A surface protection film includes an adhesion layer that includes a blend of a first hydrogenated styrene block copolymer, a second hydrogenated styrene block copolymer different from the first hydrogenated styrene block copolymer, and polyethylene. An Adhesion Build Value of the surface protection film is less than 2.5 after the adhesion layer has been attached to a textured polycarbonate substrate and heated to 90 C. for 10 minutes.

Aromatic complexes featuring metal-aryl bonds, active in propylene and other alpha olefin polymerizations are described herein. They are prepared by a single step reaction of readily available ligands Ar.sub.x-L-E with MXy, wherein: Ar=Aryl sigma bonded to L, L=Heteroaromatic or heteroaliphatic ring, with one or more heteroatoms, including fused derivatives, E=Heteroatom on L, available for coordination with the metal. M=Transition metal from groups 3-6, 8, and the lanthanide series of the periodic table of elements. X=Halogenide, y=integer. The ligands react with the TiCl.sub.4 present on MgCl.sub.2 supported polypropylene catalysts and impart substantial activity and other enhancements. They may be used as ethylene or propylene polymerization and copolymerization with higher alpha-olefins, activated with aluminum alkyls such as triethylaluminum.

The present application relates to an encapsulant for a PV module, a method of manufacturing the same, and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep properties, exhibits a haze with a certain level or less and excellent optical properties such as transparency or the like, when the encapsulant is applied to a PV module, physical properties such as durability, transparency, or the like are improved, and thus excellent generating efficiency of the PV module may be obtained.

The present application relates to an encapsulant for a PV module, a method of manufacturing the same, and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep properties, exhibits a haze with a certain level or less and excellent optical properties such as transparency or the like, when the encapsulant is applied to a PV module, physical properties such as durability, transparency, or the like are improved, and thus excellent generating efficiency of the PV module may be obtained.

A hot melt adhesive that is composed of a metallocene catalyzed polyethylene polymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a solid plasticizer. The preferred polyethylene polymer is an ethylene-octene copolymer, and the preferred styrenic block copolymer is a styrene-ethylene-butylene-styrene having less than 30% styrene content. The preferred solid plasticizer is either glycerol tribenzoate or 1,4-cyclohexane dimethanol dibenzoate.

A hot melt adhesive that is composed of a metallocene catalyzed polyethylene polymer, a hydrogenated styrenic block copolymer, a tackifying resin, and a solid plasticizer. The preferred polyethylene polymer is an ethylene-octene copolymer, and the preferred styrenic block copolymer is a styrene-ethylene-butylene-styrene having less than 30% styrene content. The preferred solid plasticizer is either glycerol tribenzoate or 1,4-cyclohexane dimethanol dibenzoate.

This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190 C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190 C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.

This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190 C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190 C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.

A process for increasing MFR.sub.2 of a polyethylene copolymer or an ethylene plastomer or elastomer comprising: (I) extruding a copolymer of polyethylene copolymer having a density of 910 to 970 kg/m.sup.3 and an MFR.sub.2 of 1 and 100 g/10 min or an ethylene plastomer or elastomer having a density of 855 to 910 kg/m.sup.3 and an MFR.sub.2 of 0.5 and 100 g/10 min in the presence of 0.1 to 2 wt % of a non-peroxide radical initiator so as to produce a polyethylene copolymer having an MFR.sub.2 of 200 g/10 min or more, or an ethylene plastomer or elastomer having a MFR.sub.2 of 200 g/10 min or more.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.