The present invention relates to a method for producing a composite structure comprising a magnetic filler material embedded in a resin matrix. So far, a balance between sufficient magnetic performance and mechanical fatigue resistance, for applications involving cyclic strains of hundreds of thousands of cycles, has not been achieved, largely due to the poor compatibility between metallic and plastic surfaces. The present invention solves this problem by embedding magnetic filler material in a resin, after the magnetic filler material has been subjected to a possible surface treatment for improving the adhesion of the magnetic filler material to the resin matrix in the composite structure. Further, a composite structure comprising magnetic filler material embedded in a resin matrix obtainable by the method as disclosed in the current specification is disclosed. Still further, the use of the composite structure in applications requiring magnetic properties and resistance to mechanical fatigue is disclosed.

The invention relates to a curable casting compound for the manufacture of molded plastics, comprising a binder component composition and a composition of the filler component, wherein the filler component composition comprise at least one magnetic metal oxide, in particular magnetite, in a proportion of 1 to 100 percent by weight, in relation to the total mass of the composition of the filler component.

A glove that is detectable by a metal detector. The glove is prepared from latex formulation including a metallic additive. The metallic additive includes a pigment, a surfactant and a solvent. The metallic additive is used in an amount of at least 10 phr based on an amount of a latex formulation.

This disclosure relates to non-naturally occurring light reflecting or color changing materials comprising a segmented array of flexible polymers, wherein the segmented array of flexible polymers comprise photonic crystal lattices embedded therein, wherein the segmented array of flexible polymers are themselves embedded within an elastic supporting polymer that maintains a near constant size during chromatic shifting of the photonic crystal lattices.

A semiconductor-encapsulating resin composition includes a thermosetting resin, a filler, and a colorant. The filler has a mean particle size falling within the range from 0.5 μm to 15.0 μm. The colorant has an electrical resistivity of 1.0 Ω.Math.m or more.

This invention relates to anti-microbial active particles, compositions and uses thereof for inhibiting bacterial growth on surfaces or devices. This invention further discloses methods of making such anti-microbial active particles.

A composite insulator includes an insulating elongated core, a protective layer surrounding the elongated core, the protective layer including an outer surface with a shed profile and an adhesive primer layer disposed between the elongated core and the protective layer for adhering the protective layer to the elongated core, the adhesive primer layer including a coupling agent and particles of a low resistivity material. The method for producing a composite insulator includes preparing a first solution including a solvent, a coupling agent and particles of a low resistivity material, applying the first solution on at least a part of an envelope surface of an insulating elongated core and thus forming one or more first adhesive primer layers and applying a protective layer onto the first adhesive primer layer on the elongated core, wherein the protective layer includes an outer surface with a shed profile.

The present invention relates to specially formulated adhesives and methods for preparing such adhesives. The present invention also relates to composites and materials formed from such adhesives. More specifically, the present invention is concerned with specially formulated adhesives comprising phenolic resins.

The present invention provides a magnetic glass fibre component comprising at least one glass fibre component coated and/or impregnated with an iron ore containing resin.

A process for gluing on an industrial scale, preferably by using hot-melt adhesives, substrates, preferably made of plastic material, by nano-modifying the adhesives through the addition of particles sensitive to electromagnetic fields and electromagnetic induction coupling. The present invention also relates to a simple, low-cost and environment-friendly (i.e., eco-compatible) separation of various components glued by way of the adhesives through the use of the same equipment and the same type of process. Furthermore, the present invention also relates to repairing glued junctions made by way of the adhesives.