This highly thermally-conductive silicone composition is obtained by blending, as thermally-conductive fillers at a specific ratio and in specific amounts in (A) a silicone composition containing an organopolysiloxane as a main agent, (B) a spherical magnesium oxide powder having an average sphericity of 0.8 or more, an average particle size of 80-150 μm, and a purity of 98 mass % or more, and (C) (C-I) a spherical aluminum oxide powder which has an average sphericity of 0.8 or more and an average particle size of 7-60 μm, and in which the proportion of rough particles of 96-150 μm is 0.1-30 mass % in the entire component (C-I) in a laser diffraction particle size distribution, and (C-II) a spherical or irregularly-shaped aluminum oxide powder having an average particle size of 0.1-4 μm. The thermal conductivity of the composition is 7.0 W/m.Math.K or more, and the viscosity of the composition at 25° C. is 30-800 Pa.Math.s. This highly thermally-conductive silicone composition has excellent electrical insulating properties and thermal conductivity.

The present invention relates to a resin composition comprising an ethylene-vinyl alcohol copolymer (A) with an ethylene unit content of 20 mol % or more and 60 mol % or less, a divalent metal hydroxide (B) and a monovalent metal compound (C), wherein a content of the divalent metal hydroxide (B) is 5 ppm or more and 5000 ppm or less, and a mass ratio (C/B) of the amount of the monovalent metal compound (C) in terms of the monovalent metal atom to the amount of the divalent metal hydroxide (B) in terms of the divalent metal atom is 0.025 to 100. Thus, there is provided a resin composition containing an ethylene-vinyl alcohol copolymer having excellent long run property during melt molding and excellent color phase in long-term melt molding.

Provided is an irradiation-crosslinked ethylene propylene diene monomer (EPDM) composition containing: EPDM 30 to 80 phr (parts per hundred resin) free of a crosslinking agent, a polyolefin (PO) resin 10 to 50 phr, a silicone rubber 5 to 40 phr, a flame retardant 20 to 30 phr, a crosslinking accelerator 5 to 10 phr, a crosslinking assistant 1 to 5 phr, an antioxidant 5 to 15 phr, and a lubricant 0.25 to 5 phr. Provided is a cable produced by: providing the irradiation-crosslinked EPDM composition; first kneading the composition using a kneader; second kneading the first kneaded composition using a roll mill; extruding the second kneaded composition using an extruder, and then cutting the extruded composition to produce pellets as a raw material for the cable; forming a cable of a predetermined length by extruding the pellets using an extruder; and irradiation-crosslinking the formed cable using an electron beam accelerator.

A resin composition including: a thermosetting resin component including a mesogen; and a phosphorus atom-containing thermoplastic polymer type frame retardant, wherein the thermoplastic polymer type frame retardant is a phosphorous atom-containing formed by polymerizing or copolymerizing one of monomers represented by general formulae (1) and (2) below, ##STR00001## wherein, in the general formulae (1) and (2), each of R1 and R2 is any one of an alkyl group, an alkoxy group, an aryl group and an aryloxy group, R1 and R2 being different or identical, and R3 is a methyl group or a hydrogen atom.

A thermally conductive sheet has a thermally conductive resin composition layer, wherein the thermally conductive resin composition layer is made of a thermally conductive resin composition (1) including an inorganic filler and a binder resin (3). The inorganic filler includes a boron nitride particle (2), the content of the inorganic filler in the thermally conductive resin composition layer is 65% by volume or more, and the boron nitride particle (2) has an average aspect ratio of 7 or less, which is calculated from a major axis and a minor axis of a primary particle measured by a specific method. The thermally conductive resin composition layer has a thickness of 200 μm or less.

The invention relates to a composition, such as an adhesive and/or injectable composition, comprising at least or consisting of: ground plant seeds, protein isolate, starch or mixture thereof, a metal oxide, a plasticizer, and optionally, water.

The invention also concerns an article and a lignocellulosic-based composite comprising said composition.

A cellulose acetate resin composition may include a cellulose acetate (A) having a total degree of acetyl substitution of 2.60 or less; a filler (B); and a plasticizer (C). The filler (B) may be selected from the group consisting of (b1) a predetermined inorganic compound, (b2) a predetermined metal salt, (b3) cellulose or hemicellulose, and (b4) wood flour. The plasticizer (C) may he selected from (c1) a glycerin ester-based plasticizer, (c2) an ether-based plasticizer, and (c3) a glycol ester-based plasticizer. A content of the component (A) may he from 4.5 to 90 mass %. A total content of the component (B) may be from 5 to 50 mass %. A total content of the component (C) may be from 5 to 35 mass %.

A thermally conductive silicone composition contains a silicone polymer and a thermally conductive inorganic filler. The ratio X of the BET specific surface area (m.sup.2/g) to the average particle size (μm) of the thermally conductive inorganic filler is 0.1 or more. The thermally conductive inorganic filler is surface treated with a first surface treatment agent and further surface treated with a second surface treatment agent. The first surface treatment agent contains an organic silane compound represented by R.sup.11SiR.sup.12.sub.x(OR.sup.13).sub.3-x (where R.sup.11 is, e.g., a monovalent aliphatic hydrocarbon group having 1 to 4 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 30 carbon atoms, R.sup.12 is, e.g., a methyl group, and R.sup.13 is, e.g., a hydrocarbon group having 1 to 4 carbon atoms). The second surface treatment agent contains a silicone polymer that has a kinematic viscosity of 1000 mm.sup.2/s or less and does not have a hydrolyzable group. Thus, the present invention provides a thermally conductive silicone composition that has improved viscoelasticity and heat resistance, and a method for producing the thermally conductive silicone composition.

This invention relates to an acid resistant adhesive composition, comprising at least one polychloroprene; at least one epoxy silane; at least one amine silane; at least one unsaturated silane; and at least one organic solvent. The acid resistant adhesive composition according to the present invention exhibits excellent initial peel strength and final peel strength after being soaked in electrolyte solution and shows good acid resistant property.

A thermoplastic resin (A) including, in its main chain structure, a unit (i) having a biphenyl group, a unit (ii) having a substituent biphenyl group, a unit (iii) having a specific number of atoms in its main chain, and a unit (iv) having a specific number of atoms in its main chain provides a thermoplastic resin which has a low liquid crystal phase transition temperature and a low isotropic phase transition temperature, is highly thermally conductive, and can be processed by molding at a low melting temperature.