A dielectric welding film for welding a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including at least one resin selected from the group consisting of an olefin-vinyl acetate copolymer and a maleic anhydride-modified polyolefin, the olefin-vinyl acetate copolymer containing 2 mass % or more constituent unit derived from vinyl acetate.

Unique 3-PPB monobenzoate analogs useful as plasticizers in polymeric dispersions, such as plastisols, melt compounds, and adhesives among other applications. The analogs are structurally similar to and/or derived from 3-phenylpropyl benzoate and heretofore were not known for use in industrial applications, particularly not as a plasticizer in polymeric applications. Depending on the application, the advantages rendered by the use of the inventive monobenzoate analogs include, among other things, excellent solvating properties and rheology, low viscosity and significantly improved viscosity over time, comparable or improved Tg suppression, set and open times, as well as health, safety and environmental advantages, over traditional plasticizers.

An adhesive composition comprising includes (i) a copolymer of an unsaturated hydrocarbon and an acrylate ester or acid, or of an unsaturated hydrocarbon and a vinyl saturated aliphatic ester or mixtures thereof, and (ii) a polyether carbonate polyol wherein the weight proportion of CO.sub.2 ranges from 0.5 to 37 wt % with respect to the total weight of the polyether carbonate polyol. The compositions of the invention may be used in PSA or HotMelt adhesive formulations.

An adhesive composition comprising includes (i) a copolymer of an unsaturated hydrocarbon and an acrylate ester or acid, or of an unsaturated hydrocarbon and a vinyl saturated aliphatic ester or mixtures thereof, and (ii) a polyether carbonate polyol wherein the weight proportion of CO.sub.2 ranges from 0.5 to 37 wt % with respect to the total weight of the polyether carbonate polyol. The compositions of the invention may be used in PSA or HotMelt adhesive formulations.

The invention relates to a curable volume expandable polymer composition comprising an organic acid component, wherein the organic acid component comprises a first organic acid, a second organic acid, and optionally one or more additional organic acids; wherein said polymer composition, when being heated to an activation of expansion temperature above room temperature, undergoes volume expansion. When the organic acid component is heated to the activation of expansion temperature, the first organic acid and/or the second organic acid and/or the optionally present one or more additional organic acids decarboxylate and thus release carbon dioxide. The polymer composition traps the thus released carbon dioxide thereby causing the polymer composition to undergo volume expansion.

A breathable, polyolefinic, filled, stretched film. The film has a water vapor transmission rate of at least 500 g/m.sup.2 in 24 h according to ASTM D6701-01. The water column of the film is more than 300 mm according to EDANA WSP 80.6. The film has an imprint which is bonded to the film via an adhesive. The film has at least one layer in which the adhesive is integrated.

The invention relates to a curable pressure-sensitive adhesive, comprising, based on the total mass of the curable pressure-sensitive adhesive: a) one or more film-forming (co)polymers in a combined mass fraction in the range from 20% to 60%, b) one or more polymerizable epoxide compounds in a combined mass fraction in the range from 20% to 60%, the epoxide compounds being selected from the group consisting of monomeric and oligomeric epoxide compounds, c) one or more cationic photoinitiators in a combined mass fraction in the range from 0.5% to 7%, and d) one or more epoxy-modified nitrile rubbers in a combined mass fraction in the range from 3% to 30%.

The invention relates to a curable pressure-sensitive adhesive, comprising, based on the total mass of the curable pressure-sensitive adhesive: a) one or more film-forming (co)polymers in a combined mass fraction in the range from 20% to 60%, b) one or more polymerizable epoxide compounds in a combined mass fraction in the range from 20% to 60%, the epoxide compounds being selected from the group consisting of monomeric and oligomeric epoxide compounds, c) one or more cationic photoinitiators in a combined mass fraction in the range from 0.5% to 7%, and d) one or more epoxy-modified nitrile rubbers in a combined mass fraction in the range from 3% to 30%.

The invention relates to a curable volume expandable polymer composition comprising an organic acid component, wherein the organic acid component comprises a first organic acid, a second organic acid, and optionally one or more additional organic acids; wherein said polymer composition, when being heated to an activation of expansion temperature above room temperature, undergoes volume expansion. When the organic acid component is heated to the activation of expansion temperature, the first organic acid and/or the second organic acid and/or the optionally present one or more additional organic acids decarboxylate and thus release carbon dioxide. The polymer composition traps the thus released carbon dioxide thereby causing the polymer composition to undergo volume expansion.

The invention relates to a method for producing a hydrocarbon resin, in which method a monomer mixture which contains an aromatic component containing indene and/or C.sub.1-4 alkylindene and a cyclic diolefin component containing a cyclic diolefin compound is polymerized by heating to a polymerization temperature of at least 180? C. to obtain a product stream containing hydrocarbon resin, wherein oligomers which contain units originating from the cyclic diolefin compound and/or units originating from the aromatic component are separated from the product stream and returned to the monomer mixture, and wherein the hydrocarbon resin is heated in an annealing step to a temperature of 150? C. to 300? C. for a period of 15 minutes to 240 hours. The invention also relates to a hydrocarbon resin that is obtainable by the method, to a hydrogenated hydrocarbon resin, and to the use of the hydrocarbon resin and the hydrogenated hydrocarbon resin.