In one aspect, the disclosure relates to azide-containing poly(ether imide) polymers (PEIs; N.sub.3-PEI-N.sub.3) synthesized via a heterogenous diazotizationazidation reaction. In one aspect, the azide-containing PEIs can be solution-cast into films and then thermally crosslinked. In a further aspect, the crosslinked PEIs (X-PEIs) exhibit superior thermal and mechanical properties. In a still further aspect, X-PEIs display outstanding resistance to classical solvents for conventional PEI, including THF, DCM, chloroform, DMF, and NMP. In another aspect, with an initial number average molecular weight (M.sub.n) of 8.9 kDa, the disclosed azide-containing PEIs have a high crosslinking density and thus possess desirable thermal, mechanical, and solvent resistance properties.

There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that is obtained by curing the curable resin composition, a laminate that includes the cured film, a method for manufacturing the cured film, and a semiconductor device including the cured film or the laminate, and a novel polymer precursor.

A photosensitive resin composition including a polyimide resin represented by Chemical Formula 1; a photopolymerizable compound; a photopolymerization initiator; and a solvent, a photosensitive resin layer manufactured utilizing the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are disclosed.

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