An insulation layer formation method comprises: a first step in which a surface treatment is applied to a base material to form thereon a high-resistance layer having high electric resistivity; a second step in which metal plating parts are formed on the base material that has undergone the first step in such a manner as to allow a high-resistance layer to be formed thereon; and a third process in which a high-resistance layer is formed on the base material that has undergone the second step.

A substrate processing method includes discharging a processing liquid to a substrate, and discharging a mixed fluid that is produced by mixing a processing liquid and a purified water in a vapor state or a mist state thereof to a substrate where a processing liquid is discharged.

A substrate liquid processing apparatus configured to supply a plating liquid to a substrate includes a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path; an extrusion fluid sending device configured to send an extrusion fluid different from the plating liquid to the first flow path; and a discharge device connected to the temperature controller and configured to discharge a fluid supplied from the temperature controller.

A preparation method for an iron-based alloy powder EBSD test sample includes the following steps: surface electrolytic activation of an iron-based powder; ultrasonically cleaning the powder, and drying the powder to obtain a surface activated powder; adding the surface activated powder to a chemical embedding solution for ultrasonic dispersion; after the ultrasonic dispersion, performing a plating process; then heating to 80-92° C. for chemical reaction to prepare an iron-based alloy bulk which coated with nickel. The plating process is as follows: still standing, stirring, and repeating the still standing is taken as a cycle, and at least one cycle is performed to complete the plating process. Then grinding and electropolishing are done to the obtained iron-based alloy bulk coated with nickel to obtain the iron-based alloy powder EBSD test sample.

First, in a first step S101, a semiconductor layer composed of a p type Group III-V compound semiconductor is prepared. The semiconductor layer may be composed of a Group III-V compound semiconductor crystal. Next, in a second step S102, gold is grown on a surface of the above semiconductor layer according to an electroless plating method to form fine gold particles. In this step, for example, an electroless plating solution of gold is brought into contact with a surface of the semiconductor layer such as by immersing the semiconductor layer in the electroless gold plating solution. In addition, in this plating treatment, the liquid temperature of the electroless gold plating solution may be room temperature (about 20° C. to 30° C.).

A substrate liquid processing apparatus configured to perform a heating control over a processing liquid on a substrate with high accuracy in a unit of zones is provided. The substrate liquid processing apparatus includes a substrate holder configured to hold the substrate; a processing liquid supply configured to supply the processing liquid onto a processing surface of the substrate; and a heating unit configured to heat the processing liquid on the processing surface. The heating unit includes a heater, and a first sheet-shaped body and a second sheet-shaped body which are disposed to face the heater therebetween. The heater includes multiple heating elements provided in multiple heating zones of the heating unit.

An on-chip magnetic structure includes a magnetic material comprising cobalt in a range from about 80 to about 90 atomic % (at. %) based on the total number of atoms of the magnetic material, tungsten in a range from about 4 to about 9 at. % based on the total number of atoms of the magnetic material, phosphorous in a range from about 7 to about 15 at. % based on the total number of atoms of the magnetic material, and palladium substantially dispersed throughout the magnetic material.

An electroless platinum plating solution is disclosed that can be subjected to plating processing with high deposition efficiency, does not self-decompose even when it does not contain sulfur or heavy metals, and has excellent bath stability, and an electroless platinum plating solution that can suppresses out-of-pattern deposition of platinum and perform platinum plating only on a necessary portion. An electroless platinum plating solution is disclosed that contains a soluble platinum salt, a complexing agent and any of a borohydride compound, an aminoborane compound and a hydrazine compound, and has a pH of 7 or more, adding a specific hydroxymethyl compound represented by the following formula (1) or a salt thereof:
R.sup.1CH.sub.2OH(1) wherein R.sup.1 is an atomic group having an aldehyde group or a ketone group.

A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40 C.

The present invention includes methods of manufacturing a metal infused graphitic material. Also described is how this device may be rendered impermeable. The present invention includes the electroplating/electroless deposition of metal on exposed internal and external surfaces of a porous graphitic substrate. The deposition of metal on the internal structure is accomplished by replacing the void space in the porous substrate with an electrolyte solution containing dissolved metallic species. The plating is initiated either through electrochemical means, electroless means, chemical vapor deposition means, or other means obvious to one familiar in the art of metal plating. A post-deposition bath is also described wherein the plating may be removed from one or both sides of the external surface without impacting the internal pore plating.