A polyimide precursor solution contains a polyimide precursor, particles, and a water-based solvent that contains an amine compound (A), an organic solvent (B) other than the amine compound (A) and amide compounds, and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and is 200° C. or higher and 300° C. or lower.

Phenolic-terminated and phenolic pendent curable polyimides with very good dielectric properties have been prepared. These materials in combination with epoxy resins and other co-curable resins are ideal for being transformed into flexible films that are ready to be laminated for example between copper foils for applications such as copper-clad laminates for a variety of electronics applications.

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

The present invention relates to a liquid crystal alignment agent composition comprising a polymerizable liquid crystal alignment polymer; and a catalyst precursor compound of a specific structure, a method for preparing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display using the same.

A particle-dispersed polyimide precursor solution contains a polyimide precursor having a unit represented by the following formula (I), particles, and a solvent, in which the particle-dispersed polyimide precursor solution satisfies both the following conditions (1) and (2),

##STR00001## (in the formula (I), A represents a tetravalent organic group, and B represents a divalent organic group represented by any of the following formulas (B1) to (B4)),

##STR00002## (in the formulas (B1) to (B4), Ar.sup.1, Ar.sup.10, and Ar.sup.11 each independently represent a trivalent aromatic group which may have a substituent, Ar.sup.2, Ar.sup.4, Ar.sup.5, Ar.sup.7 and Ar.sup.8 each independently represent a divalent aromatic group which may have a substituent, Ar.sup.3 and Ar.sup.6 each independently represent a tetravalent aromatic group which may have a substituent or a group represented by the following formula (II), Ar.sup.9 represents a divalent aromatic group which may have a substituent or a group represented by the following formula (III), X.sup.1 to X.sup.7 each independently represent NRa, O, or S, Ra represents a hydrogen atom, an alkyl group which may have a substituent, or an aryl group, and * represents a bonding site with an adjacent linking group), and

##STR00003## (in the formulas (II) and (III), Ar.sup.12 and Ar.sup.13 each independently represent a trivalent aromatic group which may have a substituent, Ar.sup.14 and Ar.sup.15 each independently represent a divalent aromatic group which may have a substituent, Y and Z each independently represent O, S, S(═O).sub.2, or CRbRc, Rb and Rc each independently represent a hydrogen atom, an alkyl group which may have a substituent, or an aryl group, and * represents a bonding site with an adjacent linking group),

Condition (1): a total content of the groups represented by the formulas (B1) to (B4) is 1% by mass or more and 40% by mass or less with respect to a total amount of the polyimide precursor, and

Condition (2): a content of the particles is 5% by mass or more and 90% by mass or less with respect to a total content of the polyimide precursor and the particles.

The present disclosure provides a multilayer polyimide film in which the core layer is made of a non-thermoplastic polyimide resin comprising one or more imidization catalysts and one or more dehydrating agents, and the skin layer laminated on one or both surfaces of the core layer contains one or more imidization catalysts, but does not contain a dehydrating agent, and a method for manufacturing the same.

A method of preparing a colorless transparent copolyamide-imide resin solution and its fabrication as a thin film has been disclosed. The method details formulations derived from a reaction between one or more units of dianhydride and one or more units of diamine monomers with one or more of the monomers containing fluorine atoms in their structural unit. It enables the fabrication of thin films with superior thermal and mechanical properties along with co-efficient of thermal expansion values as low as 2 ppm/° C. and a tensile modulus as high as 9 GPa. The transparent copolyamide-imide film thus prepared has the potential for utilization in flexible displays such as substrates for thin film transistors (TFT), touch sensor panels (TSP) and cover window in organic light emitting diode (OLED) and liquid crystal display (LCD) applications.

A method for producing an aqueous polyimide precursor solution composition includes forming a polyamic acid by the reaction of a tetracarboxylic acid component and a diamine component in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.

An object of the present invention is to provide a polyimide binder which can be prepared under lower temperature conditions. The binder composition for a secondary battery of the present invention is characterized in comprising a polyamic acid and an aromatic compound comprising an electron donating group and an organic acid group.

A gas separation membrane is provided. The gas separation membrane includes a poly(imide-oxadiazole) polymer including an oligomer having a structure comprising:

##STR00001##

In this structure, Ar.sub.1, Ar.sub.2, and Ar.sub.3 include aromatic moieties, and wherein Ar.sub.1, Ar.sub.2, and Ar.sub.3 are each independently selected.