The present invention relates to an aqueous composition comprising at least one partially fluorinated copolymer in the form of particle powder, to a method for its preparation and to its use as a coating.

A heat-shrinkable film comprises a blend of 35-75 wt % of an ethylene-based polymer, 10-45 wt % of an ethylene/unsaturated ester copolymer, and 5-30 wt % of a plastomer, with the blend making up at least 20 wt % of the film. The ethylene-based polymer has a peak melt point 95 C. The plastomer has a peak melt point 90 C. and a melt index of 1.1 g/10 min. The film comprises a cross-linked polymer network which has been strained by solid state orientation. The film has a total free shrink at 85 C. of at least 90% and an energy-to-break of at least 0.70 J/mil.

A heat-shrinkable film comprises a blend of 35-75 wt % of an ethylene-based polymer, 10-45 wt % of an ethylene/unsaturated ester copolymer, and 5-30 wt % of a plastomer, with the blend making up at least 20 wt % of the film. The ethylene-based polymer has a peak melt point 95 C. The plastomer has a peak melt point 90 C. and a melt index of 1.1 g/10 min. The film comprises a cross-linked polymer network which has been strained by solid state orientation. The film has a total free shrink at 85 C. of at least 90% and an energy-to-break of at least 0.70 J/mil.

A method for producing a cross-linked body is disclosed which includes providing a thermoplastic fluororesin composition and cross-linking the thermoplastic fluororesin composition by an ionizing radiation. The thermoplastic fluororesin composition includes a thermoplastic fluororesin (A) having a Shore D hardness of less than or equal to 50 measured at 23 C. in accordance with ASTM D2240, and a cross-linked structure forming agent (B) that is selected from a polyfunctional unsaturated compound (b-1), a polyamine compound (b-2), and a polyhydroxy compound (b-3) and that is capable of forming a cross-linked structure through a reaction with the thermoplastic fluororesin (A), the thermoplastic fluororesin composition not substantially containing a peroxide compound when containing the polyfunctional unsaturated compound (b-1), not substantially containing an acid acceptor when containing the polyamine compound (b-2), and not substantially containing at least one of the acid acceptor and an onium compound when containing the polyhydroxy compound (b-3).

A polyolefin composition is foamed by a process in which a nucleator is used, and the nucleator comprises 80% or more of unagglomerated fluororesin particles and/or agglomerates of fluororesin particles in which both the unagglomerated particles and the agglomerates are less than 1 m in size.

A polyolefin composition is foamed by a process in which a nucleator is used, and the nucleator comprises 80% or more of unagglomerated fluororesin particles and/or agglomerates of fluororesin particles in which both the unagglomerated particles and the agglomerates are less than 1 m in size.

A cable article made from or containing a polyolefin composition made from or containing: (i) from 20.0 wt % to 80.0 wt % of component T1) being an interpolymer of ethylene and less than 7 wt %, of a polymerizable comonomer; (ii) from 0.5 wt % to 5.0 wt % of a peroxide; and (iii) from 20.0 wt % to 80.0 wt % of component T2). Component T2) is made from or contains: A) 5-35% by weight of a propylene homopolymer or a propylene ethylene copolymer; B) 20-50% by weight of a copolymer of ethylene and a C.sub.3-C.sub.8 alpha-olefin containing from 0.1% to 20% by weight of alpha-olefin units; and C) 30-60% by weight of a copolymer of ethylene and propylene containing from 25% to 75% by weight of ethylene units. The cable article is selected from the group consisting of cable insulation and cable jacketing.

A moisture-curable semiconductive formulation consisting essentially of a mixture of an ethylene/(alkenyl-functional hydrolyzable silane)/(optional olefinic hydrocarbon) copolymer and a conventional carbon black. Also discovered methods of making and using same, a moisture-cured semiconductive product made therefrom, and articles containing or made from same.

A moisture-curable semiconductive formulation consisting essentially of a mixture of an ethylene/(alkenyl-functional hydrolyzable silane)/(optional olefinic hydrocarbon) copolymer and a conventional carbon black. Also discovered methods of making and using same, a moisture-cured semiconductive product made therefrom, and articles containing or made from same.

Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene--olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.