Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member.

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer having a density of 0.850 g/cc to 0.890 g/cc; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising triallyl phosphate.

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70 C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70 C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

Disclosed is a hot melt adhesive comprising: (A) a metallocene based propylene homopolymer, (B) a metallocene based ethylene/-olefin copolymer, (C) a tackifier resin, and (D) a plasticizer, wherein the plasticizer (D) comprises (D1) an oil and (D2) at least one polymer selected from polybutene, polybutadiene, polyisobutylene, and polyisoprene. This hot melt adhesive has an initial adhesive strength enough to enable a pressure sensitive adhesion body to stick easily on a member, thus making it possible to firmly hold the pressure sensitive adhesion body on the member. The hot melt adhesive is also excellent in releasability, thus causing no adhesive residue on the member when the pressure sensitive adhesion body is peeled from the member.

The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107 C., while maintaining excellent bonding under stress and a very fast setting time.

A new hot-melt adhesive formulations having improved processability and that are easily processable even with processes at high speed and in particular with Spraying or Fiberization processes. Said hot-melt adhesive formulations comprise, as their main polymer component, at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a substantially bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps, where the first polymer (polymer A) of said compositionally bimodal polymer composition is an isotactic butene-1 homopolymer or an isotactic butene-1 copolymer with another olefin, while the second polymer (polymer B) is an isotactic copolymer of butene-1, with another olefin, with a chemical composition obviously different from A, qualitatively and/or quantitatively; said hot-melts further comprising a viscosity modifier that is not solid at room temperature.

The invention relates to a sealant antifog composition for polyester films comprising anionic and non-ionic surfactants in a mixture of amorphous and (semi)crystalline polyesters. The invention also relates to a multi-layer film comprising a sealant layer having the above composition, to the use of said films in food packaging and to the packages obtained therefrom.

A composition comprising the following components: a) a first ethylene/alpha-olefin interpolymer that comprises the following properties: i) a melt viscosity (177? C.) from 2,000 to 50,000 mPa.Math.s, ii) a density from 0.855 to 0.885 g/cc; b) a second ethylene/alpha-olefin interpolymer that comprises the following properties: i) a melt viscosity (177? C.) from 2,000 to 50,000 mPa.Math.s, ii) a density from 0.900 to 0.960 g/cc; and wherein the weight ratio of component a to component b is from 1.0 to 100.

A composition comprising the following components: a) a first ethylene/alpha-olefin interpolymer that comprises the following properties: i) a melt viscosity (177? C.) from 2,000 to 50,000 mPa.Math.s, ii) a density from 0.855 to 0.885 g/cc; b) a second ethylene/alpha-olefin interpolymer that comprises the following properties: i) a melt viscosity (177? C.) from 2,000 to 50,000 mPa.Math.s, ii) a density from 0.900 to 0.960 g/cc; and wherein the weight ratio of component a to component b is from 1.0 to 100.