a substrate of a photoresist layer applied on the substrate in a lithographic process of manufacturing a semiconductor device, and a bottom anti-reflective coating composition containing the same.

Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.

Thermal protective materials suitable for use in a spacecraft include a substrate, such as carbon fibers or carbon felt, and cyanate ester resin or phthalonitrile resin, and cross-linkers. These thermal protective materials have a density of about 0.2 to about 0.35 g/cm.sup.3. Methods of making the thermal protective materials include mixing a cyanate ester resin or a phthalonitrile resin and a cross-linker to result in a resin solution, infusing the resin solution into a substrate, and curing the resin to result in the thermal protective material.

A method for forming a multilayer coating film which includes forming an uncured coating film by applying a first aqueous base coating composition, forming an uncured coating film by applying a second aqueous base coating composition, forming an uncured coating film by applying a clear coating composition, and simultaneously heat curing the obtained coating films. The first aqueous base coating composition contains a carbodiimide compound, the clear coating composition contains a hydroxyl group-containing acrylic resin (A) having a hydroxyl value of 120 to 160 mgKOH/g and an acid value of 5 to 10 mgKOH/g, a polyisocyanate compound (B), and a polycarbonate diol compound (C). The component (A) has a hydroxyl group-containing alkyl moiety having 3 or less carbon atoms, and the ratio of the numbers of moles of the isocyanate functional groups of the component (B) and the hydroxyl group functional groups of the component (A) is 1.15 to 1.35.

A method for preparing fire resistant polymeric materials including, providing at least one first polyphenol having three or more phenolic groups, reacting at least one first polyphenol having three or more phenolic groups with at least one halophosphate and at least one first base to produce at least one second phenol having at least one phosphate group, and converting at least one second phenol having at least one phosphate group to a thermoplastic or thermosetting fire resistant polymeric material.

A method of forming a three-dimensional object is carried out by: (a) providing a cyanate ester dual cure resin; (b) forming a three-dimensional intermediate from said resin, where said intermediate has the shape of, or a shape to be imparted to, said three-dimensional object, and where said resin is solidified by exposure to light; (c) optionally washing the three-dimensional intermediate, and then (d) heating and/or microwave irradiating said three-dimensional intermediate sufficiently to further cure said resin and form said three-dimensional object. Compositions useful for carrying out the method, and products made from the method, are also described.