A hotmelt adhesive composition includes a polymer produced from ethylene, one or more branched vinyl ester monomers, and optionally, vinyl acetate, and a tackifier. A method for producing the hotmelt adhesive composition includes adding a polymer produced from ethylene, one or more branched vinyl ester monomers, and optionally, vinyl acetate and a tackifier into a mixer, optionally adding wax and/or antioxidant into the mixer, and mixing the polymer and the tackifier, and the optional wax and/or antioxidant at a temperature in a range from 150° C. to 200° C. to form the hot melt adhesive composition. A method for bonding a substrate to a similar or dissimilar substrate includes applying the hotmelt adhesive composition to at least one substrate; and bonding the substrate and the hotmelt adhesive composition together. A multi-layer article comprises at least one layer of the hotmelt adhesive compositions and one or more substrate layers.

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

A thermally expandable composition, including at least one polymer, cross-linkable by peroxide, at least one peroxide, preferably at least one antioxidant, at least one chemical blowing agent, and at least one activator, wherein the activator includes at least one compound selected from formula (I), ##STR00001##
wherein radicals R.sup.1 and R.sup.4 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms; R.sup.2 and R.sup.3 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms, nitrogen atoms, and/or aromatic moieties or R.sup.2 and R.sup.3 together form a divalent alkyl radical with 1 to 10 carbon atoms which optionally includes oxygen atoms, nitrogen atoms or aromatic moieties. The composition shows excellent properties in terms of expansion stability over a wide temperature range, can be expanded at temperatures below 150° C. and is suitable for baffle and/or reinforcement elements.

A thermally expandable composition, including at least one polymer, cross-linkable by peroxide, at least one peroxide, preferably at least one antioxidant, at least one chemical blowing agent, and at least one activator, wherein the activator includes at least one compound selected from formula (I), ##STR00001##
wherein radicals R.sup.1 and R.sup.4 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms; R.sup.2 and R.sup.3 represent hydrogen atoms or monovalent alkyl radicals with 1 to 10 carbon atoms which optionally include oxygen atoms, nitrogen atoms, and/or aromatic moieties or R.sup.2 and R.sup.3 together form a divalent alkyl radical with 1 to 10 carbon atoms which optionally includes oxygen atoms, nitrogen atoms or aromatic moieties. The composition shows excellent properties in terms of expansion stability over a wide temperature range, can be expanded at temperatures below 150° C. and is suitable for baffle and/or reinforcement elements.

Radiation shielding glass articles with thin glass faceplates that improve transmission are disclosed. A radiation shielding glass article includes a radiation shielding glass having a first surface and an opposing second surface; and a first thin glass faceplate having a first surface and an opposing second surface, wherein one of said first surface or second surface of said first thin glass faceplate faces the first surface of the radiation shielding glass, wherein the first thin glass faceplate having a thickness of less than or equal to 1.0 mm is bonded to the first surface of the radiation shielding glass, and wherein the first thin glass faceplate is one of an alkaline boro-aluminosilicate glass, or a chemically strengthenable sodium aluminum silicate glass.

One aspect of the present invention is a method for producing an ethylene vinyl acetate hot-melt adhesive, comprising: introducing a liquid including at least one of water and alcohol into a heating kneader while or after kneading a hot-melt adhesive material in a liquid state, at an amount of 0.05 parts by mass or more with respect to 100 parts by mass of the hot-melt adhesive material; and performing vacuuming while heating stirring or dispersing the hot-melt adhesive material and the liquid so as to come into contact with each other.

The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.

The present invention relates to hot melt adhesive compositions comprising ethylene vinyl acetate copolymer(s) and isothiazolinone fungicides according to formula (I). Such hot melt adhesives show improved fungus resistance and are thus particularly suited for applications where such properties are desirable, such as ventilation and air-conditioning systems and air filters. The invention further relates to the use of said hot melt adhesives in such ventilation and air-conditioning systems and air filters as well as for bonding, stabilizing and sealing of pleats, edge and frame bonding, or seam sealing of bag filters. Further encompassed are air filters comprising the hot melt adhesives and methods of their manufacture using the hot melt adhesives of the invention.

An electrically conductive adhesive composition, free of metals and metal salts, includes an adhesive polymer component selected from polyethylene-vinyl acetate, polyolefin elastomers, polyvinyl butyral, poly(acrylic acid), polyacrylates and poly(methyl methacrylate) from 5% to 40% by weight, an electrically conductive component including acetylene or carbon black nanoparticles, carbon nanotubes, and flakes or plates of graphene or graphene derivatives from 60% to 95% by weight, percentages by weight of the adhesive polymer component and electrically conductive component, the electrically conductive component consisting of acetylene or carbon black nanoparticles from 15% to 45% by weight, carbon nanotubes from 5% to 25% by weight, and flakes or plates of graphene or graphene derivatives from 35% to 70% by weight, percentages by weight of the electrically conductive component, and a solvent compatible with the adhesive polymer component from 50% to 90% by weight of the electrically conductive adhesive composition.

An adhesive resin composition contains an ethylene-vinyl acetate copolymer (A) in which a content of a structural unit derived from vinyl acetate is 3% by mass or more and 18% by mass or less, and a melt mass flow rate (MFR, JIS K 7210:1999, 190° C., 2160 g load) is 5 g/10 min or more and 40 g/10 min or less, a tackifier resin (B), and an ethylene-vinyl acetate copolymer (C) having a viscosity of 15,000 mPa.Math.s or more and 300,000 mPa.Math.s or less measured at 18° C. using a Brookfield viscometer.