A polymer blend including a vinylidene chloride interpolymer; an ethylene-acrylate interpolymer; and optionally one or more additives selected from the group consisting of stabilizers, plasticizers, and processing aids is provided. Also provided is an extruded film and a packaging or container which includes the film.

A polymer blend including a vinylidene chloride interpolymer; an ethylene-acrylate interpolymer; and optionally one or more additives selected from the group consisting of stabilizers, plasticizers, and processing aids is provided. Also provided is an extruded film and a packaging or container which includes the film.

The purpose of the present invention is to provide a resin composition for forming a hydrophilic coating film with which it is possible to form a hydrophilic coating film imparted with exceptional durability and suitable moisture sorption, wettability, and slip properties without selecting the type of substrate. A resin composition formed by dissolving or dispersing a modified polyalkylene oxide and a polyolefin resin in a hydrophilic organic solvent, and a hydrophilic coating film and hydrophilic-surfaced substrate obtained by drying this resin composition on a substrate.

The purpose of the present invention is to provide a resin composition for forming a hydrophilic coating film with which it is possible to form a hydrophilic coating film imparted with exceptional durability and suitable moisture sorption, wettability, and slip properties without selecting the type of substrate. A resin composition formed by dissolving or dispersing a modified polyalkylene oxide and a polyolefin resin in a hydrophilic organic solvent, and a hydrophilic coating film and hydrophilic-surfaced substrate obtained by drying this resin composition on a substrate.

The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m.sup.3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m.sup.3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Halogen-free, flame resistant and hydrolysis resistant polymer compositions are disclosed. The polymer composition contains a thermoplastic polymer, such as polybutylene terephthalate. The thermoplastic polymer is combined with a flame retardant that can include a phosphinate, a phosphite, and a nitrogen-containing synergist. In addition, the composition can contain various hydrolysis resistant components. For instance, the polyester polymer incorporated into the composition can have a relatively low amount of carboxyl end groups. In addition, the composition can contain reinforcing fibers that are coated with a hydrolysis resistant agent. The composition can also contain an organometallic compatibilizer.

Halogen-free, flame resistant and hydrolysis resistant polymer compositions are disclosed. The polymer composition contains a thermoplastic polymer, such as polybutylene terephthalate. The thermoplastic polymer is combined with a flame retardant that can include a phosphinate, a phosphite, and a nitrogen-containing synergist. In addition, the composition can contain various hydrolysis resistant components. For instance, the polyester polymer incorporated into the composition can have a relatively low amount of carboxyl end groups. In addition, the composition can contain reinforcing fibers that are coated with a hydrolysis resistant agent. The composition can also contain an organometallic compatibilizer.

The invention relates to the use of at least one copolymer of at least one olefin, preferably an alpha-olefin, and at least one acrylic ester of an aliphatic alcohol, wherein the Melt Flow Index of the copolymer is not less than 100 g/10 min, for production of polybutylene terephthalate-based automotive interior parts having a low tetrahydrofuran content by injection molding.

The present disclosure describes a treated cellulosic material comprising a cellulosic material having a porous structure defining a plurality of pores, at least a portion of the pores containing a treating agent comprising a polymer comprising an olefin-carboxylic acid copolymer; and a modifying agent comprising an epoxy.