A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.

According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a roll of material includes a substrate. An insulating ink is on the substrate. A catalyst coating is on the substrate whereat the insulating ink is not present. The catalyst coating may be configured to provide the substrate with one or more catalytic surfaces suitable for electroless deposition of metal. Accordingly, metal plating may be electrolessly deposited on the catalyst coating without over-plating the insulating ink.

According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a selectively plated roll of material includes a substrate, an electrically-conductive ink in a pattern along the substrate, and a metal plating on the electrically-conductive ink. The metal plating may be deposited on the electrically-conductive ink without over-plating the substrate whereat the electrically-conductive ink is not present.

The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other, and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

A method for forming a metal wiring according to embodiments includes forming a first insulating layer on a substrate; forming a catalyst adsorption layer by bringing a surface of the first insulating layer into contact with a solution containing a compound having a triazine skeleton, a first functional group of one of a silanol group and an alkoxysilyl group, and a second functional group of at least one selected from the group consisting of an amino group, a thiol group, a carboxyl group, and an azide group; forming a second insulating layer different from the first insulating layer on the catalyst adsorption layer; patterning the second insulating layer to form a mask pattern; etching the first insulating layer by a wet etching method; selectively forming a catalyst layer; and forming a metal layer on the catalyst layer by an electroless plating method.

Electroless plating is accomplished by forming a metal salt and a polymer solution as a binder into a solid electrolyte block and depositing metal on the surface by rubbing or brushing the solid electrolyte block onto a surface with minimal or no water and without an electric potential/power source. The solid electrolyte block is also conformable/moldable and can be used to deposit metal on to both conductive and nonconductive surface through electroless deposition process.

A method for forming a metal wiring according to embodiments includes forming a first insulating layer on a substrate; forming a catalyst adsorption layer by bringing a surface of the first insulating layer into contact with a solution containing a compound having a triazine skeleton, a first functional group of one of a silanol group and an alkoxysilyl group, and a second functional group of at least one selected from the group consisting of an amino group, a thiol group, a carboxyl group, and an azide group; forming a second insulating layer different from the first insulating layer on the catalyst adsorption layer; patterning the second insulating layer to form a mask pattern; etching the first insulating layer by a wet etching method; selectively forming a catalyst layer; and forming a metal layer on the catalyst layer by an electroless plating method.

An ink composition including a metal salt amine complex; wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent. A process including forming a metal salt amine complex; adding a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator to the metal salt amine complex to form an ink. A process including providing an ink composition comprising a metal salt amine complex, wherein the metal salt amine complex is formed from a metal salt and an amine; a compound selected from the group consisting of a stable free radical, a photoacid generator, and a thermal acid generator; and an optional solvent; depositing the ink composition onto a substrate to form deposited features; and treating the deposited features on the substrate to form conductive features on the substrate.

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

Devices produced by patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate is covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.