A polymer composition for use in the removal and recovery of oil slicks or spills floating on the surfaces of bodies or water or present on land, such as beaches comprising a foam of a blend of polyethylene and an ethylene-alkyl acrylate copolymer and a process for using such foams in the selective removal of oil from fresh water or salt water and the recovery of the absorbed oils from the foams is disclosed. The polymer composition is also for use in other applications in which absorption of liquids is desired.

A multi-layer structure comprising: a) at least one layer comprising a polyolefin component comprising i) 60 to 94 weight percent of a first component selected from the group consisting of ethylene homopolymer, ethylene copolymer, polypropylene homopolymer, polypropylene copolymer, and combinations thereof ii) 0-35 weight percent of a functional polymer component, and iii) 1-35 weight percent of a compatibilizer component comprising an anhydride and/or carboxylic acid functionalized ethylene/alpha-olefin interpolymer having a melt viscosity (177° C.) less than, or equal to, 200,000 cP and a density from 0.855 to 0.94 g/cc; b) at least one tie layer comprising maleic-anhydride grafted polymer with a melt index of less than 50 dg/min, wherein the tie layer does not contain the compatibilizer component; and c) at least one polar layer comprising a polar polymer, is disclosed.

A multi-layer structure comprising: a) at least one layer comprising a polyolefin component comprising i) 60 to 94 weight percent of a first component selected from the group consisting of ethylene homopolymer, ethylene copolymer, polypropylene homopolymer, polypropylene copolymer, and combinations thereof ii) 0-35 weight percent of a functional polymer component, and iii) 1-35 weight percent of a compatibilizer component comprising an anhydride and/or carboxylic acid functionalized ethylene/alpha-olefin interpolymer having a melt viscosity (177° C.) less than, or equal to, 200,000 cP and a density from 0.855 to 0.94 g/cc; b) at least one tie layer comprising maleic-anhydride grafted polymer with a melt index of less than 50 dg/min, wherein the tie layer does not contain the compatibilizer component; and c) at least one polar layer comprising a polar polymer, is disclosed.

Disclosed herein is a polycarbonate resin composition. The polycarbonate resin composition includes a polycarbonate resin, inorganic fillers, an impact modifier comprising a modified olefin-based copolymer, and olefin wax containing a reactive group comprising at least one of a carboxylic acid group, a carboxylic acid anhydride group, an epoxy group, and a glycidyl group, wherein the inorganic fillers comprise flake-type fillers and needle-like fillers. The polycarbonate resin composition has excellent properties in terms of appearance, mechanical properties, and dimensional stability.

Disclosed herein is a polycarbonate resin composition. The polycarbonate resin composition includes a polycarbonate resin, inorganic fillers, an impact modifier comprising a modified olefin-based copolymer, and olefin wax containing a reactive group comprising at least one of a carboxylic acid group, a carboxylic acid anhydride group, an epoxy group, and a glycidyl group, wherein the inorganic fillers comprise flake-type fillers and needle-like fillers. The polycarbonate resin composition has excellent properties in terms of appearance, mechanical properties, and dimensional stability.

The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer. The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.

The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer. The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.

Provided is an adhesive composition comprising a continuous aqueous medium and further comprising (i) particles of a polymer dispersed in said aqueous medium; and (ii) particles comprising fatty amide and one or more fatty acid, wherein 50 mole % or more of said fatty acid is in the carboxylate form, and wherein the weight ratio of said fatty amide to said fatty acid is from 0.12:1 to 2.3:1, wherein said particles comprising fatty amide and one or more fatty acid are dispersed in said aqueous medium. Also provided is a method of bonding substrates using such an adhesive composition and a bonded structure made by such a method.

A thermally conductive resin filler including a sintered body containing at least magnesium oxide, calcium oxide, and silicon oxide, the thermally conductive filler being characterized in that, when the molar number of calcium element contained in the total composition of the sintered body in terms of calcium oxide (CaO) is defined as MCa, and the molar number of silicon element contained in the total composition of the sintered body in terms of silicon oxide (SiO.sub.2) is defined as MSi, the molar ratio of the calcium oxide (CaO) to the silicon oxide (SiO.sub.2) represented by MCa/MSi is in the range of 0.1 or more and less than 2.0.

A thermally conductive resin filler including a sintered body containing at least magnesium oxide, calcium oxide, and silicon oxide, the thermally conductive filler being characterized in that, when the molar number of calcium element contained in the total composition of the sintered body in terms of calcium oxide (CaO) is defined as MCa, and the molar number of silicon element contained in the total composition of the sintered body in terms of silicon oxide (SiO.sub.2) is defined as MSi, the molar ratio of the calcium oxide (CaO) to the silicon oxide (SiO.sub.2) represented by MCa/MSi is in the range of 0.1 or more and less than 2.0.