A liquid crystal aligning agent composition for forming a liquid crystal alignment film that can exhibit excellent alignment and electrical characteristics and simultaneously having enhanced durability, a method for preparing a liquid crystal alignment film using the liquid crystal aligning agent composition, and a liquid crystal alignment film comprising an aligned and cured product of the liquid crystal aligning agent composition and a liquid crystal display device comprising the liquid crystal alignment film.

A method for fabricating a shape memory polymer into a three-dimensional object is provided. The method includes forming a film of crosslinked poly(amic acid) on a substrate to provide a laminated substrate; forming the laminated substrate into a first configuration that is in a three-dimensional form; curing the cross-linked poly(amic acid) to provide the shape memory polymer having a permanent shape corresponding to the first configuration; and removing the substrate from the laminated substrate to provide the three-dimensional object comprising the shape memory polymer. The formation of the laminated substrate into the three-dimensional object may be based on origami techniques.

This disclosure relates to dielectric film forming compositions containing a) at least one fully imidized polyimide polymer; b) at least one metal-containing (meth)acrylates; c) at least one catalyst; and d) at least one solvent, as well as related processes and related products. The compositions can form a dielectric film that generates substantially no debris when the dielectric film is patterned by laser ablation process.

A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of ##STR00001##
the Ar represents a group selected from a group consisting of phenyl having a chemical structural formula of ##STR00002##
diphenyl ether having a chemical structural formula of ##STR00003##
biphenyl having a chemical structural formula of ##STR00004##
hexafluoro-2,2-diphenylpropane having a chemical structural formula of ##STR00005##
benzophenone having a chemical structural formula of ##STR00006##
and diphenyl sulfone having a chemical structural formula of ##STR00007##
and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

A poly(imide-amide) copolymer or its precursor includes two ends and a main chain located between the two ends, and includes a group represented by Chemical Formula 1 at one end, and a structural unit represented by Chemical Formula 7, and at least one of a structural unit represented by Chemical Formula 2 or a structural unit represented by Chemical Formula 3 in the main chain:

##STR00001##

wherein, in Chemical Formulae 1, 2, 3, and 7, R.sup.1 and Ar.sup.1 to Ar.sup.4 are the same as defined in the detailed description.

A fast-response thermoplastic shape-memory polyimide and a preparation method thereof, related to a polyimide and a preparation method thereof. The present invention aims to solve the problem in high-temperature conditions of slow shape recovery poor stability, and poor mechanical properties of a shape-memory polymer prepared by utilizing an existing method. The structural formula of the polyamide of the present invention is as represented by formula (I). The preparation method is: 1. preparation of a diamine solution; 2. preparation of an anhydride-terminated high molecular weight polyamic acid; 3. preparation of a viscous sol-gel; and, 4. preparation of the thermoplastic shape-memory polyimide. The thermoplastic shape-memory polyimide prepared per the present invention is provided with a very fast shape recovery rate and improved shape-memory effect. The present invention is applicable in the field of polyimide preparation.

Polymer resins for the vat photopolymerization of thermoplastics are provided, in particular for the vat photopolymerization of thermoplastics with exception thermal stability and mechanical properties. In some aspects, the polymer resins are prepared by ring opening of an aromatic dianhydride with an alcohol containing an acrylate or methacrylate to produce a photocrosslinkable diacid monomer; conversion of the photocrosslinkable diacid monomer to a photocrosslinkable diacyl chloride; and polymerization of the photocrosslinkable diacyl chloride with an aromatic diamine to produce a photocrosslinkable precursor polymer. Upon crosslinking and drying, a thermal imidization can yield aromatic polyimide polymers with high yield and with micron-scale structural resolution.

The present disclosure relates to a polyimide-based block copolymer and a polyimide-based film including the same. The polyimide-based block copolymer according to the present disclosure makes it possible to provide a polyimide-based film having a large molecular weight and exhibiting colorless and transparent properties.