A polyimide composition includes 1 to 99 weight percent, preferably 70 to 99 weight percent, more preferably 75 to 95 weight percent of a first polyimide; and 1 to 99 weight percent, preferably 1 to 30 weight percent, more preferably 2 to 25 weight percent of a second polyimide, wherein the first polyimide and the second polyimide are different, and wherein the polyimide composition has a melt flow rate that is greater than a melt flow rate of the first polyimide and less than a melt flow rate of the second polyimide; an apparent viscosity that is less than an apparent viscosity of the first polyimide and less than an apparent viscosity of the second polyimide; and a notched Izod impact strength that is greater than a notched Izod impact strength of the first polyimide and greater than a notched Izod impact strength of the second polyimide.

A polyimide oligomer of the formula

##STR00001##

wherein G is a group having a valence of t, each R is independently a C.sub.1-30 divalent bridging group, a C.sub.1-20 alkylene-X, or a C.sub.6-30 arylene-X wherein X is O-M, C(O)O-M, OC(O)O-M, S-M, S(O).sub.2-M, S(O).sub.3-M, OS(O).sub.3-M, or OP(O).sub.3-M wherein each M is independently Li, Na, K, Cs, Mg, Ca, Sr, Cr, Mn, Fe, Co, Ni, Cu, Zn, Cd, B, Al, Ga, In, Ge, Sn, Pb, As, or Sb, provided that at least one R is C.sub.1-20 alkylene-X or C.sub.6-30 arylene-X, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 1 to 6, and each n is independently 1 to 1,000, the total of all values of n is greater than 4, the polyimide oligomer is thermoplastic, and Q, M, D, and V are as provided herein.

The present disclosure provides an additive of a lithium ion battery. The additive is an oligomer prepared by mixing maleimides and thiobarbituric acid and reacting the mixture of maleimides and thiobarbituric acid at 80 C.-130 C. for 0.5-24 hours. The present disclosure also provides a cathode of the lithium battery with the additive. The additive is 0.5-10 wt % based on the total weight of the cathode active material and the additive.

Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

An amide acid oligomer (AAO) solution, methods of making the same, powder, AAO solution prepregs, AAO dry prepreg, imide prepregs, and fiber reinforced polyimide composites with high temperature resistance and excellent mechanical properties are disclosed herein. In some embodiments, a method of making an AAO solution includes dissolving an aromatic diamine and an aromatic tetracarboxylic compound in a solvent to form a mixture, wherein the solvent has a boiling point of less than 150? C.; stirring the mixture at a temperature ranging from about 5? C. to about 60? C. for about I hour to about 24 hours to form a reaction solution; adding unsaturated acid anhydride to the reaction solution; and stirring the reaction solution at a temperature ranging from about 5? C. to about 60? C. for about 1 minute to about 180 minutes to form an amide acid oligomer solution, the amide acid oligomer solution having amide acid oligomer in the solvent.

The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same. The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General Formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic, or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20. ##STR00001##

The present invention provides a polyimide precursor composition comprising an amic acid ester oligomer of Formula (1):

##STR00001##

and
a diamine of Formula (2) or (3):

##STR00002##

wherein G, P, R, R.sub.x, P, D, E and m are as defined herein.

The present invention also provides a dry film containing the polyimide precursor composition, as well as a polyimide film and polyimide laminate prepared from the composition.

The present invention provides a resin impregnated material and a composite material having excellent dielectric properties, high heat resistance, low stress property and the like at the same time, and a copper-clad laminate using the same.

The resin impregnated material is formed by impregnating a porous fluororesin with a curable resin composition containing: (A) a bismaleimide compound represented by General Formula (I); and (B) a radical polymerization initiator. In General formula (I), X represents an aliphatic, alicyclic, or aromatic hydrocarbon group having 10 to 30 carbon atoms in the main chain; Y represents an aliphatic, alicyclic or aromatic hydrocarbon group; and n represents a number in the range of 1 to 20.

##STR00001##

A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.

Provided are a polyimide precursor comprising a reactive end group of Formula Q, a polyimide composition comprising the same and having improved tensile strength and elongation, and a pattern or film or a semiconductor or display device or an electronic device prepared using the same.