A method for the production of metal-plated articles, including the step of depositing an electrically-conductive metallic layer on a surface of an article comprising a polymer composition comprising by weight: a) 40-60% of a propylene homopolymer, or propylene copolymer containing up to 5% by weight of ethylene and/or another C.sub.4-C.sub.10 α-olefin, and having a melting temperature of 155° C. or higher and/or a fraction soluble in xylene at 25° C. of 10% by weight or less; b) 10-20% of an ethylene-based elastoplastic copolymer, optionally, a copolymer of ethylene with C.sub.4-C.sub.10 α-olefin; c) 2-6% of a styrene block copolymer; d) optionally, up to 3% of a propylene homopolymer having a Melt Flow Rate (230° C./2.16 kg) of 500 g/10 min. or more; e) 15-50% of a filler; and f) optionally, up to 6% of a color pigment.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

A treatment device 1 includes: a treatment tank 2; an electrolytic cell 6 including diamond electrodes continuous from a pipe 4 including a circulation pump 5; and a pipe 7 supplying from the electrolytic cell 6 to the treatment tank 2. The treatment tank 2 and the electrolytic cell 6 are filled with sulfuric acid having a predetermined concentration; current is applied to the electrolytic cell 6 to electrolyze the sulfuric acid and a persulfuric acid solution S is generated by electrolyzing the sulfuric acid; and the persulfuric acid solution S is supplied to the treatment tank 2 through the pipe 7. Besides, inside the treatment tank 2, a PPS resin board 8 is vertically suspended in a state of being fixed to a fixture 8A, and the PPS resin board 8 is treated by the persulfuric acid solution S.

There is provided a method for treating a surface comprising heating the object and the object with a solution comprising a thermal initiator and a polymerizable molecule, wherein the polymerizable molecule reacts with the surface and forms a covalent bond and optionally a covalently bound polymer on the surface of the object. Metal ions are bound to the surface to make the surface possible for adding further metal later. Advantages include that complicated geometries can be coated, problems with oxygen inhibition of the initiator is reduced, and surface reaction to form covalent bonds is promoted compared to the bulk polymerization reaction.

[Object]

To provide a copper clad laminate that is capable of achieving a good volume resistivity at an electroless copper plating layer of a low dielectric resin film while suppressing a transmission loss when being applied to a flexible circuit board, and a method for producing the copper clad laminate.

[Solving Means]

A copper clad laminate of the present invention includes a low dielectric resin film having a relative permittivity of 3.5 or lower and a dissipation factor of 0.008 or lower at a frequency of 10 GHz, and an electroless copper plating layer laminated on at least one surface of the low dielectric resin film. An Ni content in the electroless copper plating layer is 0.01 to 1.2 wt %, and the electroless copper plating layer has a volume resistivity of 6.0 μΩ.Math.cm or lower.

A composition which conditions a surface for electroless deposition of a metal is disclosed. The composition comprises a polymer surfactant comprising repeating units of a monomer, wherein each of the repeating units comprises a functional group; a metal ion; and water, wherein the functional group in each of the repeating units forms a complex with the metal ion. In a preferred embodiment, the functional group is amine, and the surfactant comprises polyethyleneimine and/or polyallylamine. The metal ion comprises cobalt, rhodium, palladium or silver. A method of forming the composition as well as a method of electroless deposition using the composition are also disclosed.

Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.

Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.

A transistor manufacturing method includes forming a source electrode and a drain electrode on a substrate, forming a layer including an insulator layer to cover the source electrode and the drain electrode, and forming a gate electrode on the layer including the insulator layer, wherein the forming the gate electrode includes forming a plating base film, forming a protection layer of the plating base film, forming a photoresist layer on the protection layer to expose the photoresist layer with desired patterning light, causing the exposed photoresist layer to come into contact with a developer to remove the photoresist layer and the protection layer until the plating base film is uncovered corresponding to the patterning light, and after depositing a metal on the uncovered plating base film, causing an electroless plating solution to come into contact with the plating base film to perform electroless plating.