C09J123/0869

Electronic device, method and apparatus for producing an electronic device, and composition therefor
11240916 · 2022-02-01 · ·

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

Electronic device, method and apparatus for producing an electronic device, and composition therefor
11240916 · 2022-02-01 · ·

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

Sealing film suitable for food packaging and preparation method thereof

A sealing film suitable for food packaging is disclosed, which adopts the following solution. The sealing film comprises, in sequence, a PET layer, a VMPET layer and a PE layer from outside to inside, wherein the PE layer comprises 100-110 parts of PE, 15-20 parts of EVA, 15-20 parts of EAA, 55-60 parts of HDPE and 10-15 parts of LLDPE in parts by mass. In this manner, the addition of HDPE and LLDPE into the PE layer is intended to enhance the tensile strength of the sealing film.

PACKAGING SHEET FOR PACKAGING OF CHEESE, AND ASSOCIATED PACKAGING AND MANUFACTURING METHODS
20210404120 · 2021-12-30 ·

Disclosed is a packaging sheet for packaging of cheese, in particular white moulded soft cheese. The packaging sheet comprises: an inner surface and an outer surface of the packaging sheet, said inner surface being configured for facing the cheese in a packaged use position of the packaging sheet; a paper layer with a first surface and a second surface; a coloured layer provided on a first surface of the paper layer, an outer surface of the coloured layer establishing said outer surface of the packaging sheet; and a polymer layer with a water vapour transmission rate of at least 300 g/m.sup.2/24 hours at 38° C. and 90% atmospheric humidity. The polymer layer being coated on the second surface of the paper layer with a first surface of the polymer layer facing the paper layer and a second surface of the polymer layer establishing said inner surface of the packaging sheet.

Adhesive composition based on ethylene copolymers obtained by tube copolymerisation, that can be used for extrusion-coating and extrusion-lamination

An adhesive composition of at least one ethylene polymer or copolymer, wherein at least one first polymer or copolymer including the unsaturated carboxylic acid ester type comonomer is copolymerized in a continuous high-pressure tubular reactor, while a second polymer or copolymer including the functional comonomer is copolymerized by either autoclave or tubular continuous high-pressure radical means; the first and second polymer or copolymer possibly being of one and the same polymer/copolymer. Also, a multilayer structure that incorporates the adhesive composition and a particular process for obtaining this composition.

Adhesive composition based on ethylene copolymers obtained by tube copolymerisation, that can be used for extrusion-coating and extrusion-lamination

An adhesive composition of at least one ethylene polymer or copolymer, wherein at least one first polymer or copolymer including the unsaturated carboxylic acid ester type comonomer is copolymerized in a continuous high-pressure tubular reactor, while a second polymer or copolymer including the functional comonomer is copolymerized by either autoclave or tubular continuous high-pressure radical means; the first and second polymer or copolymer possibly being of one and the same polymer/copolymer. Also, a multilayer structure that incorporates the adhesive composition and a particular process for obtaining this composition.

RESIN COMPOSITION FOR SEALANT, LAMINATE, PACKAGING MATERIAL, AND PACKAGE

A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane.

A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.

UNIVERSAL THERMOPLASTIC ADHESIVES FOR MULTILAYER FILMS

Embodiments of the present disclosure are directed to a thermoplastic adhesive composition comprising: at least one maleic anhydride-grafted ethylene-based polymer; at least one at least one ethylene/α-olefin/non-conjugated diene interpolymer having a molecular weight distribution (MWD) ≥2.5, wherein MWD=Mw/Mn, wherein Mw is weight averaged molecular weight and Mn is number averaged molecular weight, which are both determined by gel permeation chromatography; a very low density polyethylene (VLDPE) having a density in the range 0.885 to 0.915 grams/cm.sup.3; and optionally at least one ethylene alkyl (meth)acrylate copolymer, wherein the alkyl group comprises one to four carbon atoms.

UNIVERSAL THERMOPLASTIC ADHESIVES FOR MULTILAYER FILMS

Embodiments of the present disclosure are directed to a thermoplastic adhesive composition comprising: at least one maleic anhydride-grafted ethylene-based polymer; at least one at least one ethylene/α-olefin/non-conjugated diene interpolymer having a molecular weight distribution (MWD) ≥2.5, wherein MWD=Mw/Mn, wherein Mw is weight averaged molecular weight and Mn is number averaged molecular weight, which are both determined by gel permeation chromatography; a very low density polyethylene (VLDPE) having a density in the range 0.885 to 0.915 grams/cm.sup.3; and optionally at least one ethylene alkyl (meth)acrylate copolymer, wherein the alkyl group comprises one to four carbon atoms.

HOT MELT COMPOSITION IN THE FORM OF A FILM FOR USE IN THIN FILM PHOTOVOLTAIC MODULES

The invention features a hot melt composition in the form of a film including from 40% by weight to 80% by weight of a non-functionalized alkyl acrylate, from 14% by weight to 50% by weight of an olefin polymer, from 2% by weight to 15% by weight of a first functionalized polymer comprising a functional group selected from the group consisting of epoxides and carboxylic anhydrides, and from 2% by weight to 15% by weight of a second functionalized polymer comprising a functional group capable of reacting with the functional group of the first functionalized polymer.

The hot melt composition in the form of a film has found utility as an encapsulant for thin film photovoltaic modules.