A method for plugging and sealing subsurface formations using alkaline nanosilica dispersion and a delayed activation chemistry is disclosed. In accordance with one embodiment of the present disclosure, the method includes introducing a mixture with a first pH into the subsurface formation. The mixture comprises an aqueous solution, an alkaline nanosilica dispersion and a water-insoluble hydrolyzable compound. The method further includes allowing the water-insoluble hydrolyzable compound to hydrolyze in the subsurface formation to form an acid at 70 C. or greater, thereby acidizing the mixture to a reduced second pH and causing the alkaline nanosilica dispersion to gel into a solid and seal the subsurface formation. A composition for sealing a subsurface formation is also disclosed. The composition includes an aqueous mixture including water, an alkaline nanosilica dispersion, and a water-insoluble hydrolyzable compound.

A method of treating a subterranean formation including providing a sugar based hardenable resin, providing proppant particles, providing a hardening agent, combining the sugar based hardenable resin and the hardening agent to form a resin compound, coating the resin compound onto at least a portion of the proppant particles to create resin-coated proppant particles, and placing the coated proppant particles into a subterranean formation zone, wherein the resin compound does not substantially cure prior to placing the resin coated proppant particles into the subterranean formation zone.

This invention provides a fracturing fluid comprising i) 85 wt.-% or more of an aqueous carrier fluid as continuous phase, ii) 0.001 to 1.5 wt.-% of a first wax inhibitor being dispersed in the carrier fluid, the wax inhibitor being selected from the group consisting of a) copolymers of ethylene and ethylenically unsaturated esters, ethers and/or C.sub.3 to C.sub.30-alkenes, b) homo- or copolymers of ethylenically unsaturated carboxylic acids, bearing C.sub.12-C.sub.50-alkyl radicals bound via ester, amide and/or imide groups, c) ethylene copolymers grafted with ethylenically unsaturated esters and/or ethers, d) homo- and copolymers of C.sub.3 to C.sub.30-olefins, and e) condensation products of alkyl phenols with aldehydes and/or ketones iv) optionally a water soluble polymer for viscosity adjustment,
wherein the amount of water-immiscible hydrocarbons is less than 2.5 wt.-%.

A foamed treatment fluid comprising: an external phase, wherein the external phase comprises: (A) water; (B) a curable resin; and (C) a foaming agent; and an internal phase, wherein the internal phase comprises an inert gas. A method of treating particles of a particle pack located in a subterranean formation comprising: introducing the foam into the subterranean formation; and consolidating the particles of the particle pack after introduction into the subterranean formation.

Systems and methods for treating subterranean formations using deagglomerated inorganic clay particles are provided. In one embodiment, the methods comprise: providing a treatment fluid that comprises a base fluid, a consolidating agent, and a deagglomerated inorganic clay particle; introducing the treatment fluid into at least a portion of a subterranean formation so as to contact unconsolidated particles within the subterranean formation with the treatment fluid; and allowing the consolidating agent and the deagglomerated inorganic clay particle to consolidate at least a portion of the unconsolidated particulates in the portion of the subterranean formation.

Various embodiments disclosed relate to a curable composition and resin for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include placing in a subterranean formation a curable composition. The curable composition can include an epoxy silane monomer, a hardener, and carrier fluid. The curable composition can include an epoxy monomer, an amine silane hardener, and carrier fluid. The method can also include curing the curable composition to form an epoxy silane resin.

A method for plugging and sealing subsurface formations using alkaline nanosilica dispersion and a delayed activation chemistry is disclosed. In accordance with one embodiment of the present disclosure, the method includes introducing a mixture with a first pH into the subsurface formation. The mixture comprises an aqueous solution, an alkaline nanosilica dispersion and a water-insoluble hydrolyzable compound. The method further includes allowing the water-insoluble hydrolyzable compound to hydrolyze in the subsurface formation to form an acid at 70 C. or greater, thereby acidizing the mixture to a reduced second pH and causing the alkaline nanosilica dispersion to gel into a solid and seal the subsurface formation. A composition for sealing a subsurface formation is also disclosed. The composition includes an aqueous mixture including water, an alkaline nanosilica dispersion, and a water-insoluble hydrolyzable compound.

Systems and methods for stabilizing portions of a subterranean formation, including portions of a subterranean formation having unconsolidated particulates, using a consolidating agent comprising polyamino-functionalized nanoparticles are provided. Certain of the methods include the steps of providing a treatment fluid comprising a base liquid and polyamino-functionalized nanoparticles; and introducing the treatment fluid into a portion of a subterranean formation. Treatment fluids comprising polyamino-functionalized nanoparticles include gravel packing fluids, consolidation fluids, and hydraulic fracturing fluids are also provided.

Various embodiments disclosed relate to a curable composition and resin for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include placing in a subterranean formation a curable composition. The curable composition can include an epoxy silane monomer, a hardener, and carrier fluid. The curable composition can include an epoxy monomer, an amine silane hardener, and carrier fluid. The method can also include curing the curable composition to form an epoxy silane resin.

Disclosed is an -glycol containing sulfonated epoxy resin composition and method for preparing said composition. The -glycol containing sulfonated epoxy resin composition is made by forming a reaction product comprising an epoxide-containing compound, a primary amino sulfonate, and optionally one or more of a primary monoamine alkylene oxide oligomer, followed by converting any unreacted epoxide groups in the reaction product to -glycol groups by hydrolysis. Said -glycol containing sulfonated epoxy resin compositions demonstrate good solubility in aqueous solutions and are useful for modifying the permeability of subterranean formations and increasing the mobilization and/or recovery rate of hydrocarbon fluids present in the formations.