The invention relates to an adhesive tape carrier made of a film, onto at least one side of which film an adhesive material is applied, wherein the film is a monoaxially stretched film made of polypropylene which contains at least 80 percent by weight polypropylene which has been processed in advance at least once, preferably has been extruded at least once, wherein the film has a stretching ratio during stretching in the longitudinal direction of 1:4 to 1:10.

The invention relates to an adhesive tape which can be used in particular in a method for connecting two fiber-reinforced plastic components, comprising a carrier material made of polyethylene, wherein a polyacrylate-based self-adhesive compound is applied to one side of the carrier material, said adhesive compound can be reduced to the following reactant mixture containing monomers having the following composition: A1) acrylic acid ester, and/or methacrylic acid ester of the following formula CH.sub.2CH(R.sup.1)(COOR.sup.2), wherein R.sup.1=H or CH.sub.3 and R.sup.2 is an alkyl chain with 1 to 14 carbon atoms at a proportion of between 65 to 98 wt. %, A2) acrylates and/or methacrylates whose alcohol component contains at least one primary hydroxyl- or carboxyl-group, and/or with acrylate-copolymerizable vinyl compounds containing the at least one primary hydroxyl or carboxyl group at a proportion of between 1 to 20 wt. %, A3) multi-functional isocyanate cross-linker which blocks with thermally reversible protective groups at a proportion of between 1-10 wt. %, A4) and, if the proportions of A1), A2) and A3) do not add up to 100 wt. %, olefinically unsaturated monomers having functional groups, with a proportion of 0 to 15 wt. %.

Materials and methods for mitigating passive intermodulation. A membrane for reducing passive intermodulation includes a first polymeric layer, a second polymeric layer, and a continuous metal layer encapsulated between the first and second polymeric layers. A self-adhesive radio frequency barrier tape includes a waterproof polymeric top layer, a metal-containing layer adhered by an adhesive layer to the polymeric top layer, a pressure sensitive adhesive layer adhered to the metal-containing layer, and a release liner on a bottom surface of the pressure sensitive adhesive layer. A method of mitigating passive intermodulation includes passing a probe over an area of interest, the probe being sensitive to an intermodulation frequency of interest, and identifying a suspected source of passive intermodulation when the amplitude of the probe output exceeds a threshold at the frequency of interest. The method further includes covering the suspected passive intermodulation source with a radio frequency barrier material.

A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 m and 150 m. The masking film also includes a release layer on a side of the adhesion layer opposite the outer adhesion surface.

Provided is a barrier adhesive composition comprises polyisobutylene resin, organically modified nanoclay (e.g. mont-morillonite or bentonite) and sorbent nanoparticles (e.g. CaO which acts as a desiccant and/or getter). In a preferred embodiment, the barrier adhesive composition is disposed on a gas-barrier film to form an adhesive barrier film. The adhesive barrier film can then be used for protection from oxygen and moisture in OLED displays and solid state lightings, solar cells, electrophoretic and electrochromic displays thin film batteries, quantum dot devices, sensors (e.g. touch sensor) and other organic electronic devices. The adhesive barrier film is especially well-suited for applications that require oxygen and moisture protection as well flexibility and good optical transmittance.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.

A patch is provided and described that can be used with the installation of a cured-in-place structural liner in a conduit when the conduit has protrusions into the conduit. The patch is made with similar material to the liner, or felt, and is impregnated with epoxy. The patch may be shaped to more closely match the anticipated curve of the outer surface of the liner. Tools for the installation of the patches, a method of use, and tools for measuring the quality of the installation of the patch before the installation of the structural liner, are also described.

Provided is a double-sided adhesive tape or sheet which is light-weight and has excellent strength and insulating properties even when the thickness of the tape or sheet is small. This double-sided adhesive tape or sheet comprises a laminate including a support and two adhesive agent layers formed on opposite surfaces of the support, wherein the support contains a polypropylene resin, the adhesive agent layers contain an acrylic polymer, the laminate has a total thickness (Ds) of 4-15 m, the value of the ratio Dp/Ds of the thickness (Dp) of the support to the total thickness (Ds) of the laminate is 0.15-0.6, and the laminate has a density of 0.90-1.10 g/cm.sup.3.

A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23 C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.

A fire-spreading prevention and flame-retardant material includes a gel carrier, a first flame retardant, a second flame retardant, a first flame barrier, a second flame barrier and an adhesive. The first flame retardant uses a collosol way to be distributed in the gel carrier. The second flame retardant uses the collosol way to be distributed in the gel carrier. The first flame barrier uses the collosol way to be distributed in the gel carrier. The second flame barrier uses the collosol way to be distributed in the gel carrier. The adhesive is dissolved in the gel carrier to improve a property of the gel carrier.