C08K2003/222

Coating solution for gas barrier, gas barrier laminate, packaging material and packaging material for heat sterilization

This coating solution for a gas barrier contains an ammonium salt (A) of a polymer having a carboxyl group, a particulate multivalent metallic compound (B), and water, the content of the multivalent metallic compound (B) being about 0.5-2.0 times the chemical equivalent of the ammonium salt (A), and the mean particle diameter of the multivalent metallic compound (B) being about 4 μm or less.

FLUORINE-CONTAINING THERMOPLASTIC ELASTOMER COMPOSITION

The present invention relates to a fluorine-containing thermoplastic elastomer composition comprising a continuous thermoplastic fluorocarbon polymer phase and a dispersed fluorine-containing elastomer phase which are useful, for example, in automotive fuel lines.

PROCESSING AIDS FOR DIE LIP BUILDUP SUPPRESSION AND USES THEREOF
20220081557 · 2022-03-17 ·

Disclosed herein is a composition for suppressed die lip buildup. The composition may comprise from about 20 wt. % to about 98 wt. % of a polycarbonate; from about 0.01 wt. % to about 30 wt. % of a polybutylene terephthalate; from about 0.5 wt. % to about 60 wt. % of a functional filler; from about 0.1 wt. % to about 5 wt. % of an ultra-high molecular weight polydimethylsiloxane; and from about 0.01 wt. % to about 30 wt. % of a flame retardant component. The composition may exhibit a notched Izod impact strength of greater than 30 J/m when tested in accordance with ASTM D256 and may exhibit less die buildup during a continuous extrusion process when compared to a substantially similar reference composition in the absence of the ultra-high molecular weight polydimethylsiloxane.

Composition containing fluorinated thermoplastic elastomers and vulcanizates

The present invention relates to new fluorinated thermoplastic elastomer compositions comprising a continuous thermoplastic fluorocarbon polymer phase and a dispersed vulcanized fluorine-containing elastomer phase having improved thermal processability.

Curable Composition and Cured Material
20220089855 · 2022-03-24 ·

A curable composition and a cured material containing: a compound (A) having one (meth) acrylate group in one molecule; a compound (B) having two or more (meth) acrylate groups in one molecule; a polymerization initiator (C); a dispersant (D); and a thermally conductive filler (E) containing zinc oxide.

FILLER COMPOSITION, SILICONE RESIN COMPOSITION AND HEAT DISSIPATION ELEMENT

A filler composition is excellent in heat dissipation. A silicone resin composition includes the filler composition. A heat dissipation element is made by molding the silicone resin composition. More specifically, the filler composition has a filler (A1) having an average particle diameter of 0.3-1.0 μm, a filler (A2) having an average particle diameter of 3-15 μm, and a filler (A3) having an average particle diameter of 35-140 μm, wherein the filler (A1), the filler (A2) and the filler (A3) are one or more kinds selected from alumina, magnesia, AlN covered alumina, AlN and SN.

TRANSMISSION BELT

A power transmission belt includes a belt body made of rubber and a cord embedded in the belt body. The belt body has a portion having the cord embedded therein, and the portion is made of a rubber composition having a storage normal modulus at 25° C. in a grain direction of 80 MPa or more and the ratio of the storage normal modulus at 25° C. in the grain direction to a storage normal modulus at 25° C. in a cross-grain direction of 1.20 or more to 2.50 or less. The rubber composition is arranged such that the grain direction corresponds to a belt length direction and the cross-grain direction corresponds to a belt width direction.

TRANSMISSION BELT

A power transmission belt includes a belt body at least portion of which is made of a rubber composition containing a rubber component, cellulose-based fine fibers, and cotton powder.

ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR DEVICE USING THE SAME AND DICING DIE BONDING FILM USING THE SAME
20220089916 · 2022-03-24 · ·

The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.

THERMOPLASTIC RESIN COMPOSITION FOR REFRIGERANT TRANSPORTING PIPING, AND METHOD FOR PRODUCING SAME
20220073740 · 2022-03-10 ·

Provided is a thermoplastic resin composition for refrigerant transporting piping having high barrier properties, flexibility, and good extrusion processability. The thermoplastic resin composition for refrigerant transporting piping is composed of: a matrix containing a thermoplastic resin; and a domain containing a rubber dispersed in the matrix, and is characterized in that the thermoplastic resin has a melting point of 150° C. or higher, the rubber is a butyl-based rubber or an olefin-based rubber, the matrix contains a viscosity stabilizer, the thermoplastic resin composition contains a processing aid and at least one selected from the group consisting of a phenylenediamine-based anti-aging agent, a quinoline-based anti-aging agent, and a trihydric alcohol having a triazine skeleton, and at least a portion of the rubber is crosslinked.