C09J123/0853

Floor covering with universal backing and methods of making and recycling

A dimensionally stable universal floor covering includes a tufted textile having stitches and a reinforcement layer of fibers and adhesive providing dimensional stability for the entire floor covering. The fibers and adhesive are mixed and then moved by an applicator towards the stitches. A slip path is formed to improve the movement of the fibers and adhesive. A releasable adhesive or gecko-like cover system is provided which also provides additional strength and stability and a releasable attachment of the universal floor covering to a supporting surface.

Adhesive compostions with wide service temperature window and use thereof

The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.

Adhesive compostions with wide service temperature window and use thereof

The invention provides a hot melt adhesive comprising a polymer mixture of an ethylene vinyl acetate polymer with low vinyl acetate content and a functionalized metallocene catalyzed polyethylene copolymer. The hot melt adhesive has wide service temperature ranges for bonding cellulosic substrates together. The adhesive is well suited for case, tray, carton and bag sealing applications.

DIELECTRIC HEATING ADHESIVE FILM AND ADHESION METHOD USING DIELECTRIC HEATING ADHESIVE FILM
20190352546 · 2019-11-21 ·

A dielectric welding configured to weld a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including a polyolefin resin having a polar part, a content of the B component in the dielectric welding film ranging from 3 volume % to 40 volume %.

DIELECTRIC HEATING ADHESIVE FILM AND ADHESION METHOD USING DIELECTRIC HEATING ADHESIVE FILM
20190352546 · 2019-11-21 ·

A dielectric welding configured to weld a plurality of adherends of the same material or different materials through dielectric heating is provided. The dielectric welding film contains an A component in a form of a thermoplastic resin and a B component in a form of a dielectric filler, the A component including a polyolefin resin having a polar part, a content of the B component in the dielectric welding film ranging from 3 volume % to 40 volume %.

AN AQUEOUS POLYMER DISPERSION
20240109990 · 2024-04-04 · ·

Aqueous dispersions and uses for the same. The aqueous dispersion includes a component (a) of one or more ethylene-vinyl ester copolymers and a component (b) of one or more protective colloids. The aqueous dispersion may optionally a component (c1) of one or more nonionic surfactants and/or a component (c2) of one or more ionic surfactants. Where a total amount of the component (b) is less than or equal to 2.2 pphm, preferably between 1-2.2 pphm, or more preferably 1.8 pphm. Additionally, where a total amount of the component (c1) and the component (c2) is less than 0.1 pphm, preferably less than or equal to 0.01 pphm.

Primer for solar cell module and solar cell module

Provided is a primer for a solar cell module which makes it possible to prevent peeling of a surface protective material from a sealing material over a long time, and a solar cell module manufactured using this primer. The primer includes 40 to 95 parts by mass of a polymerizable ester, 5 to 60 parts by mass of an adhesion promoter, and a polymerization initiator. The polymerizable ester includes at least one of an acryloyl group and a methacryloyl group. The adhesion promoter includes a functional group improvable is adhesion to an acrylic resin or a methacrylic resin, and an alkoxysilyl group. The polymerization initiator is configured to be able to initiate polymerization of the polymerizable ester. The content of the polymerization initiator is 0.1 to 10 parts by mass based on 100 parts by mass as a total of the polymerizable ester and the adhesion promoter.

Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

Low VOC adhesive composition

Disclosed are compositions containing a pigment mixture and a binder. The pigment mixture contains a non-ionic platy filler and at least a second pigment material. The non-ionic platy filler may be present in an amount of 1% by weight to 9% by weight and the at least one second pigment material may be present in an amount of at least 30% by weight based on total weight of the pigment mixture. The at least one second pigment material may have a weighted average oil absorption of 20 g linseed oil absorbed per 100 g at least one second pigment material to 100 g linseed oil absorbed per 100 g at least one second pigment material based on total weight of the pigment mixture. Also disclosed are articles comprising an adhesive comprising one of the compositions in an at least partially dried state positioned between first and second substrates.

Back-off preventing resealable adhesives

Adhesive compositions that replace gaskets and liners in sealing applications for packages that are detachable with hand force are described. The adhesive compositions are particularly useful in preventing leaks and spillage during storage and transport of its packaged contents. Advantageously, the adhesive composition provides packages with (1) a removal torque of from about 4 to about 20 in-lb and (2) resealable torque on subsequent openings of from about 2 to about 15 in-lb, measured in accordance to ASTM D2063.