The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The thermosetting resin composition, a prepreg containing same, a metal foil-clad laminate and a printed circuit board; the resin composition comprises the following components: a combination of a bismaleimide resin and a benzoxazine resin or a prepolymer of a bismaleimide resin and a benzoxazine resin, an epoxy resin and an active ester. A metal foil-clad laminate prepared by using the resin composition provided by the present invention has a high glass transition temperature, a low thermal expansion coefficient, a high high-temperature modulus, a high peel strength, a low dielectric constant, a low dielectric loss factor, as well as good heat resistance and good processability.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

Provided is a bismaleimide compound where the compound itself has a superior solubility in various solvents; a resin composition containing this compound has a superior flexibility; and a cured product of such composition has a low relative permittivity and dielectric tangent, a low thermal expansion coefficient, and a superior heat resistance due to a high glass-transition temperature. The bismaleimide compound is represented by the following formula (1):

##STR00001##

wherein A independently represents a cyclic structure-containing tetravalent organic group; B independently represents a dimer acid frame-derived divalent hydrocarbon group; Q independently represents an aromatic ring-containing divalent group that has a fluorene frame or indene frame; W is B or Q; n is 1 to 100; m is 1 to 100; no restrictions are imposed on an order of each repeating unit identified by n and m, and a bonding pattern thereof may be alternate, block or random.

Provided is a thermosetting compound that has satisfactory solvent solubility and can be rapidly cured by a heat treatment to form a cured product having extreme heat resistance. The thermosetting compound according to the present invention is represented by following Formula (1). In Formula (1), R.sup.1 and R.sup.2 each independently represent a thermosetting group; D.sup.1 and D.sup.2 are each, identically or differently, selected from a single bond and a linkage group; Ar.sup.1, Ar.sup.2, and Ar.sup.3 are each, identically or differently, selected from a divalent aromatic hydrocarbon group and a divalent group including two or more aromatic hydrocarbons bonded to each other via any one selected from a single bond, a divalent aliphatic hydrocarbon group, and a divalent alicyclic hydrocarbon group; and E represents, independently on each occurrence, an ester bond.

##STR00001##

Provided are a curable maleimide resin composition and others, in which the curable maleimide resin composition is one that does not employ an aprotic polar solvent such as NMP, can be cured at a temperature lower than 250? ? C. which is a temperature at which a normal polyimide cures, and can particularly be turned into a cured product having a superior adhesiveness to copper. The curable maleimide resin composition contains: (A) a maleimide compound that has a bisphenol structure and a number average molecular weight of 5,000 to 50,000; (B) a reaction initiator; and (C) a diaminotriazine ring-containing imidazole.

The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.

There is provided a soluble polyimide resin comprising: (a) one or more tetracarboxylic acid component residues: (b) one or more diamine component residues; and (c) one or more endcapping compounds; wherein: the one or more endcapping compounds comprise one or more crosslinking groups. The soluble polyimide resin can be used in electronics applications.

The present invention provides the following: a photo alignment method-use liquid crystal aligning agent used to obtain a photo alignment method-use liquid crystal alignment film that does not cause bright spots even when negative liquid crystals are used, and that is capable of achieving good after-image characteristics; a liquid crystal alignment film obtained from the liquid crystal aligning agent; and a liquid crystal display element provided with the liquid crystal aligning agent. Provided is the liquid crystal aligning agent which contains a polyimide or polyimide precursor obtained from a reaction between: a tetracarboxylic acid dianhydride represented by formula (1) (in the formula, X.sup.1 is as set forth in the present specification) or a derivative thereof; and a diamine component that contains a diamine represented by formula (2) (in the formula, R.sup.1, Z.sup.1 and n are as set forth in the present specification).