A negative-type photosensitive resin composition, including: (A) a polymer compound including a polyimide precursor structure; (C) a photopolymerization initiator; (D) an organic compound represented by the following general formula (1); and (E) a solvent. This can provide: a photosensitive resin composition that allows an imide ring-closing reaction at low temperature, that has excellent stability of the composition, that uses a polyimide precursor that enables fine patterning, and that can impart resistance against chemicals after curing. In addition, an object of the present invention is to provide: a patterning process using the above photosensitive resin composition; an interlayer insulating film including a cured coating formed by curing the photosensitive resin composition; and a semiconductor device.

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A photosensitive resin composition, a photosensitive resin layer manufactured using the photosensitive resin composition, and a semiconductor device including the photosensitive resin layer are provided. The photosensitive resin composition includes (A) a resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) a solvent. The photopolymerizable compound includes a compound represented by Chemical Formula 1.

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A resin composition containing a resin that contains a specific repeating unit and a group having an ethylenically unsaturated bond, in which a content of a phenolic hydroxyl group is 0.250 mmol/g or less, and a polymerizable compound having an ethylenically unsaturated bond, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for a cured substance, and a semiconductor device including the cured substance, and a diamine compound having a specific structure.

The present invention provides a photosensitive resin composition which contains (A) a polyimide precursor that has a repeating structure represented by formula (1), and (B) a photoradical initiator. (In formula (1), X1 represents a tetravalent organic group; Y1 represents a divalent organic group; m represents an integer of 1 or more; R1 and R2 each represent a hydrogen atom, a radically polymerizable group or an organic group represented by formula (2). In formula (2), R3, R4 and Rz each independently represent a monovalent organic group having 2 to 20 carbon atoms and not containing a fluorine atom, or alternatively, in cases where one of the R3, R4 and Rz moieties is a hydrogen atom, the other moieties are each a monovalent organic group having 2 to 20 carbon atoms and not containing a fluorine atom, and at least one of the other moieties has a branched chain or a cyclic structure.)

Provided is a negative photosensitive resin composition comprising: a polyimide (A) represented by formula (1) {in formula (1), A denotes a structure derived from a tetracarboxylic dianhydride, B denotes a structure derived from a diamine, and D denotes an imide structure, Z.sub.1 and Z.sub.2 may each be the same or different, and each denotes a monovalent organic group comprising a photopolymerizable functional group and at least one linking group selected from the group consisting of an ester bond, a urea bond, and an amide bond, and the photopolymerizable functional group is present at the end of Z.sub.1 and/or Z.sub.2, l and m are integers of 0 or 1 and satisfy l+m=1, n is an integer of 1-30, and p and q are each an integer of 0-2 and satisfy p+q1}; a solvent (B); and a photopolymerization initiator (C).