A particle-dispersed polyimide precursor solution contains a polyimide precursor having a unit represented by the following formula (I), particles, and a solvent, in which the particle-dispersed polyimide precursor solution satisfies both the following conditions (1) and (2), ##STR00001## (in the formula (I), A represents a tetravalent organic group, and B represents a divalent organic group represented by any of the following formulas (B1) to (B4)), ##STR00002## (in the formulas (B1) to (B4), Ar.sup.1, Ar.sup.10, and Ar.sup.11 each independently represent a trivalent aromatic group which may have a substituent, Ar.sup.2, Ar.sup.4, Ar.sup.5, Ar.sup.7 and Ar.sup.8 each independently represent a divalent aromatic group which may have a substituent, Ar.sup.3 and Ar.sup.6 each independently represent a tetravalent aromatic group which may have a substituent or a group represented by the following formula (II), Ar.sup.9 represents a divalent aromatic group which may have a substituent or a group represented by the following formula (III), X.sup.1 to X.sup.7 each independently represent NRa, O, or S, Ra represents a hydrogen atom, an alkyl group which may have a substituent, or an aryl group, and * represents a bonding site with an adjacent linking group), and ##STR00003## (in the formulas (II) and (III), Ar.sup.12 and Ar.sup.13 each independently represent a trivalent aromatic group which may have a substituent, Ar.sup.14 and Ar.sup.15 each independently represent a divalent aromatic group which may have a substituent, Y and Z each independently represent O, S, S(?O).sub.2, or CRbRc, Rb and Rc each independently represent a hydrogen atom, an alkyl group which may have a substituent, or an aryl group, and * represents a bonding site with an adjacent linking group), Condition (1): a total content of the groups represented by the formulas (B1) to (B4) is 1% by mass or more and 40% by mass or less with respect to a total amount of the polyimide precursor, and Condition (2): a content of the particles is 5% by mass or more and 90% by mass or less with respect to a total content of the polyimide precursor and the particles.

Provided is a bismaleimide compound where the compound itself has a superior solubility in various solvents; a resin composition containing this compound has a superior flexibility; and a cured product of such composition has a low relative permittivity and dielectric tangent, a low thermal expansion coefficient, and a superior heat resistance due to a high glass-transition temperature. The bismaleimide compound is represented by the following formula (1):

##STR00001##

wherein A independently represents a cyclic structure-containing tetravalent organic group; B independently represents a dimer acid frame-derived divalent hydrocarbon group; Q independently represents an aromatic ring-containing divalent group that has a fluorene frame or indene frame; W is B or Q; n is 1 to 100; m is 1 to 100; no restrictions are imposed on an order of each repeating unit identified by n and m, and a bonding pattern thereof may be alternate, block or random.

The instant disclosure relates to a method for manufacturing a transparent polyimide film, including providing a polyamic acid solution having a fluorine content more than 12%; adding a dehydrating agent and a catalyst into the polyamic acid solution, the dehydrating agent having an equivalent number equal to or larger than 3; and baking the polyamic acid solution under a temperature ranging from 250 to 350 C. for performing a chemical imidization process so that the transparent polyimide film is obtained. The transparent polyimide film has an elongation rate of more than 30% and a b* value in a CIELAB coordinate of less than 3.5.

Embodiments of the present disclosure include, a dianhydride monomer, a polyimide, a method of making a dianhydride, a method of making a polyimide, and the like. Embodiments of the present disclosure can be used in membrane-based gas separation applications.

A method for producing a polyimide film includes: obtaining a polyamic acid solution having a viscosity of 5 to 150 cps by preparing a raw material mixture liquid containing a solvent, a tetracarboxylic dianhydride represented by a specific general formula, and an aromatic diamine represented by a specific general formula, and has a total content of the tetracarboxylic dianhydride and aromatic diamine of 15% by mass or less, and reacting the tetracarboxylic dianhydride and aromatic diamine with each other in the raw material mixture liquid forming a polyamic acid having a repeating unit represented by a specific general formula; obtaining a polyimide-forming mixture liquid by adding a compound represented by a specific general formula to the polyamic acid solution; and obtaining a polyimide film represented by a specific general formula by forming a film made of the polyimide-forming mixture liquid, followed by imidization of the polyamic acid in the film.

The present invention provides a resin composition, a polyimide preparation method and related products. The resin composition consists of the following components: polyimide which is a soluble product generated by a reaction of monomer groups containing aromatic tetracarboxylic dianhydride and diacid dihydrazide, a main chain of the polyimide containing a hydrazide structure; and a curing agent which comprises one or more of multifunctional epoxy resin, a primary amine compound with three or more functional groups, and polyisocyanate, wherein a mass ratio of the curing agent to the soluble polyimide is 0-20%. The resin composition in the present invention utilizes the hydrazide structure in the polyimide to prepare an adhesive with excellent heat resistance, adhesive performance, and solubility, overcoming the shortcomings of existing polyimide-based adhesives during processing or application.

A method of manufacture of a polyetherimide composition includes contacting a substituted phthalic anhydride and an organic diamine in the presence of diphenyl sulfone, sulfolane, or a combination comprising at least one of the foregoing solvents at a temperature of greater than 130 C. to provide a bis(phthalimide) composition comprising diphenyl sulfone, sulfolane, or a combination comprising at least one of the foregoing solvents and a bis(phthalimide); and polymerizing the bis(phthalimide) and an alkali metal salt of a dihydroxy aromatic compound in the presence of diphenyl sulfone, sulfolane, or a combination comprising at least one of the foregoing to form a polyetherimide. The method does not require any catalyst either for the imidization or the polymerization.

An object of the present invention is to provide a polyimide binder which can be prepared under lower temperature conditions. The binder composition for a secondary battery of the present invention is characterized in comprising a polyamic acid and an aromatic compound comprising an electron donating group and an organic acid group.

The present invention relates to novel block copolyimides for preparing highly selective integrally asymmetrical gas separation membranes of improved permeance, processes for preparing these block copolyimides, membranes prepared from the block copolyimides, and also the use of the block copolyimides and of the membranes prepared therefrom.

A polymide resin is the product of a reaction between an imidized compound (P) of a polyamic acid resin with a compound (C) having a functional group, that can react with a phenolic hydroxyl group, and an ethylenically unsaturated double bond group. The polyamic acid resin is a copolymer of amino compounds (A) and a tetrabasic acid dianhydride (B). Amino compounds (A) contain an aminophenol compound (a1) having at least two amino groups per molecule, an aliphatic diamino compound (a2) having 6-36 carbon atoms, and an aromatic diamino compound (a3) having no phenolic hydroxyl group.