A polyimide oligomer of the formula ##STR00001##
wherein G is a group having a valence of t, each R is independently a C.sub.1-30 divalent bridging group, a C.sub.1-20 alkylene-X, or a C.sub.6-30 arylene-X wherein X is O-M, C(O)O-M, OC(O)O-M, S-M, S(O).sub.2-M, S(O).sub.3-M, OS(O).sub.3-M, or OP(O).sub.3-M wherein each M is independently Li, Na, K, Cs, Mg, Ca, Sr, Cr, Mn, Fe, Co, Ni, Cu, Zn, Cd, B, Al, Ga, In, Ge, Sn, Pb, As, or Sb, provided that at least one R is C.sub.1-20 alkylene-X or C.sub.6-30 arylene-X, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 1 to 6, and each n is independently 1 to 1,000, the total of all values of n is greater than 4, the polyimide oligomer is thermoplastic, and Q, M, D, and V are as provided herein.

A salt composition includes at least one ammonium carboxylate salt obtained from: (a) at least one aromatic compound comprising 2 anhydride functional groups and/or its carboxylic acid and/or ester derivatives; and (b) one or more aliphatic diamines in which said aliphatic diamine or diamines are chosen from the diamines of formula (I) NH.sub.2RNH.sub.2 with R being a saturated aliphatic divalent hydrocarbon radical, the two amine functional groups of which are separated by 4 to 6 carbon atoms and 1 or 2 hydrogen atoms of the divalent radical of which are replaced by 1 or 2 methyl and/or ethyl groups; and optionally the diamines of formula (II) NH.sub.2RNH.sub.2 with R being a saturated or unsaturated and aliphatic, cycloaliphatic or arylaliphatic divalent hydrocarbon radical, which optionally comprises heteroatoms; and at least one chain-limiting compound chosen from monoamines, monoacids or diacids in the , positions.

A graphene-based membrane and a method of producing the same are disclosed. The graphene-based membrane may include a graphene-polymer composite, wherein the graphene-polymer composite may consist of an amine functionalized graphene and a polymer containing an anhydride group as a linker for linking the amine functionalized graphene to the polymer. The graphene-based membrane may be constructed of a single-layer. A method may include reacting a polymer containing an anhydride with an amine functionalized graphene in presence of a solvent to form an intermediate product; and thermal imidizing the intermediate product to form a graphene grafted polymer composite for use in fabricating a graphene-based membrane.

This disclosure relates to dielectric film forming composition containing at least one fully imidized polyimide polymer; at least one inorganic filler; at least one metal-containing (meth)acrylate compound; and at least one catalyst. The dielectric film formed by such a composition can have a relatively low coefficient of thermal expansion (CTE) and a relatively high optical transparency.

A modified polyimide represented by Formula 4: ##STR00001##
wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater, X.sub.1, X.sub.2, X.sub.3, and X.sub.4 are each independently a tetravalent organic group derived from a tetracarboxylic dianhydride, Y.sub.1, Y.sub.2, and Y.sub.3 are each independently a divalent organic group derived from a diamine, p, q, r, and v are each independently an integer of 0 or greater, with the proviso that p, q, r, and v are not simultaneously 0, and r+v is 1 or greater. Additionally, curable resin compositions including the modified polyimide, as well as polyimide films including a cured product of the curable resin composition, and methods for preparing the modified polyimide.

This invention relates to a highly heat-resistant polyamic acid solution and a polyimide film having improved thermal dimensional stability, wherein the polyamic acid solution includes a polymer of a diamine compound, containing 1 to 10 mol % of a carboxylic acid functional group-containing diamine compound based on the total amount of diamine, and a dianhydride compound, and the polyimide film includes polyimide, which is an imidized product of the polyamic acid solution and is configured such that main chains thereof are crosslinked through an amide bond (CONH).

Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

The present invention relates to a liquid crystal aligning agent for use as an alignment layer for liquid crystal display. More specifically, the present invention relates to a liquid crystal aligning agent capable of improving an imidization rate and thus exhibiting an excellent alignment state, a liquid crystal alignment layer comprising the same, a preparation method thereof and a liquid crystal display comprising the liquid crystal alignment layer.

A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of

##STR00001##

the Ar represents a group selected from a group consisting of phenyl having a chemical structural formula of

##STR00002##

diphenyl ether having a chemical structural formula of

##STR00003##

biphenyl having a chemical structural formula of

##STR00004##

hexafluoro-2,2-diphenylpropane having a chemical structural formula of

##STR00005##

benzophenone having a chemical structural formula of

##STR00006##

and diphenyl sulfone having a chemical structural formula of

##STR00007##

and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

A polyimide composition includes 1 to 99 weight percent, preferably 70 to 99 weight percent, more preferably 75 to 95 weight percent of a first polyimide; and 1 to 99 weight percent, preferably 1 to 30 weight percent, more preferably 2 to 25 weight percent of a second polyimide, wherein the first polyimide and the second polyimide are different, and wherein the polyimide composition has a melt flow rate that is greater than a melt flow rate of the first polyimide and less than a melt flow rate of the second polyimide; an apparent viscosity that is less than an apparent viscosity of the first polyimide and less than an apparent viscosity of the second polyimide; and a notched Izod impact strength that is greater than a notched Izod impact strength of the first polyimide and greater than a notched Izod impact strength of the second polyimide.