A framework of copper oxide dendrites is formed on a copper substrate, and these are then coated or plated with silver, gold, or an equivalent metal to create metal-coated dendrites with nano-structures, favorably in range of 50 to 200 nanometers. The framework of metal-coated dendrites are well suited for use in surface-enhanced Raman spectroscopy and other practical applications.

There are provided: an aluminum alloy magnetic disk substrate including: an aluminum alloy base material including an aluminum alloy containing 0.4 to 3.0 mass % (hereinafter, simply referred to as %) of Fe, 0.1 to 3.0% of Mn, 0.005 to 1.000% of Cu, and 0.005 to 1.000% of Zn, with the balance of Al and unavoidable impurities; and an electroless NiP plated layer formed on a surface of the aluminum alloy base material, in which the peak value (BLEI) of Fe emission intensity at an interface between the electroless NiP plated layer and the aluminum alloy base material, as determined by a glow discharge optical emission spectrometry device, is lower than Fe emission intensity (AlEI) in the interior of the aluminum alloy base material, as determined by the glow discharge optical emission spectrometry device; and a method for producing the aluminum alloy magnetic disk substrate.

A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.

A multifunctional coating method involves cleaning a surface, applying a layer of corrosion-resistant alloy coating to the surface, and applying an oleo-hydrophobic composite coating over the corrosion-resistant alloy coating. An oil and gas pipe has an inner surface with a multifunctional coating applied using the multifunctional coating method, and has an inner oleo-hydrophobic composite coating, beneath the inner oleo-hydrophobic composite coating a corrosion-resistant alloy coating, and beneath the corrosion-resistant alloy coating untreated pipe or any other metallic substrate.

A surface-treated material of the present disclosure has a conductive substrate, and a surface treatment film which includes at least one layer of metal layers and is formed on the conductive substrate. The surface treatment film is a plating film. The surface treatment film is formed on a whole surface or a part of the conductive substrate through a zinc-containing layer that contains zinc as a main component and has a thickness of 50 nm or less, or is formed on the conductive substrate without through the zinc-containing layer. The surface-treated material has a ratio of a contact area to a test area of 85% or more as measured according to a tape test method defined in JIS H 8504: 1999.

Method for preparing high-strength and durable super-hydrophobic film layer on inner wall of elongated metal tube includes roughening treatment of inner wall of a metal tube, electrodepositing preparation of nickel-phosphorus alloy layer and functional coating, heat treatment, subsequent anodizing and low surface energy modification. The method greatly reduces the influence of local mass transfer resistance, and a uniform nanocrystalline film layer is electroplated under the ultrasound induction. Since only electroplating solution is filled in the tube during the preparation process, the consumption of device and raw materials is greatly reduced. Also, since silica particles are added to the electroplating solution in preparing the nanocrystalline film layer, the surface morphology can be made more uniform and denser in terms of the microscopic morphology. Nano-scale channels structures are etched, so that the super-hydrophobic inner surface can have a better ability to store air, and its water flow impact resistance is greatly enhanced.

There is provided a metal plate coated stainless material (100) which includes a stainless steel sheet (10) having formed thereon a passivation film (11) having a Cr/O value in the range of 0.05 to 0.2 and a Cr/Fe value in the range of 0.5 to 0.8 at the surface as measured by an Auger electron spectroscopy analysis and a metal plated layer (20) formed on the passivation film (11) of the stainless steel sheet (10), in which the metal plated layer (20) is a plated layer formed from any one metal selected from among Ag, Pd, Pt, Rh, Ru, Cu, Sn and Cr, or an alloy of these metals.

An electrode for an energy storage device including a Zn layer or Zn alloy layer, a Ni layer, and a Sn layer or Sn alloy layer formed by plating on a connecting terminal part of a positive electrode composed of Al so that the resistance value at the contacting point is reduced and the voltage of the energy storage device can be effectively supplied without any drop. Accordingly, this electrode can be soldered to a Cu negative electrode, which is composed of metal that is different species from Al, through a Sn layer or a Sn alloy layer so that jointing strength of the Al positive electrode and the Cu negative electrode can be enhanced. The contacting area is increased in comparison with the conventional jointing by spot-welding or conventional fastening by a bolt so that the resistance value at the contacting point is reduced.

A manufacturing method of a rotating machine (100) includes: a casing forming process (S0) of forming a casing (1) of the rotating machine (100) having openings (5, 6, 10, 11) and suctioning and discharging a fluid (F); a surface activating process (S2) of supplying and discharging a pretreatment liquid (W1) into and from the casing (1) through the openings (5, 6, 10, 11) and activating an inner surface (1a) of the casing (1); a preheating process (S4) of supplying and discharging a preheating liquid (W2) into and from the casing (1) through the openings (5, 6, 10, 11) and preheating the casing (1); a plating process (S5) of supplying and discharging a plating liquid (W3) into and from the casing (1) through the openings (5, 6, 10, 11), and circulating the plating liquid to plate the inner surface (1a) of the casing (1); and an assembling process (S7) of providing a rotating body (3, 4) such that the rotating body is covered from an outer peripheral side by the plated casing (1). In the surface activating process (S2), the preheating process (S4), and the plating process (S5), when the liquid level of each of the liquids used in each process is vertically changed in the casing (1), each of the liquids is supplied to the inner surface (1a) of the casing (1) in a range above the liquid level by a treatment liquid auxiliary supply device (18).

A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.