Presently described are bio-based hot-melt adhesive compositions including rosin acids or derivatives thereof and an amphiphilic agent that provide adhesives with a high softening point, improved heat resistance, low melt viscosity, and compatibility with hydrocarbon compositions including polyolefins and waxes used in hot-melt adhesives.

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene-α-olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene-α-olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene-α-olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene-α-olefin copolymer is not higher than 0.91 g/cm.sup.3. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.

This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190° C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190° C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.

This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190° C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190° C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

A hot melt adhesive composition contains a 1-butene homopolymer, an ethylene-based polymer having a melting point of lower than 80° C., an α-olefin copolymer having a melting point 80° C. or higher, a tackifying resin, wax, and a liquid softener, in which the ethylene-based polymer includes at least one type of copolymer selected from the group consisting of an ethylene-α-olefin copolymer and an ethylene-vinyl acetate copolymer.

This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.

The present invention is related to adhesive compositions and their applications. In particular, the adhesive compositions described herein comprise a propylene-based polymer and an ethylene-based polymer with varying comonomer content.

The present invention is related to adhesive compositions and their applications. In particular, the adhesive compositions described herein comprise a propylene-based polymer and an ethylene-based polymer with varying comonomer content.