A product, especially a master-batch for producing thermally expandable compositions, is obtainable or obtained by reacting, preferably by extruding, a mixture including: (a) at least one polymer P, cross-linkable by peroxide, and (b) at least one coagent, especially an acrylate A, and (c) at least one peroxide PE, wherein the mixture is reacted such that the product has an average melt flow index (MFI) of between 0.1 and 8 g/10 min.

The present disclosure relates to a UV-curable composition and adhesive film, adhesive tape and bonding member containing the same. Said UV-curable composition is a UV-curable composition catalyzable by photobase. Said UV-curable composition comprises (1) acrylic polymer and/or ethylene-vinyl acetate copolymer; (2) curable components, comprising polyfunctional mercaptan and polyfunctional epoxy resin; and a (3) photobase generator. The composition of the present disclosure can be coated into an adhesive tape or adhesive film; such adhesive tape or film possesses initial adhesion before UV curing is carried out and can have the strength of a semi-structural adhesive or a structural adhesive after UV curing is carried out.

A polymeric composition may include a thermoplastic polymer including: at least one monomer selected from the group consisting of vinyl esters, C.sub.2-C.sub.12 olefins, and combinations thereof; and a dynamic crosslinking group; and a crosslinking agent to dynamically crosslink the thermoplastic polymer by ionic bonds or metal-ligand interaction.

A polymeric composition may include a thermoplastic polymer including: at least one monomer selected from the group consisting of vinyl esters, C.sub.2-C.sub.12 olefins, and combinations thereof; and a dynamic crosslinking group; and a crosslinking agent to dynamically crosslink the thermoplastic polymer by ionic bonds or metal-ligand interaction.

The invention provides a semiconductive polymer composition comprising a) at least 30 wt% of an ethylene vinyl acetate copolymer; b) at least 25 wt% carbon black; and c) at least 2 wt% of an ethylene vinyl acetate copolymer with an MFR2 of at least 100 g/10 min; with the proviso that components (a) and (c) are different.

The invention provides a semiconductive polymer composition comprising a) at least 30 wt% of an ethylene vinyl acetate copolymer; b) at least 25 wt% carbon black; and c) at least 2 wt% of an ethylene vinyl acetate copolymer with an MFR2 of at least 100 g/10 min; with the proviso that components (a) and (c) are different.

The present invention relates to a method for preparing ethylene vinylacetate copolymer that can improve the mechanical strength of copolymer by controlling the polymerization conditions using an autoclave reactor.

To provide a waterproof sheet for civil engineering, having sufficient strength and elongation even at a low temperature of about −10° C. and having excellent adhesiveness to a structure such as a tunnel. Disclosed is a waterproof sheet for civil engineering, which has a layer (A) including a composition containing an ethylene-vinyl acetate copolymer (a1) and a thermoplastic resin (a2) other than the ethylene-vinyl acetate copolymer (a1), and a silica-containing layer containing silica, wherein the content of the ethylene-vinyl acetate copolymer (a1) in the composition is 30 to 95% by mass, the content of the thermoplastic resin (a2) is 5 to 70% by mass, and the absolute value of the difference between the SP value of the ethylene-vinyl acetate copolymer (a1) and the SP value of the thermoplastic resin (a2) is less than 0.70 (cal/cm.sup.3).sup.1/2.

To provide a waterproof sheet for civil engineering, having sufficient strength and elongation even at a low temperature of about −10° C. and having excellent adhesiveness to a structure such as a tunnel. Disclosed is a waterproof sheet for civil engineering, which has a layer (A) including a composition containing an ethylene-vinyl acetate copolymer (a1) and a thermoplastic resin (a2) other than the ethylene-vinyl acetate copolymer (a1), and a silica-containing layer containing silica, wherein the content of the ethylene-vinyl acetate copolymer (a1) in the composition is 30 to 95% by mass, the content of the thermoplastic resin (a2) is 5 to 70% by mass, and the absolute value of the difference between the SP value of the ethylene-vinyl acetate copolymer (a1) and the SP value of the thermoplastic resin (a2) is less than 0.70 (cal/cm.sup.3).sup.1/2.

A polymeric composition may include a thermoplastic polymer including: at least one monomer selected from the group consisting of vinyl esters, C2-C12 olefins, and combinations thereof; and a dynamic crosslinking group; and a dynamic crosslinking system to dynamically crosslink the thermoplastic polymer.