A peroxide-curable ethylene copolymer composition comprising (A) a crosslinkable ethylene/alpha-olefin copolymer, (B) an effective amount of triallyl phosphate (TAP), (C) an organic peroxide, and, optionally, (D) a supplemental polymer; wherein the (A) crosslinkable ethylene/alpha-olefin copolymer is made by copolymerizing ethylene and an olefin-functional comonomer in the presence of a molecular catalyst useful therefor. Also provided are a cured product made from the composition, methods of making and using same, and articles containing same.

The present invention deals with a process for producing a coated pipe. The process comprises (i) homopolymerising ethylene or copolymerising ethylene and an -olefin comonomer in a first polymerisation step in the presence of a polymerisation catalyst to produce a first ethylene homo- or copolymer having a density of from 940 to 980 kg/m.sup.3 and a melt flow rate MFR.sub.2 of from 1 to 2000 g/10 min; (ii) homopolymerising ethylene or copolymerising ethylene and an -olefin comonomer in a second polymerisation step in the presence of a first ethylene homo- or copolymer to produce a first ethylene polymer mixture comprising the first ethylene homo- or copolymer and a second ethylene homo- or copolymer, said first ethylene polymer mixture having a density of from 940 to 980 kg/m.sup.3 and a melt flow rate MFR.sub.2 of from 10 to 2000 g/10 min; (iii) copolymerising ethylene and an -olefin comonomer in a third polymerisation step in the presence of the first ethylene polymer mixture to produce a second ethylene polymer mixture comprising the first ethylene polymer mixture and a third ethylene copolymer, said second ethylene polymer mixture having a density of from 915 to 965 kg/m.sup.3, preferably from 930 to 955 kg/m.sup.3 and a melt flow rate MFR.sub.5 of from 0.2 to 10 g/10 min; (iv) providing a pipe having an outer surface layer; (v) applying a coating composition onto the pipe outer surface layer to form a top coat layer, wherein the coating composition comprises the second ethylene polymer mixture.

The present invention deals with a process for producing a coated pipe. The process comprises (i) homopolymerising ethylene or copolymerising ethylene and an -olefin comonomer in a first polymerisation step in the presence of a polymerisation catalyst to produce a first ethylene homo- or copolymer having a density of from 940 to 980 kg/m.sup.3 and a melt flow rate MFR.sub.2 of from 1 to 2000 g/10 min; (ii) homopolymerising ethylene or copolymerising ethylene and an -olefin comonomer in a second polymerisation step in the presence of a first ethylene homo- or copolymer to produce a first ethylene polymer mixture comprising the first ethylene homo- or copolymer and a second ethylene homo- or copolymer, said first ethylene polymer mixture having a density of from 940 to 980 kg/m.sup.3 and a melt flow rate MFR.sub.2 of from 10 to 2000 g/10 min; (iii) copolymerising ethylene and an -olefin comonomer in a third polymerisation step in the presence of the first ethylene polymer mixture to produce a second ethylene polymer mixture comprising the first ethylene polymer mixture and a third ethylene copolymer, said second ethylene polymer mixture having a density of from 915 to 965 kg/m.sup.3, preferably from 930 to 955 kg/m.sup.3 and a melt flow rate MFR.sub.5 of from 0.2 to 10 g/10 min; (iv) providing a pipe having an outer surface layer; (v) applying a coating composition onto the pipe outer surface layer to form a top coat layer, wherein the coating composition comprises the second ethylene polymer mixture.

The invention relates to a sealant antifog composition for polyester films comprising anionic and non-ionic surfactants in a mixture of amorphous and (semi)crystalline polyesters. The invention also relates to a multi-layer film comprising a sealant layer having the above composition, to the use of said films in food packaging and to the packages obtained therefrom.

A polymeric composition includes a resin including an ethylene-based polymer and a copolymer of ethylene and an alpha olefin comonomer. The resin has a High Mw Comonomer Content of 3.2 wt % or greater based on a total weight of the resin over the weight average molecular weight range of 10.sup.5 g/mol to 10.sup.5.5 g/mol as measured by Ethylene GPC. The polymeric composition has a Relevant Comonomer Content of 0.6 wt % or greater. The polymeric composition also includes at least one of (i) a polydimethylsiloxane having a weight average molecular weight of 550,000 g/mol to 650,000 g/mol as measured according to Component GPC and (ii) a polymeric ultraviolet light stabilizer comprising a hindered amine moiety and having a weight average molecular weight from 5,000 g/mol to 20,000 g/mol as measured according to Component GPC.

The present disclosure provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

The present disclosure provides an encapsulating composition, a composition, an encapsulating glue film, an electronic component and a solar cell assembly. The encapsulating composition comprises polyolefin resin, polyethylene glycol dimethacrylate and organic peroxide, and the structural formula of the polyethylene glycol dimethacrylate is represented by a formula (I). When the polyolefin resin is heated and melted, the ethylene glycol dimethacrylate is delaminated and aggregated in the polyolefin resin. A polymer network structure that has a three-dimensional network structure and that has several ester groups and ether bonds is formed in situ in a polyolefin resin matrix, and the polymer network structure may adsorb residual metal ions in the polyolefin resin, thereby reducing the mobility of the metal ions, so as to improve the dry insulation resistance of the polyolefin resin. In addition, said composition has simple components, readily available raw materials and low costs.

Ethylene copolymer compositions having a density of 0.902 g/cm.sup.3 or less exhibit rapid crystallization behavior. The ethylene copolymer compositions comprise a first ethylene copolymer, a second ethylene copolymer and optionally a third ethylene copolymer, where the number average molecular weight of the first ethylene copolymer is greater than the number average molecular weight of the second ethylene copolymer. The ethylene copolymer compositions are useful in the formation of monolayer and multilayer films.

An antibacterial polymer masterbatch containing a thermoplastic polymer, titanium dioxide and a paraffin or silicone oil and the use thereof in the production of antimicrobial articles made of plastic material, in particular antimicrobial films.

An antibacterial polymer masterbatch containing a thermoplastic polymer, titanium dioxide and a paraffin or silicone oil and the use thereof in the production of antimicrobial articles made of plastic material, in particular antimicrobial films.