In one embodiment, ground mineral wool is added to conventional polyurethane composition A or B to improve fire or flame resistant properties. In a second embodiment, a larger percentage of ground mineral wool is used in combination with a higher water concentration in order to substantially reduce the hydrocarbon content of the resulting foam. In a third embodiment, a foam composition is substantially re-formulated to reduce polyol concentration. Preliminary testing has suggested that it is possible to create an effective foam-like insulation without requiring the foam components to have a high polyol concentration.

A multi-layered thermoplastic roofing membrane comprising a planar body including at least three layers, said at least three layers including (i) a top layer that includes magnesium hydroxide dispersed within a thermoplastic resin, (ii) an upper middle layer disposed below said top layer and including magnesium hydroxide and calcium carbonate dispersed within a thermoplastic resin, and (iii) a lower layer disposed below said upper middle layer and including magnesium hydroxide and calcium carbonate dispersed within a thermoplastic resin.

A composition formed of an epoxy resin incorporating a fire retardant.

This coating composition for an electrical steel sheet is a coating composition for an electrical steel sheet containing an epoxy resin, a high-temperature curing agent, and inorganic fine particles, wherein a content of the high-temperature curing agent with respect to 100 parts by mass of the epoxy resin is 5 to 30 parts by mass, wherein the inorganic fine particles are one or more selected from metal hydroxides, metal oxides that react with water at 25? C. to become metal hydroxides and silicate minerals having a hydroxyl group, wherein the volume average particle diameter of the inorganic fine particles is 0.05 to 2.0 ?m, wherein a content of the epoxy resin with respect to a total mass of the coating composition for an electrical steel sheet is 45 mass % or more, and wherein a content of the inorganic fine particles with respect to 100 parts by mass of the epoxy resin is 1 to 100 parts by mass.

A composition which can be cured at room temperature; and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesion force, and excellent thermal conductivity, is provided. In addition, the composition can achieve the low adhesion force, and the like without using a plasticizer or the like, or in a state where even if the plasticizer is used, the use ratio thereof is minimized. A product containing the composition, or a cured body thereof is also provided.

Fire retardant paint compositions and coatings containing acrylic modified polysiloxane, polyphosphate salt, expandable graphite, and fire retardant additives are provided. The paint compositions find use in protecting a substrate against fire and exhibit excellent adhesion to substrates and long term weather resistance.

A semiconductor encapsulation material is used to fabricate a semiconductor device. The semiconductor device includes a semiconductor chip and an encapsulating portion. The encapsulating portion is made of a cured product of the semiconductor encapsulation material. The encapsulating portion encapsulates the semiconductor chip. A stress index (SI), given by the following Formula (1), of the semiconductor encapsulation material is equal to or more than 8500. If a volume of the semiconductor chip is represented by Vc and a total volume of the semiconductor chip and the encapsulating portion is represented by Va, the volume Vc and the total volume Va satisfy the following Formula (2). In Formula (1), E (T) represents a storage modulus, CTE (T) represents a coefficient of thermal expansion, and Mold temp. represents a molding temperature. $\begin{array}{cc}\mathrm{SI}={?}_{35?C.}^{\mathrm{Mold}\mathrm{temp}.}\left[E^{}\left(T\right)?\mathrm{CTE}\left(T\right)\right]\mathrm{dT}& \left(1\right)\end{array}$$\begin{array}{cc}\frac{\mathrm{Vc}}{\mathrm{Va}}?0.3.& \left(2\right)\end{array}$

A semiconductor encapsulation material is used to fabricate a semiconductor device. The semiconductor device includes a semiconductor chip and an encapsulating portion. The encapsulating portion is made of a cured product of the semiconductor encapsulation material. The encapsulating portion encapsulates the semiconductor chip. A stress index (SI), given by the following Formula (1), of the semiconductor encapsulation material is equal to or more than 8500. If a volume of the semiconductor chip is represented by Vc and a total volume of the semiconductor chip and the encapsulating portion is represented by Va, the volume Vc and the total volume Va satisfy the following Formula (2). In Formula (1), E (T) represents a storage modulus, CTE (T) represents a coefficient of thermal expansion, and Mold temp. represents a molding temperature. $\begin{array}{cc}\mathrm{SI}={?}_{35?C.}^{\mathrm{Mold}\mathrm{temp}.}\left[E^{}\left(T\right)?\mathrm{CTE}\left(T\right)\right]\mathrm{dT}& \left(1\right)\end{array}$$\begin{array}{cc}\frac{\mathrm{Vc}}{\mathrm{Va}}?0.3.& \left(2\right)\end{array}$

A composition includes specific amounts of a poly(phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene, a low molecular weight polybutene, a flame retardant, an ultraviolet absorbing agent, and a poly(alkylene oxide). The composition is useful as an insulation or jacketing material for wires and cables.

A composition includes specific amounts of a poly(phenylene ether), a hydrogenated block copolymer of an alkenyl aromatic monomer and a conjugated diene, a polypropylene, a low molecular weight polybutene, a flame retardant, an ultraviolet absorbing agent, and a poly(alkylene oxide). The composition is useful as an insulation or jacketing material for wires and cables.