The invention relates to the use of dicyanamide-containing ionic liquids which decrease the cure temperature of cyanate esters to form unique thermoset polymers having a triazine network. These thermoset polymers having the triazine network have an ionic character allowing for use in varied applications. The thermoset polymers described herein are useful in high temperature performance composites, and their high Tg makes them useful as a substitute for epoxies in the microelectronics industry. The thermoset polymers have good fracture toughness, excellent substrate adhesion, low shrinkage, and low moisture uptake.

A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof; (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented.

A polymer and a method of forming a polymer are provided. The polymer has the general structure (I): ##STR00001##
wherein M is an organic moiety; X is a main group element selected from S, P, As, Se, Te, and Sb; R.sub.1 is a direct bond between M and the ethylene group depicted between M and X or a hydrocarbyl linking moiety having between 1 and about 9 carbon atoms; R.sub.2 is a hydrocarbyl moiety; R.sub.3 is an organic linking group; Y has a value of 0, 1, 2, 3, or 4; Z has a value of 0, 1, 2, 3, or 4; YY has a value of 0, 1 or 2; and Y, YY, and Z are such that the total number of moieties bonded to M is 3, 4, 5, or 6.

A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).

The present specification relates to a compound, a method for preparing the same, and a single molecule, an oligomer and a polymer derived from the compound.

A curable resin composition which can achieve a cured product in which the generation of cracks upon curing is suppressed and which has both a low thermal expansion rate and a low water absorbability is provided. The curable resin composition comprises: at least a cyanate ester compound (A) represented by the following formula (I); a metal complex catalyst (B); and an additive (C), wherein the additive (C) contains any one or more selected from the group consisting of a compound represented by the following general formula (II), a compound represented by the following general formula (III), and a tertiary amine. ##STR00001##

Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250 C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound; (C) at least one epoxy resin; (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and (E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt. A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.

Disclosed herein are monomer embodiments that can be used to make polymers, such as homopolymers, heteropolymers, and that can be used in particular embodiments to make sequence-defined polymers. Also disclosed herein are methods of making polymers using such monomer embodiments. Methods of using the polymers disclosed herein also are described.

The present invention is a solventless one liquid type cyanate ester-epoxy resin composition having high thermal resistance as well as excellent storage stability and curing properties, which contains (A) cyanate ester, (B) epoxy resin, (C) guanidine compounds and (D) at least one kind of phenol compounds selected from a group consisting of phenol compounds represented by the following general formulae. In the general formulae, 1 is an integer selected from 0 to 4, R.sup.1 represents an unsubstituted or fluorine-substituted monovalent hydrocarbon group. General formula: ##STR00001##

A composition for forming a resist underlayer film which make possible to form a desired high-adhesion resist pattern. A resist underlayer film-forming composition for lithography containing a polymer having the following structure Formula (1) or (2) at a terminal of a polymer chain, crosslinker, compound promoting crosslinking reaction, and organic solvent.

##STR00001##

(wherein R.sub.1 is a C.sub.1-6 alkyl group optionally having a substituent, phenyl group, pyridyl group, halogeno group, or hydroxy group, R.sub.2 is a hydrogen atom, a C.sub.1-6 alkyl group, hydroxy group, halogeno group, or ester group of C(O)OX wherein X is a C.sub.1-6 alkyl group optionally having a substituent, R.sub.3 is a hydrogen atom, a C.sub.1-6 alkyl group, hydroxy group, or halogeno group, R.sub.4 is a direct bond or divalent C.sub.1-8 organic group, R.sub.5 is a divalent C.sub.1-8 organic group, A is an aromatic ring or heteroaromatic ring, t is 0 or 1, and u is 1 or 2.)