A heterocyclic compound having a structure in which a benzene ring and a nitrogen-containing heterocycle are condensed is added to a sulfuric acid solution that contains a persulfuric acid component such as peroxomonosulfuric acid, peroxomonosulfate, peroxodisulfuric acid, or peroxodisulfate as an oxidant and in which impurities that promote the reduction in the oxidant concentration are present. Here, the heterocyclic compound having a structure in which a benzene ring and a nitrogen-containing heterocycle are condensed is preferably a benzotriazole-based compound. The impurities that promote a reduction in the oxidant concentration are suitably one or more selected from copper ions, iron ions, nitrate ions, and nitrite ions. The method of the present invention of inhibiting a reduction in the oxidant concentration in a sulfuric acid solution containing a persulfuric acid component can inhibit the reduction in the oxidant concentration to a minimum even when impurities that cause a reduction in the oxidant concentration are mixed.

The processing system (1) is provided with an etching tank (2) and a circulation pipe (7) that exits from the bottom portion of the etching tank (2) and returns to the etching tank (2). The circulation pipe (7) is provided with a liquid feed pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10), and an oxidant concentration meter (11). The sulfuric acid concentration meter (10) and the oxidant concentration meter (11) can transmit measurement results to a calculation/control device (12). The etching tank (2) can be replenished with hydrogen peroxide water, sulfuric acid, and pure water through a hydrogen peroxide water supply line (13), a sulfuric acid supply line (14), and a pure water supply line (15). The calculation/control device (12) can adjust the supply amounts of hydrogen peroxide water, sulfuric acid, and pure water to respective desired amounts. Such a processing system enables etching of a resin molded article while maintaining both the sulfuric acid concentration and the oxidant concentration of a sulfuric acid solution that is free from hexavalent chromic acid or permanganic acid and contains an oxidizing substance obtained by mixing sulfuric acid and hydrogen peroxide water.

The processing system (1) is provided with an etching tank (2) and a circulation pipe (7) that exits from the bottom portion of the etching tank (2) and returns to the etching tank (2). The circulation pipe (7) is provided with a liquid feed pump (8), a heat exchanger (9), a sulfuric acid concentration meter (10), and an oxidant concentration meter (11). The sulfuric acid concentration meter (10) and the oxidant concentration meter (11) can transmit measurement results to a calculation/control device (12). The etching tank (2) can be replenished with hydrogen peroxide water, sulfuric acid, and pure water through a hydrogen peroxide water supply line (13), a sulfuric acid supply line (14), and a pure water supply line (15). The calculation/control device (12) can adjust the supply amounts of hydrogen peroxide water, sulfuric acid, and pure water to respective desired amounts. Such a processing system enables etching of a resin molded article while maintaining both the sulfuric acid concentration and the oxidant concentration of a sulfuric acid solution that is free from hexavalent chromic acid or permanganic acid and contains an oxidizing substance obtained by mixing sulfuric acid and hydrogen peroxide water.

A phenol resin composition used in a resin molded body for which a plating process is applied to a surface includes component (A), which is phenol resin and component (B), which is calcium carbonate.

Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or more and less than 0.2 μm; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 μm; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.

The disclosure provides a circuit substrate and a method for manufacturing the same. The circuit substrate includes a wiring and a substrate having a base region and a circuit region. The base region having a first pattern is constituted by a first thermoplastic material. The circuit region having a second pattern is constituted by a second thermoplastic material. The first pattern has a portion opposite to the second pattern. The wiring is formed on the circuit region along the second pattern. The first thermoplastic material is different from the second thermoplastic material, and the second thermoplastic material includes a catalyst particle.

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less as measured in accordance with JIS B0601-2001 and a kurtosis Sku of 2.0 or more and 3.5 or less as measured in accordance with ISO 25178; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

There is provided a method for manufacturing a printed wiring board that effectively suppresses pattern failure and is also excellent in fine circuit forming properties. This method includes: providing an insulating substrate including a roughened surface; performing electroless plating on the roughened surface of the insulating substrate to form an electroless plating layer less than 1.0 μm thick having a surface having an arithmetic mean waviness Wa of 0.10 μm or more and 0.25 μm or less and a valley portion void volume Vvv of 0.010 μm.sup.3/μm.sup.2 or more and 0.028 μm.sup.3/μm.sup.2 or less; laminating a photoresist on the surface of the electroless plating layer; performing exposure and development to form a resist pattern; applying electroplating to the electroless plating layer; stripping the resist pattern; and etching away an unnecessary portion of the electroless plating layer to form a wiring pattern.

A method for the production of metal-plated articles, including the step of depositing an electrically-conductive metallic layer on a surface of an article comprising a polymer composition comprising by weight: a) 40-60% of a propylene homopolymer, or propylene copolymer containing up to 5% by weight of ethylene and/or another C.sub.4-C.sub.10 α-olefin, and having a melting temperature of 155° C. or higher and/or a fraction soluble in xylene at 25° C. of 10% by weight or less; b) 10-20% of an ethylene-based elastoplastic copolymer, optionally, a copolymer of ethylene with C.sub.4-C.sub.10 α-olefin; c) 2-6% of a styrene block copolymer; d) optionally, up to 3% of a propylene homopolymer having a Melt Flow Rate (230° C./2.16 kg) of 500 g/10 min. or more; e) 15-50% of a filler; and f) optionally, up to 6% of a color pigment.

A treatment device 1 includes: a treatment tank 2; an electrolytic cell 6 including diamond electrodes continuous from a pipe 4 including a circulation pump 5; and a pipe 7 supplying from the electrolytic cell 6 to the treatment tank 2. The treatment tank 2 and the electrolytic cell 6 are filled with sulfuric acid having a predetermined concentration; current is applied to the electrolytic cell 6 to electrolyze the sulfuric acid and a persulfuric acid solution S is generated by electrolyzing the sulfuric acid; and the persulfuric acid solution S is supplied to the treatment tank 2 through the pipe 7. Besides, inside the treatment tank 2, a PPS resin board 8 is vertically suspended in a state of being fixed to a fixture 8A, and the PPS resin board 8 is treated by the persulfuric acid solution S.