A modified polyimide represented by Formula 4:

##STR00001##

wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater, X.sub.1, X.sub.2, X.sub.3, and X.sub.4 are each independently a tetravalent organic group derived from a tetracarboxylic dianhydride, Y.sub.1, Y.sub.2, and Y.sub.3 are each independently a divalent organic group derived from a diamine, p, q, r, and v are each independently an integer of 0 or greater, with the proviso that p, q, r, and v are not simultaneously 0, and r+v is 1 or greater. Additionally, curable resin compositions including the modified polyimide, as well as polyimide films including a cured product of the curable resin composition, and methods for preparing the modified polyimide.

A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of ##STR00001##
the Ar represents a group selected from a group consisting of phenyl having a chemical structural formula of ##STR00002##
diphenyl ether having a chemical structural formula of ##STR00003##
biphenyl having a chemical structural formula ##STR00004##
hexafluoro-2,2-diphenylpropane having a chemical structural formula of ##STR00005##
benzophenone having a chemical structural formula of ##STR00006##
and diphenyl sulfone having a chemical structural formula of ##STR00007##
and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

An oligomer including two ends and a main chain located between the two ends, a group represented by Chemical Formula 1 at one end and a structural unit represented by Chemical Formula 2 or Chemical Formula 3 in the main chain:

##STR00001## wherein, in Chemical Formulae 1 to 3, R.sup.1, Ar.sup.1, and Ar.sup.2 are the same as defined in the detailed description.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The present invention relates to a branched copolymer having a polyimide polymer block bonded to each terminal of a branched polyamide functional group, and a photosensitive resin composition including the same, a photosensitive resin film, and an optical device.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

An aerogel and process of making the aerogel is provided. The aerogel is a polyimide aerogel having polyamide cross-links formed using a triacid chloride cross-linker.

A polyimide oligomer of the formula

##STR00001##

wherein G is a group having a valence of t, each R is independently a C.sub.1-30 divalent bridging group, a C.sub.1-20 alkylene-X, or a C.sub.6-30 arylene-X wherein X is O-M, C(O)O-M, OC(O)O-M, S-M, S(O).sub.2-M, S(O).sub.3-M, OS(O).sub.3-M, or OP(O).sub.3-M wherein each M is independently Li, Na, K, Cs, Mg, Ca, Sr, Cr, Mn, Fe, Co, Ni, Cu, Zn, Cd, B, Al, Ga, In, Ge, Sn, Pb, As, or Sb, provided that at least one R is C.sub.1-20 alkylene-X or C.sub.6-30 arylene-X, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 1 to 6, and each n is independently 1 to 1,000, the total of all values of n is greater than 4, the polyimide oligomer is thermoplastic, and Q, M, D, and V are as provided herein.

The present invention relates to a modified polyimide including a terminal group represented by Formula 1: ##STR00001## wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater. The modified polyimide undergoes less reduction in transmittance and is protected from discoloration when cured. Due to these advantages, the modified polyimide can provide a highly transparent colorless polyimide film. Particularly, the modified polyimide is suitable for use in display substrates, interlayer insulating films of semiconductor devices, passivation films, buffer coat films, insulating films for multilayer printed circuit boards, insulating films of OLEDs, and protective films of thin film transistors of liquid crystal display devices. The present invention also relates to a curable composition including the modified polyimide.

A multifunctional crosslinking agent, a crosslinked polymer, and a method of making the same are disclosed. The multifunctional crosslinking agent, which may be used to crosslink amine-terminated polyamides, polyimides, or poly(amide-imide)s, includes three or four anhydride functional groups. The multifunctional crosslinking agent may be defined by a general chemical formula (I): (ZAr).sub.nW, wherein W represents an anhydride functional group that is directly or indirectly bonded to Ar; Ar represents an aryl group that is directly bonded to W; and n is equal to 3 when W is PO or N, or n is equal to 4 when W is Si or a carbon moiety.