A magnesium oxide powder containing magnesium oxide particles, wherein an average sphericity of a magnesium oxide particle having a projected area equivalent circle diameter of a particle cross section by microscopy of 10 μm or more among the magnesium oxide particles is 0.73 or more and 0.95 or less, a proportion of a magnesium oxide particle having a sphericity of 0.65 or less among the magnesium oxide particles is 20% or less on a number basis, and a proportion of a magnesium oxide particle having a sphericity of 0.55 or less among the magnesium oxide particles is 15% or less on a number basis.

The invention pertains to a fluoroelastomer composition comprising a vinylidene-fluoride based fluoroelastomer, a polyhydroxylated compound, a basic compound, a pyridinium-type salt having an aromatic ring-quaternized nitrogen atom, and comprising at least two groups having a central carbon atom which bears acidic hydrogen atoms; and an accelerant, which possesses an improved molding behaviour, leading to shaped parts possessing less blisters and surface defects.

An ambient curable coating composition includes a mixture of components comprising a polysiloxane having a Mw of at least 10,000 as determined by gel permeation chromatography using a polystyrene standard, (b) an alkoxy functional polysiloxane, and (c) an inorganic corrosion inhibitor, a method of preparing a corrosion resistant coating comprising (i) applying the coating composition to a substrate and (ii) curing component (b) at ambient conditions; and a substrate at least partially coated with the coating composition.

This application relates to synthetic elastomeric articles, such as gloves, comprising the cured product of a synthetic latex composition, the synthetic latex composition comprising a synthetic carboxylated polymer and a cross-linking composition, the cross-linking composition comprising an aqueous solution of a negatively charged multivalent metal complex ion having a pH of at least 9.0. Also described are compositions for forming the articles, and methods for making the articles, based on the use of the described cross-linking composition. The articles, compositions and methods contain a second cross-linking agent comprising either (a) sulphur and a sulphur donor, (b) a multivalent metal oxide or ionic cross-linking agent, (c) sulphur, a sulphur donor and an ionic cross-linking agent, or (d) sulphur donor.

A hydrogenated NBR composition comprising 30 to 200 parts by weight of titanium oxide and 1 to 8 parts by weight of magnesium oxide, based on 100 parts by weight of hydrogenated NBR. By forming a crosslinked rubber layer of the rubber composition on a metal plate, a gasket material with excellent blister resistance, whose roll kneadability is improved without reducing the rubber strength of hydrogenated NBR, is provided. Moreover, the rubber composition is effective as a rubber raw material for use in soft metal or a high hardness hydrogenated NBR material for which kneading processing is difficult.

An insulating filler composed of a mixed powder in which a hydrophobic fumed oxide powder having an average primary particle size D.sub.1, which is smaller than an average primary particle size D.sub.2, is adhered to the surface of a magnesium oxide powder and/or a nitride-based inorganic powder having the average primary particle size D.sub.2, wherein: the ratio D.sub.1/D.sub.2 of the average primary particle size D.sub.1 to the average primary particle size D.sub.2 is 6×10.sup.−5 to 3×10.sup.−3; the volume resistivity of the mixed powder is 1×10.sup.11 Ω.Math.m or more; and the content ratio of the hydrophobic fumed oxide powder in the mixed powder is 5-30 mass %. Also provided is an insulating material in which the above-mentioned insulating filler is contained in a resin molded body.

A thermoplastic resin composition and a molded article including the same. The thermoplastic resin composition includes: about 100 parts by weight of a thermoplastic resin; about 1 to about 30 parts by weight of an additive for laser direct structuring (LDS additive); about 0.01 to about 5 parts by weight of a hindered phenol-based compound; about 0.01 to about 10 parts by weight of a sodium phosphate salt; about 0.01 to about 5 parts by weight of a phosphite compound; about 0.01 to about 5 parts by weight of a sulfonate compound; and about 0.01 to about 10 parts by weight of a metal oxide, wherein a weight ratio of the hindered phenol-based compound, the sodium phosphate salt, the phosphite compound and the sulfonate compound to the metal oxide may range from about 2:1 to about 10:1. The thermoplastic resin composition has good properties in terms of plating reliability and thermal stability (discoloration resistance) and can secure good injection molding stability by suppressing gas generation upon injection molding.

An additive material has a composition of from about 50 wt % to about 95 wt % of a base material and a curing agent when required to cure the base material, and from about 5 wt % to about 50 wt % of a weight percentage of boric acid and a weight percentage of sodium bicarbonate, wherein the weight percentage of boric acid is greater than the weight percentage of sodium bicarbonate. The composition optionally further includes a weight percentage of magnesium oxide.

To provide a fluorinated copolymer composition capable of forming a crosslinked rubber having favorable rubber properties and excellent metal adhesion, and a metal rubber laminate using the crosslinked rubber. A fluorinated copolymer composition comprising a copolymer having units based on tetrafluoroethylene and units based on propylene, a copolymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether), or a copolymer having units based on hexafluoropropylene and units based on vinylidene fluoride, hydrophilic silica, and an acid acceptor.

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.