Components for articles of footwear and athletic equipment are provided including a foam. A variety of foams and foam components and compositions for forming the foams are provided. In some aspects, the foams and components including the foams can have exceptionally high energy return while also having improved durability and softness. In particular, midsoles including the foams are provided for use in an article of footwear. Methods of making the compositions and foams are provided, as well as methods of making an article of footwear including one of the foam components. In some aspects, the foams and foam components can be made by injection molding or injection molding followed by compression molding.

Components for articles of footwear and athletic equipment are provided including a foam. A variety of foams and foam components and compositions for forming the foams are provided. In some aspects, the foams and components including the foams can have exceptionally high energy return while also having improved durability and softness. In particular, midsoles including the foams are provided for use in an article of footwear. Methods of making the compositions and foams are provided, as well as methods of making an article of footwear including one of the foam components. In some aspects, the foams and foam components can be made by injection molding or injection molding followed by compression molding.

Polymer compositions containing a suitable polymer and a triazine metal phosphate compound are disclosed, and the triazine metal phosphate compound can have a d50 particle size from 0.1 to 45 μm and a BET surface area from 0.5 to 30 m.sup.2/g. The polymer compositions have improved moisture resistance and improved wet insulating properties as compared to polymer compositions that contain polymerized versions of the triazine metal phosphate compound. The polymer compositions can be utilized in a variety of end-uses, such as wire and cable applications.

Polymer compositions containing a suitable polymer and a triazine metal phosphate compound are disclosed, and the triazine metal phosphate compound can have a d50 particle size from 0.1 to 45 μm and a BET surface area from 0.5 to 30 m.sup.2/g. The polymer compositions have improved moisture resistance and improved wet insulating properties as compared to polymer compositions that contain polymerized versions of the triazine metal phosphate compound. The polymer compositions can be utilized in a variety of end-uses, such as wire and cable applications.

Embodiments of the invention relate to method and an additive for a PLA article comprising at least one acrylic impact modifier between 10 and 80 weight % of the total weight of the additive; and at least one vinyl acetate ethylene copolymer (EVA) having ≧12 Wt % vinyl acetate, the EVA between 5 and 50 weight % of the additive; and at least one PLA carrier resin between 5 and 50 weight % of the total weight of the additive.

Embodiments of the invention relate to method and an additive for a PLA article comprising at least one acrylic impact modifier between 10 and 80 weight % of the total weight of the additive; and at least one vinyl acetate ethylene copolymer (EVA) having ≧12 Wt % vinyl acetate, the EVA between 5 and 50 weight % of the additive; and at least one PLA carrier resin between 5 and 50 weight % of the total weight of the additive.

The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.

The present invention relates to a semi-conductive polymer composition, the present invention provides a semi-conductive polymer composition comprising an ethylene copolymer comprising polar co-monomer units; an olefin homo- or copolymer; and a conductive filler; wherein the olefin homo- or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi-conductive polymer composition, and to the use of said composition for the production of a layer, preferably a semi-conducting shield layer of a wire or cable.

The present invention relates to a kit comprising a mould (1; 101; 201) for kids and a powder water-sensitive mixture (M) for making a bijou through the mould, wherein the mould (1; 101; 201) comprises at least one body (2; 102) having a lower face, an opposing upper face (3) and a side wall (4) comprised between the lower face and the upper face (3), and at least one cavity (5) opened on the upper face (3) and equipped with a bottom (6), wherein the at least one body (2; 102) is of a flexible and/or deformable material, and wherein the mixture comprises polyvinyl alcohol, guar gum and ethylene vinyl acetate.

The present invention relates to a kit comprising a mould (1; 101; 201) for kids and a powder water-sensitive mixture (M) for making a bijou through the mould, wherein the mould (1; 101; 201) comprises at least one body (2; 102) having a lower face, an opposing upper face (3) and a side wall (4) comprised between the lower face and the upper face (3), and at least one cavity (5) opened on the upper face (3) and equipped with a bottom (6), wherein the at least one body (2; 102) is of a flexible and/or deformable material, and wherein the mixture comprises polyvinyl alcohol, guar gum and ethylene vinyl acetate.