An object of the present invention is to provide a cellulose acetate with excellent biodegradability in seawater.

A cellulose acetate having a total degree of acetyl substitution of not greater than 2.7, a ratio τ of a sum of a degree of acetyl substitution at the 2-position and a degree of acetyl substitution at the 3-position to a degree of acetyl substitution at the 6-position in the total degree of acetyl substitution of not less than 2.0, and a sulfate component amount of greater than 20 ppm and not greater than 400 ppm.

Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D.sub.50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D.sub.50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

A molding composition formulation is provided of a thermoset cross-linkable polyol having unsaturated backbone comprising the structure defined by formula 1: (1) a reinforcing filler; and optionally, a flame retardant, a UV stabilizer or a composition comprising one of the foregoing. ##STR00001##

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m.Math.K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m.Math.K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

Provided are a power inductor including a body, a base disposed in the body, a coil disposed on the base, a first external electrode connected to the coil, the first external electrode being disposed on a side surface of the body, and a second external electrode connected to the first external electrode, the second external electrode being disposed on a bottom surface of the body and a method for manufacturing the same.

To provide a composition for an acoustic wave probe which can significantly improve the hardness and the mechanical strength (tensile strength at break, tensile elongation at break, tear strength, and abrasion resistance) of a silicone resin while maintaining a low acoustic attenuation, a silicone resin for an acoustic wave probe and the acoustic wave probe using the composition for an acoustic wave probe, an acoustic wave measurement apparatus, and an ultrasound diagnostic apparatus.

To provide an ultrasound probe in which cMUT is used as an ultrasonic diagnostic transducer, and the composition for an acoustic wave probe and the silicone resin for an acoustic wave probe which can improve the sensitivity of the photoacoustic wave measurement apparatus and the ultrasound endoscope.

Provided are a composition for an acoustic wave probe containing a polysiloxane mixture containing polysiloxane having a vinyl group, polysiloxane having two or more Si—H groups in a molecular chain, and one or more inorganic compound particles, in which the average primary particle diameter of the inorganic compound particles is less than 25 nm and the inorganic compound particles are selected from the group consisting of magnesium oxide, titanium oxide, iron oxide, zinc oxide, zirconium oxide, barium oxide, tin oxide, and ytterbium oxide; a silicone resin for an acoustic wave probe; an acoustic wave probe; an acoustic wave measurement apparatus; an ultrasound diagnostic apparatus; an ultrasound probe; a photoacoustic wave measurement apparatus; and an ultrasound endoscope.

Metal-free compositions for solar-reflective infrared-emissive coatings and methods of producing the same. The paints are suitable for reducing the temperatures of objects below ambient temperatures between sunset and sunrise (nighttime) and part or full daytime (between sunrise and sunset) when such objects are subjected to direct sunlight. Such a solar-reflective infrared-emissive paint may include a particle-polymer composite containing particles in a polymeric matrix, wherein the particles are nanoparticles or microparticles, the paint does not contain a metallic component, and the paint exhibits high reflectance for the solar spectrum wavelengths of 0.3 to 3 micrometers and high emissivity for wavelengths of 8 to 13 micrometers.

A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 1 μm, (D-2) middle-sized filler having a mean size of from 1 to 10 μm, (D-3) large filler having a mean size of larger than 30 μm and comprising at least magnesium oxide.

The purpose of the present invention is to provide a highly thermally conductive silicone composition that exhibits excellent displacement resistance and coatability by forming a silicone composition that contains: an organopolysiloxane that is a product of a reaction between (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to a silicon atom (a Si—H group) at quantities whereby the (Si—H/Si-Vi) ratio is more than 8.0 and not more than 20.0; (C) an inorganic filler having an average particle diameter of 3 μm or less which is selected from among metal oxides and metal nitrides; and (D) a thermally conductive inorganic filler having an average particle diameter of 5 μm or more. The total amount of component (C) and component (D) is 3,500-12,000 parts by mass relative to a total of 100 parts by mass of component (A) and component (B), and the composition has a thermal conductivity of 4 W/m.Math.K or more and an absolute viscosity of 100-1,000 Pa.Math.s. A further purpose of the present invention is to provide a method for producing the highly thermally conductive silicone composition.

Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.Math.m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.