An evaporation apparatus including a material source, a chamber, a passageway, and a heating component is provided. The material source is configured to provide a deposition material. The chamber includes a manifold. The passageway is configured to be connected to the material source and the manifold. The heating component is disposed in at least a portion of the passageway and configured to heat the deposition material. A calibration method of the evaporation apparatus is also provided.

An apparatus for manufacturing a display apparatus includes: a chamber; a plurality of source units outside the chamber, wherein the plurality of source units which accommodate a deposition material and transform the deposition material into gas; a nozzle unit in the chamber, wherein the nozzle unit is connected to the plurality of source units and injects, into the chamber, the deposition material supplied from one of the plurality of source units; and a regulating unit between each of the plurality of source units and the nozzle unit, wherein the regulating unit interrupts the deposition material supplied from each of the plurality of source units to the nozzle unit and selectively connects the plurality of source units with the nozzle unit.

A system for monitoring thin film deposition is described. The system includes a quartz crystal and a synthesizer to generate a modulated signal. The modulated signal is to be grounded through the quartz crystal. The system also includes a phase detector to determine a phase of the modulated signal from the quartz crystal in order to monitor thin film deposition. A modulation index can be selected so that, at resonance, high frequency of the signal matches the crystal frequency.

A measuring assembly and method for layer thickness measurement of a layer applied to a substrate by means of a vapor deposition method includes a measuring head which is provided with at least one vibration plate, an extraction line which can be coupled in a gas-conducting or vapor-conducting manner with a first end having a vacuum chamber for the vapor deposition method and which can be coupled in a gas-conducting or vapor-conducting manner with an opposite second end having the measuring head, wherein the extraction line includes at least one heating section or at least one cooling section.

A crystal oscillation probe structure and an evaporation device are provided. The crystal oscillation probe structure includes a guide cover, a crystal oscillation probe and a mesh screen structure, the guide cover includes a chamber with a guide opening, the crystal oscillation probe is fixed in the chamber, the crystal oscillation probe includes at least one crystal oscillation sheet, the mesh screen structure includes a plurality of openings, and the mesh screen structure is located on a traveling path of a material traveling toward the at least one crystal oscillation sheet and disposed on a side of the at least one crystal oscillation sheet facing the guide opening.

An apparatus for manufacturing a display apparatus includes: a chamber; a plurality of source units outside the chamber, wherein the plurality of source units which accommodate a deposition material and transform the deposition material into gas; a nozzle unit in the chamber, wherein the nozzle unit is connected to the plurality of source units and injects, into the chamber, the deposition material supplied from one of the plurality of source units; and a regulating unit between each of the plurality of source units and the nozzle unit, wherein the regulating unit interrupts the deposition material supplied from each of the plurality of source units to the nozzle unit and selectively connects the plurality of source units with the nozzle unit.

Apparatus for depositing one or more variable interference filters onto one or more substrates comprises a vacuum chamber, at least one magnetron sputtering device and at least one movable mount for supporting the one or more substrates within the vacuum chamber. The at least one magnetron sputtering device is configured to sputter material from a sputtering target towards in the mount, thereby defining a sputtering zone within the vacuum chamber. At least one static sputtering mask is located between the sputtering target and the mount. The at least one static sputtering mask is configured such that, when each substrate is moved through the sputtering zone on the at least one movable mount, a layer of material having a non-uniform thickness is deposited on each said substrate.

The disclosure provides an evaporation device and an evaporation method. The evaporation device of the disclosure configures an crystal shutter between an evaporation source and a crystal vibrator, and the crystal shutter is capable of switching between the position that the crystal vibrator is shielded and the position that the crystal vibrator is not shielded; an evaporation material is deposited on the crystal shutter when the crystal shutter is at the position that the crystal vibrator is shielded, thereby avoiding the evaporation material deposited on the crystal vibrator: the evaporation material may be deposited on the crystal vibrator when the crystal shutter is at the position that the crystal vibrator is not shielded.

Examples are disclosed relate to the application of films of transparent conductors over fluorine-doped tin oxide (FTO) to form a multi-layer structure comprising a lower sheet resistance and smoother surface, while exhibiting a higher transparency, than a single thicker FTO with an equivalent thickness. Various compositions of transparent conductor may be deposited using such solutions. Examples include Sn:In.sub.2O.sub.3, Ti:In.sub.2O.sub.3, Cd.sub.2SnO.sub.4, and combinations of two or more such materials. One example provides optical device, comprising a substrate, an FTO film on the substrate, and a film of a transparent conductor on the FTO film.

Apparatus for depositing one or more variable interference filters onto one or more substrates comprises a vacuum chamber, at least one magnetron sputtering device and at least one movable mount for supporting the one or more substrates within the vacuum chamber. The at least one magnetron sputtering device is configured to sputter material from a sputtering target towards in the mount, thereby defining a sputtering zone within the vacuum chamber. At least one static sputtering mask is located between the sputtering target and the mount. The at least one static sputtering mask is configured such that, when each substrate is moved through the sputtering zone on the at least one movable mount, a layer of material having a non-uniform thickness is deposited on each said substrate.