A linear shape member is composed of a linear shape electrical insulating body comprising irregularities on a surface, and a plating layer coating the surface of the electrical insulating body. An average irregularities spacing Sm of the irregularities is not more than 20.0 m.

To provide a surface-treated polymer production method which can be performed in a simplified manner and at low cost. In order to achieve the aforementioned object, the surface-treated polymer production method according to the present invention include: reacting a surface of a polymer with a halogen oxide radical to surface-treat the polymer, and in the surface-treating, a reaction system is not irradiated with light.

A structure includes a metal layer and a plurality of interconnected unit cells forming a lattice contained at least partly within the metal layer, including at least a first unit cell formed of first interconnected graphene tubes, and a second unit cell formed of second interconnected graphene tubes, wherein the metal layer protrudes through holes within the lattice.

Manganese-(III) species is generated and regenerated in a mixed aqueous acid solution containing manganese-(II) species by injecting ozone gas in the mixed aqueous acid solution such that ozone oxidizes at least some of the manganese-(II) species to the manganese-(III) species with at least 60% Mn(III) generation efficiency. The acids include sulfuric acid and an alkane sulfonic acid. The aqueous acid solution containing manganese-(III) and manganese-(II) species is used to etch polymer materials. The etch is a chrome-free etch method.

A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 m to 0.2 m, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 m and less than or equal to 0.5 m, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25 C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

A substrate W having a non-plateable material portion 31 and a plateable material portion 32 formed on a surface thereof is prepared, and then, a catalyst is imparted selectively to the plateable material portion 32 by supplying a catalyst solution N1 onto the substrate W. Thereafter, a plating layer 35 is selectively formed on the plateable material portion 32 by supplying a plating liquid M1 onto the substrate W. A pH of the catalyst solution N1 is previously adjusted such that the plating layer 35 is suppressed from being precipitated on the non-plateable material portion 31 while being facilitated to be precipitated on the plateable material portion 32.

Provided are an electronic component manufacturing method by which even a platable layer made of a difficult-to-plate material can be easily plated with good adhesion without using a special chemical solution or a photolithography technique, and an electronic component which has a peel strength of 0.1 N/mm or greater as measured by a copper foil peel test. A picosecond laser beam having a pulse duration on the order of a picosecond or a femtosecond laser beam having a pulse duration on the order of a femtosecond is emitted at a surface of a platable layer (2) in order to roughen the surface, a wiring pattern is formed using a mask (13), and a plated part (12) is formed on the surface of the wiring pattern.

This disclosure includes coatings for increasing the physical and/or chemical properties of articles, for example, tubular metal articles such as those found in the oil and gas industry, as well as processes for making such coatings and articles comprising such coatings.

The present disclosure relates to an oxidation-resistant and/or corrosion-resistant hybrid structure including a metal layer (thin film layer) coated on the exterior of a conductive polymer structure, and a preparation method for the hybrid structure.