A filled polyolefin composition made from or containing butene-1 copolymers having high melt flow and an inorganic filler. The compositions are useful for carpet backing.

An object of the present invention is to provide a novel emulsion coagulant having excellent coagulability used in a tire puncture sealing agent, and a tire puncture repair kit that uses the same. The present invention is an emulsion coagulant comprising magnesium oxide and a silane coupling agent and a cellulose and/or magnesium hydroxide, wherein a mass ratio of the magnesium oxide to the silane coupling agent is from 100:0.5 to 100:15; and a tire puncture repair kit that uses the same.

A semiconductor encapsulation material is used to fabricate a semiconductor device. The semiconductor device includes a semiconductor chip and an encapsulating portion. The encapsulating portion is made of a cured product of the semiconductor encapsulation material. The encapsulating portion encapsulates the semiconductor chip. A stress index (SI), given by the following Formula (1), of the semiconductor encapsulation material is equal to or more than 8500. If a volume of the semiconductor chip is represented by Vc and a total volume of the semiconductor chip and the encapsulating portion is represented by Va, the volume Vc and the total volume Va satisfy the following Formula (2). In Formula (1), E′ (T) represents a storage modulus, CTE (T) represents a coefficient of thermal expansion, and Mold temp. represents a molding temperature.

[00001]$\begin{array}{cc}\mathrm{SI}={\int }_{35°C.}^{\mathrm{Moldtemp}.}\left[E^{\prime }\left(T\right)\times \mathrm{CTE}\left(T\right)\right]\mathrm{dT}& \left(1\right)\\ \frac{\mathrm{Vc}}{\mathrm{Va}}\geqq 0.3.& \left(2\right)\end{array}$

A semiconductor encapsulation material is used to fabricate a semiconductor device. The semiconductor device includes a semiconductor chip and an encapsulating portion. The encapsulating portion is made of a cured product of the semiconductor encapsulation material. The encapsulating portion encapsulates the semiconductor chip. A stress index (SI), given by the following Formula (1), of the semiconductor encapsulation material is equal to or more than 8500. If a volume of the semiconductor chip is represented by Vc and a total volume of the semiconductor chip and the encapsulating portion is represented by Va, the volume Vc and the total volume Va satisfy the following Formula (2). In Formula (1), E′ (T) represents a storage modulus, CTE (T) represents a coefficient of thermal expansion, and Mold temp. represents a molding temperature.

[00001]$\begin{array}{cc}\mathrm{SI}={\int }_{35°C.}^{\mathrm{Moldtemp}.}\left[E^{\prime }\left(T\right)\times \mathrm{CTE}\left(T\right)\right]\mathrm{dT}& \left(1\right)\\ \frac{\mathrm{Vc}}{\mathrm{Va}}\geqq 0.3.& \left(2\right)\end{array}$

A method for producing a thixotropic curable silicone composition is provided. The curable silicone composition comprises: (A) a silicone base material comprising: an organopolysiloxane having at least two alkoxysilyl-containing groups per molecule and a filler other than fumed silica; (B) a hydrophobic fumed silica; (C) a carbasilatrane derivative; (D) an alkoxysilane or its partial hydrolysis and condensation product; and (E) a condensation reaction catalyst. The method comprises the following steps: (I) mixing components (A) and (B); (II) mixing component (C) with a mixture obtained by step (I); and (III) mixing components (D) and (E) with a mixture obtained by step (II) under free of moisture. The curable silicone composition obtained by the method has an excellent thixotropic property and can cure at room temperature by contact with moisture in air.

Provided is a thermosetting resin composition that contains 40 to 80 parts by volume of an inorganic filler with respect to 100 parts by volume of thermosetting resin solids and the inorganic filler. The inorganic filler contains (A) at least one type of particles selected from among gibbsite-type aluminum hydroxide particles and magnesium hydroxide particles having an average particle size (D.sub.50) of 1 to 15 μm; (B) aluminum oxide particles having an average particle size (D.sub.50) of 1.5 μm or less; and (C) a molybdenum compound, and the blending ratios (by volume) of the component (A), the component (B) and the component (C) with respect to 100% as the total amount of inorganic filler are component (A): 30 to 70%, component (B): 1 to 40%, and component (C): 1 to 10%.

The invention relates to an anti-vibration device (100), for example intended for a railroad application, comprising: a first frame (10), a second frame (20), a shock absorbing structure (30) for the vibrations, situated between the two frames (10, 20), and at least one fire barrier layer (40) at least partially covering the shock absorbing structure (30);
characterized in that said at least one fire barrier layer (40) is a polychloroprene-based elastomer including at least one fire retardance agent chosen from among alumina trihydrate or magnesium hydroxide.

A thermally conductive material is provided. The thermally conductive material includes: a polymer containing a thermally conductive filler and an antioxidant; the polymer being a polymer of a monomer containing an acrylic ester, a hindered phenol-based antioxidant being contained as the antioxidant, a thermal conductivity being 3.2 W/m.Math.K or greater, and an initial Asker C hardness at ambient temperature being 22 or less.

[Problem] To provide a magnesium hydroxide-based solid solution which has smaller primary particles and secondary particles and improved reactivity with an acid as compared with conventional magnesium hydroxide (Mg(OH).sub.2), improves the flame retardancy and mechanical strength of a resin, and also forms a non-sedimenting slurry, providing the same handleability as a liquid.

[Structure] A magnesium hydroxide-based solid solution represented by the following formula (1): Mg(OH).sub.2-xR.sub.x (Formula 1), wherein R represents a monovalent organic acid, and x represents 0<x<1. The magnesium hydroxide-based solid solution is a magnesium oxide (MgO) precursor. A flame retardant for a synthetic resin, including the magnesium hydroxide-based solid solution as an active ingredient. A synthetic resin composition characterized by including 0.1 to 50 parts by weight of the magnesium hydroxide-based solid solution (b) per 100 parts by weight of a synthetic resin (a); and a molded article thereof.

A fire retardant molding contains a thermoplastic compound and an inorganic flameproof agent that is mixed with the thermoplastic compound and which acts by separating from water, having a proportion in the range of 10 wt % to 90 wt %. The fire retardant molding is produced by mixing the thermoplastic material with an inorganic flame-proofing agent, the flame-proofing agent having a proportion in the range of 20 wt % to 80 wt %, and by outputting the compound obtained by mixing, in particular as a flat product. The fire retardant molding is advantageously used, for example, in or on land-based vehicles, water-based vehicles, aircraft and buildings.