Patent classifications
C08K2003/222
Coating solution for gas barrier, gas barrier laminate, packaging material and packaging material for heat sterilization
This coating solution for a gas barrier contains an ammonium salt (A) of a polymer having a carboxyl group, a particulate multivalent metallic compound (B), and water, the content of the multivalent metallic compound (B) being about 0.5-2.0 times the chemical equivalent of the ammonium salt (A), and the mean particle diameter of the multivalent metallic compound (B) being about 4 μm or less.
FLUORINE-CONTAINING THERMOPLASTIC ELASTOMER COMPOSITION
The present invention relates to a fluorine-containing thermoplastic elastomer composition comprising a continuous thermoplastic fluorocarbon polymer phase and a dispersed fluorine-containing elastomer phase which are useful, for example, in automotive fuel lines.
PROCESSING AIDS FOR DIE LIP BUILDUP SUPPRESSION AND USES THEREOF
Disclosed herein is a composition for suppressed die lip buildup. The composition may comprise from about 20 wt. % to about 98 wt. % of a polycarbonate; from about 0.01 wt. % to about 30 wt. % of a polybutylene terephthalate; from about 0.5 wt. % to about 60 wt. % of a functional filler; from about 0.1 wt. % to about 5 wt. % of an ultra-high molecular weight polydimethylsiloxane; and from about 0.01 wt. % to about 30 wt. % of a flame retardant component. The composition may exhibit a notched Izod impact strength of greater than 30 J/m when tested in accordance with ASTM D256 and may exhibit less die buildup during a continuous extrusion process when compared to a substantially similar reference composition in the absence of the ultra-high molecular weight polydimethylsiloxane.
Composition containing fluorinated thermoplastic elastomers and vulcanizates
The present invention relates to new fluorinated thermoplastic elastomer compositions comprising a continuous thermoplastic fluorocarbon polymer phase and a dispersed vulcanized fluorine-containing elastomer phase having improved thermal processability.
Curable Composition and Cured Material
A curable composition and a cured material containing: a compound (A) having one (meth) acrylate group in one molecule; a compound (B) having two or more (meth) acrylate groups in one molecule; a polymerization initiator (C); a dispersant (D); and a thermally conductive filler (E) containing zinc oxide.
FILLER COMPOSITION, SILICONE RESIN COMPOSITION AND HEAT DISSIPATION ELEMENT
A filler composition is excellent in heat dissipation. A silicone resin composition includes the filler composition. A heat dissipation element is made by molding the silicone resin composition. More specifically, the filler composition has a filler (A1) having an average particle diameter of 0.3-1.0 μm, a filler (A2) having an average particle diameter of 3-15 μm, and a filler (A3) having an average particle diameter of 35-140 μm, wherein the filler (A1), the filler (A2) and the filler (A3) are one or more kinds selected from alumina, magnesia, AlN covered alumina, AlN and SN.
TRANSMISSION BELT
A power transmission belt includes a belt body made of rubber and a cord embedded in the belt body. The belt body has a portion having the cord embedded therein, and the portion is made of a rubber composition having a storage normal modulus at 25° C. in a grain direction of 80 MPa or more and the ratio of the storage normal modulus at 25° C. in the grain direction to a storage normal modulus at 25° C. in a cross-grain direction of 1.20 or more to 2.50 or less. The rubber composition is arranged such that the grain direction corresponds to a belt length direction and the cross-grain direction corresponds to a belt width direction.
TRANSMISSION BELT
A power transmission belt includes a belt body at least portion of which is made of a rubber composition containing a rubber component, cellulose-based fine fibers, and cotton powder.
ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR DEVICE USING THE SAME AND DICING DIE BONDING FILM USING THE SAME
The present disclosure relates to an adhesive film for a semiconductor and a dicing die-bonding film the same, and particularly, to an adhesive film for a semiconductor, which may reduce electromagnetic interference generated in a semiconductor package by including a polymer matrix in which a magnetic filler including a core and a coating layer formed on the surface of the core is dispersed, and a dicing die-bonding film including the same.
THERMOPLASTIC RESIN COMPOSITION FOR REFRIGERANT TRANSPORTING PIPING, AND METHOD FOR PRODUCING SAME
Provided is a thermoplastic resin composition for refrigerant transporting piping having high barrier properties, flexibility, and good extrusion processability. The thermoplastic resin composition for refrigerant transporting piping is composed of: a matrix containing a thermoplastic resin; and a domain containing a rubber dispersed in the matrix, and is characterized in that the thermoplastic resin has a melting point of 150° C. or higher, the rubber is a butyl-based rubber or an olefin-based rubber, the matrix contains a viscosity stabilizer, the thermoplastic resin composition contains a processing aid and at least one selected from the group consisting of a phenylenediamine-based anti-aging agent, a quinoline-based anti-aging agent, and a trihydric alcohol having a triazine skeleton, and at least a portion of the rubber is crosslinked.