Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

A conductive heating composition includes a polyolefin elastomer, a crystalline non-grafted polyolefin, a crystalline polymer which is grafted or copolymerized with a monomeric unit, and a conductive filler. The composition has a surface resistivity ranging from 1.0E+01 ohm to 1.0E+06 ohm, and a volume resistivity ranging from 8.0E+01 ohm-cm to less than 1.0E+05 ohm-cm. When the composition is heated from 20 C. to 90 C., a log value of a resistance of the composition increases with a slope ranging from 3E02 log ohm/ C. to 9E02 log ohm/ C. After a specimen made of the composition is repeatedly bent 300 times, a surface resistance of the specimen at a room temperature increases by a rate of less than 300%.

A degradable EVOH high-barrier composite film, characterized in that the materials of various layers in the composite film all obtain approximately-consistent biodegradability by introducing biomass, and the additive amount of the additive master batch in the materials of each layer is controlled within the range of 0.3-15% of the total mass of the materials of the corresponding layer; the hydrophilic activity of the hydrophilic groups in the additive master batch should be greater than or equal to that of the hydrophilic groups in the materials of each layer; by adding the additive master batch, the mole ratios of the hydrophilic groups to carbon atoms of the materials of various layers tend to be consistent, namely, the bioactivities tend to be consistent, so that the degradation rates of the materials of various layers in the composite film tend to be consistent. The present invention makes contribution to obtaining approximately-consistent bioactivities and approximately-consistent biodegradation rates by balancing the mole ratios of the hydrophilic groups to carbon atoms in the materials of various layers, and the appearance, the functions and the physical and mechanical properties of a product remain unchanged.

A film for use in an absorbent article is provided. The film is formed from a polymer composition that contains an ethylene polymer and a nanofiller. The present inventors have discovered that through selective control over the particular type and concentration of these components, as well as the manner in which it is formed, the resulting film may generate a relatively low degree of noise when physically deformed.

A film for use in an absorbent article is provided. The film is formed from a polymer composition that contains an ethylene polymer and a nanofiller. The present inventors have discovered that through selective control over the particular type and concentration of these components, as well as the manner in which it is formed, the resulting film may generate a relatively low degree of noise when physically deformed.

Disclosed herein are high performance semi-aromatic polyamide compounds having improved performance indicators for various applications, including alkaline battery end cap seal assembly applications. In one preferred embodiment, the disclosure relates to compounds comprising a semi-aromatic polyamide component comprising recurring terephthalamide and/or isophthalamide units, an impact modifier component comprising a modified polyolefin elastomer, one or more synergistic blends of sterically hindered phenolic stabilizers and phosphonates and one or more relatively high molecular weight organic phosphite stabilizers, and a fine talc nucleating agent.

Disclosed herein are high performance semi-aromatic polyamide compounds having improved performance indicators for various applications, including alkaline battery end cap seal assembly applications. In one preferred embodiment, the disclosure relates to compounds comprising a semi-aromatic polyamide component comprising recurring terephthalamide and/or isophthalamide units, an impact modifier component comprising a modified polyolefin elastomer, one or more synergistic blends of sterically hindered phenolic stabilizers and phosphonates and one or more relatively high molecular weight organic phosphite stabilizers, and a fine talc nucleating agent.

The present invention is directed to a polyolefin composition which has flame retardant and/or fire resistant properties and is suitable as flame retardant and/or fire resistant layer of a wire or cable. The polyolefin composition of the present invention comprises an polyolefin homo- or copolymer, ground magnesium hydroxide having particle size distribution D.sub.50 of 1.5 to 5.0 m in an amount of 30 to 65 wt % based on the weight of the polyolefin composition, and a silicone fluid or gum in an amount of 0.1 to 20 wt % based on the weight of the polyolefin composition. The present invention is further directed to a wire or cable comprising one or more layers, wherein at least one layer thereof is obtained from the polyolefin composition of the present invention. Finally, the present invention is further directed to the use of a polyolefin composition of the present invention as a flame retardant layer of a wire or cable.

The present invention relates to polyamide molding compounds that are characterized by high notch impact resistance and high gloss. These polyamide molding compounds comprise the following components or consist of these components: (A) 84.5 to 97.0 wt % of at least one amorphous or microcrystalline copolyamide selected from the group comprising PA 6I/6T/MACMI/MACMT/PACMI/PACMT/Y, PA 6I/6T/MACMI/MACMT/Y, and mixtures thereof; (B) 3.0 to 9.5 wt % of at least one specific functionalized impact resistance modifier; and (C) 0 to 6 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100 wt %. The present invention furthermore relates to molded bodies composed of this polyamide molding compound.

The present invention relates to polyamide molding compounds that are characterized by high notch impact resistance and high gloss. These polyamide molding compounds comprise the following components or consist of these components: (A) 84.5 to 97.0 wt % of at least one amorphous or microcrystalline copolyamide selected from the group comprising PA 6I/6T/MACMI/MACMT/PACMI/PACMT/Y, PA 6I/6T/MACMI/MACMT/Y, and mixtures thereof; (B) 3.0 to 9.5 wt % of at least one specific functionalized impact resistance modifier; and (C) 0 to 6 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100 wt %. The present invention furthermore relates to molded bodies composed of this polyamide molding compound.