A composite material that prevents the emission of the radiation and a production method thereof. The composite material which prevents the emission of the radiation mainly includes boric acid, sodium pentaborate, barium sulphate, tribasic lead sulphate, zeolite, zinc borate as anti-odour and/or gas suppressor, at least one thermoset component for hardness ability or thermoplastic component for flexibility ability and preferably magnesium oxide, barium titanate and titanium dioxide.

Provided is a thermally conductive composition that is capable of effectively suppressing pump out. Specifically provided is a thermally conductive composition that contains a base oil composition and an inorganic powder filler, wherein: the base oil composition contains a base oil, a thermoplastic resin that has a softening point of 50-150° C., and a thixotropic agent; and when shaped into a thermally conductive sheet of the thermally conductive composition at a temperature not less than the softening point of the thermoplastic resin, the type-A hardness (in compliance with JIS K 6253-3) of the thermally conductive sheet as measured using a durometer is 30-80.

A thermoplastic composition includes a polyarylene ether component, a flame retardant additive, an impact modifier, and a laser direct structuring additive. The laser platable thermoplastic composition is capable of being plated after being activated using a laser, exhibits a plating index of greater than 0.8 when tested using X-ray fluorescence, and exhibits a heat deflection temperature of greater than 150° C. at 0.45 MPa/3.2 mm when tested in accordance with ASTM D648. In further aspects, the thermoplastic composition may further comprise a laser direct structuring additive synergist comprising a polysiloxane, a polysilane, or a silane.

Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.

The present invention relates to a polyolefin composition comprising (a) a hindered amine light stabilizer of formula (1) as defined herein, (b) a hydrotalcite or an inorganic oxide, and (c) a hydroxylamine stabilizer or an amine oxide stabilizer, a flame retardant article comprising such composition, and to the use of components (b) and (c) for reducing odor in a polyolefin composition comprising a component (a).

The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.

A curable composition includes a polymer having a terminal unit. The curable composition also includes a monomer polymerizable with the terminal unit of the polymer. The curable composition additionally includes an inorganic particle capable of absorbing moisture.

The invention relates to a thermoplastic molding composition comprising 5.0 to 57 wt.-% ABS graft copolymer (A); 30.5 to 80 wt.-% SAN copolymer (B) 1.5 to 9.5 wt.-% copolymer (C) with epoxy, maleic anhydride or maleic imide functions; 5 to 29 wt.-% of hollow glass microspheres (D); 6 to 12 wt.-% of glass fibers (E); 0 to 5 wt.-% additives and/or processing aids (F), having a low density and high strength, and a process for its preparation, shaped arti-cles thereof, and its use in the electronics sector.

Embodiments may generally take the form of a degradable composite structure and a method for controlling the rate of degradation of a degradable composite structure. An example embodiment may take the form of a degradable polymer matrix composite (PMC) including a matrix having: a degradable polymer, a fiber reinforcement, and particulate fillers. The fiber loading is between approximately 10% to 70% by weight and the particulate loading is between approximately 5% to 60%.

Embodiments may generally take the form of a degradable composite structure and a method for controlling the rate of degradation of a degradable composite structure. An example embodiment may take the form of a degradable polymer matrix composite (PMC) including a matrix having: a degradable polymer, a fiber reinforcement, and particulate fillers. The fiber loading is between approximately 10% to 70% by weight and the particulate loading is between approximately 5% to 60%.