The present invention relates to a thermoplastic resin composition, a method of preparing the same and a molded article including the same. More particularly, the thermoplastic resin composition includes a polycarbonate resin having a limited melt flow index, a polyorganosiloxane-polycarbonate resin, a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound copolymer, a polyester resin and an epoxy group-containing copolymer in predetermined weight ratios.

The present invention relates to a thermoplastic resin composition, a method of preparing the same and a molded article including the same. More particularly, the thermoplastic resin composition includes a polycarbonate resin having a limited melt flow index, a polyorganosiloxane-polycarbonate resin, a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound copolymer, a polyester resin and an epoxy group-containing copolymer in predetermined weight ratios.

The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer.

The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.

The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer.

The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.

The invention relates to an aqueous polyolefin dispersion having a pH value from 8.6-12.5 containing a from 50 to 100 wt. % of an aqueous dispersion A comprising the following ingredients: i. from 31 to 90 wt. % of A1, a copolymer of ethylene and (meth)acrylic acid having a content of (meth)acrylic based groups of at least 11 wt. % based on the total weight of the copolymer or a mixture of different copolymers of ethylene and (meth)acrylic acid each having a content of (meth)acrylic based groups of at least 11 wt. % based on the total weight of the copolymer, ii. from 10 to 69 wt. % of A2, another olefinic structure units containing polymer, not being a copolymer of ethylene and (meth)acrylic acid, or a mixture of other olefinic structure units containing polymers not being a copolymers of ethylene and (meth)acrylic acid, and iii. from 0-35 wt. % of additive different from A1 and A2, b. from 0 to 50 wt. % of other ingredient(s) B, where compound B is a material dispersible or soluble in water and different from any of the ingredients of dispersion A wherein—the wt. % of A and B is based on the solid content of the whole aqueous polyolefin dispersion,—the wt. % of the ingredients of dispersion A is based on the solid content of dispersion A,—the sum of the wt. % of ingredients i to iii of dispersion A is 100% and wherein the pH of the dispersion is in the range of 9.5 to 11 and/or the dispersion contains, as an ingredient of B, more than 5 and less than 35 wt. % of PEG, based on the solid content of the whole aqueous dispersion.

The invention relates to an aqueous polyolefin dispersion having a pH value from 8.6-12.5 containing a from 50 to 100 wt. % of an aqueous dispersion A comprising the following ingredients: i. from 31 to 90 wt. % of A1, a copolymer of ethylene and (meth)acrylic acid having a content of (meth)acrylic based groups of at least 11 wt. % based on the total weight of the copolymer or a mixture of different copolymers of ethylene and (meth)acrylic acid each having a content of (meth)acrylic based groups of at least 11 wt. % based on the total weight of the copolymer, ii. from 10 to 69 wt. % of A2, another olefinic structure units containing polymer, not being a copolymer of ethylene and (meth)acrylic acid, or a mixture of other olefinic structure units containing polymers not being a copolymers of ethylene and (meth)acrylic acid, and iii. from 0-35 wt. % of additive different from A1 and A2, b. from 0 to 50 wt. % of other ingredient(s) B, where compound B is a material dispersible or soluble in water and different from any of the ingredients of dispersion A wherein—the wt. % of A and B is based on the solid content of the whole aqueous polyolefin dispersion,—the wt. % of the ingredients of dispersion A is based on the solid content of dispersion A,—the sum of the wt. % of ingredients i to iii of dispersion A is 100% and wherein the pH of the dispersion is in the range of 9.5 to 11 and/or the dispersion contains, as an ingredient of B, more than 5 and less than 35 wt. % of PEG, based on the solid content of the whole aqueous dispersion.

The invention relates to the use of polyamide 6 for reduction of the melt viscosity, to be determined at 260° C. to ISO 11443, and/or of the fill pressure, to be determined according to EN ISO 294-1, of compositions and moulding compounds in which there are 10 to 115 parts by mass of glass fibres per 100 parts by mass of poly-C.sub.1-C.sub.6-alkylene terephthalate.

The invention relates to the use of polyamide 6 for reduction of the melt viscosity, to be determined at 260° C. to ISO 11443, and/or of the fill pressure, to be determined according to EN ISO 294-1, of compositions and moulding compounds in which there are 10 to 115 parts by mass of glass fibres per 100 parts by mass of poly-C.sub.1-C.sub.6-alkylene terephthalate.

Disclosed herein is a thermoplastic molding composition, including a) 39.9 to 99.9 wt % of at least one thermoplastic polyamide as component A, b) 0.1 to 10 wt % of at least one plasticizer of the general formula (1)

R.sub.1—O—(CH.sub.2CH.sub.2—O—).sub.nR.sub.2  (1) with n=1 to 10 R.sub.1, R.sub.2 independently H, C.sub.1-12-alkyl, phenyl or tolyl, having a boiling point of more than 250° C., as component B, c) 0 to 45 wt % of at least one elastomeric polymer as component C, d) 0 to 60 wt % of at least one fibrous and/or particulate filler as component D, and e) 0 to 25 wt % of further additives as component E,
where the total of wt % of components A to E is 100 wt %.

The present invention provides a laminate having an adhesive layer excellent in low-temperature adhesiveness, water resistance, and hot water resistance. The laminate includes: a substrate; and an adhesive layer laminated on at least one surface of the substrate, in which the adhesive layer is obtained by drying a coated product of an aqueous dispersion containing water and a resin (X), and the resin (X) contains two or more kinds of ethylene-unsaturated carboxylic acid copolymers (a) each having a different content of a structural unit derived from an unsaturated carboxylic acid.