The present disclosure relates to a photosensitive resin composition, a photosensitive material including the same, a black matrix including the same, and an electronic device including the same.

A polyamic acid manufacturing system for manufacturing a polyamic acid is disclosed using, as raw materials, a first solution in which a polyaddition-type first polymerizable compound is dissolved and a second solution in which a polyaddition-type second polymerizable compound that reacts with the first polymerizable compound through polyaddition is dissolved. The polyamic acid manufacturing system may include: a first supply part for supplying the first solution; a second supply part for supplying the second solution; a first combining part; and a first reaction part, thereby producing a first polymerization solution in which the polyamic acid is dissolved. Further, the polyamic acid manufacturing system may include: a first supply step of supplying the first solution; a second supply step of supplying the second solution; a first combining step; and a first reaction step, thereby producing a first polymerization solution in which the polyamic acid is dissolved.

Embodiments relate to a polymer film that is excellent in folding characteristics and transparency and maintains excellent mechanical properties even after repeated elongation and shrinkage in the elastic region, a process for preparing the same, and a front panel and a display device comprising the same. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has an MOR.sub.0/9 of Equation A of 2% or less.

A polyimide precursor resin composition for forming a flexible device substrate, including a polyamic acid having a structure obtained from a tetracarboxylic acid component including at least one of 3,3,4,4-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, a diamine component including at least one of paraphenylene diamine and 4,4-diaminodiphenyl ether, and a carboxylic acid monoanhydride, the polyamic acid satisfying equations (1) and (2) below:

0.97X/Y<1.00Equation (1)

0.5(Z/2)/(YX)1.05Equation (2)

in which X represents a number of moles of tetracarboxylic acid component, Y represents a number of moles of diamine component, and Z represents a number of moles of the carboxylic acid monoanhydride.

A polyamide acid composition contains a polyamide acid having a terminal structure represented by a general formula (1), a polyamide acid having a terminal structure represented by a general formula (2), and a polyamide acid having a terminal structure represented by a general formula (3): wherein X is a tetravalent organic group which is a tetracarboxylic acid dianhydride residue, Y is a divalent organic group which is a diamine residue, and Z is a divalent organic group which is an acid anhydride residue. A polyimide film is obtained by applying a solution of a polyamide acid on a substrate, and cyclodehydrating the polyamide acid by heating.

##STR00001##

A method for manufacturing a poly(imide) prepolymer powder includes combining a bisanhydride powder or organic diamine and a solvent comprising an alcohol, a water-soluble ketone or water to form a mixture, adding an organic diamine or bisanhydride powder to the mixture to form a poly(imide) prepolymer, and removing the solvent to provide the poly(imide) prepolymer powder. A method for manufacturing a poly(imide) prepolymer varnish includes combining a bisanhydride powder or organic diamine and a solvent comprising an alcohol, a water-soluble ketone or water to form a mixture, and adding an organic diamine or bisanhydride powder to the mixture to form a poly(imide) prepolymer. The method of manufacturing the varnish further includes at least one of adding an effective amount of a secondary or tertiary amine to solubilize the poly(imide) prepolymer powder, heating the mixture to a temperature effective to provide the varnish, or agitating the mixture to provide the varnish. The poly(imide) prepolymer powder and varnish can have a residual organic diamine content of less than or equal to 1000 ppm. A poly(imide) polymer prepared from the prepolymer powder or varnish is also disclosed.

A method of making a polyetherimide comprising: reacting an aromatic bis(ether anhydride) with an aromatic diamine in a solvent to form a first solid/liquid mixture having a first solids content within 5% of a first target solids content; cooling the first solid/liquid mixture to a temperature within 5% of a target temperature; separating a portion of the liquid component from the cooled first solid/liquid mixture to form a second solid/liquid mixture having a second solids content within 10% of a second target solids content; and melt polymerizing the second solid/liquid mixture to form the polyetherimide.

A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.

A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of ##STR00001##
the Ar represents a group selected from a group consisting of phenyl having a chemical structural formula of ##STR00002##
diphenyl ether having a chemical structural formula of ##STR00003##
biphenyl having a chemical structural formula of ##STR00004##
hexafluoro-2,2-diphenylpropane having a chemical structural formula of ##STR00005##
benzophenone having a chemical structural formula of ##STR00006##
and diphenyl sulfone having a chemical structural formula of ##STR00007##
and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

A method of making a polyetherimide comprises: combining a bisphenol A dianhydride, p-phenylene diamine and a halogenated aromatic solvent to form a reactant solution; heating the reactant solution to a temperature of 205 C. to 330 C. at a pressure sufficient to prevent boiling to afford a reaction solution; removing water from the reaction solution; maintaining the reaction solution at a temperature of 205 C. to 330 C. and a pressure sufficient to prevent boiling for 10 minutes to 5 hours to form a product mixture comprising the polyetherimide and solvent; and isolating the polyetherimide.