The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

The present invention relates to a composition for forming a conductive pattern by irradiation of electromagnetic waves capable of allowing excellent formation of a conductive micro-pattern on various polymer resin products comprising a polycarbonate resin or on resin layers by a simple method such as irradiation of electromagnetic waves and plating, and capable of reducing the degradation of the physical properties of the resin products or resin layers caused by the irradiation of electromagnetic waves, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern by irradiation of electromagnetic waves comprises: a polymer resin comprising a polycarbonate resin; and an electromagnetic wave-absorbing inorganic additive which absorbs an electromagnetic wave having a wavelength in the infrared region and satisfies the characteristic that a laser sensitivity Ls defined by a predetermined relational expression is 1.6<−log(Ls)<6.0.

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.

The invention relates to an aqueous alkaline pre-treatment solution for use prior to deposition of a palladium activation layer on a substrate in manufacturing an article with an integrated circuit and a method and use thereof, wherein the solution comprises: at least one hydroxycarboxylic acid or salt thereof according to the general formula (I)

[RCH.sub.2—(RCH).sub.n—COO.sup.−].sub.m M.sup.m+  (I)

wherein n is integer from 2 to 4 and m is 1 or 2, R is independently H or OH with proviso that at least one R is OH, and wherein M.sup.m+ with m: 1 is hydrogen, ammonium or alkali metal; or M.sup.m+ with m: 2 is earth alkali metal, at least one polyoxyethylene sorbitan fatty acid ester, at least one sulphonated fatty acid or a salt thereof.

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.

An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1): ##STR00001## in which Z.sup.1 and Z.sup.2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z.sup.1 and Z.sup.2 is not hydrogen; and in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are: i. R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are hydrogen; or ii. R.sup.1 with R.sup.2 form together an aromatic ring, R.sup.3 and R.sup.4 are hydrogen; or iii. R.sup.3 with R.sup.4 form together an aromatic ring, R.sup.1 and R.sup.2 are hydrogen; or iv. both R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 form together an aromatic ring, respectively.

An electrode for a battery, comprising an active material and a metallic fabric is disclosed. The metallic fabric comprises fibers being at least partially covered by a coating of nickel or copper, which comprises a layer and a plurality of protrusions protruding from the layer. The active material is attached on the protrusions. The metallic fabric provides a high electrical conductivity and a high mechanical stability, and demonstrates outstanding performance for the use as a current collector of battery.

A method of forming a silver catalyst layer in chemical plating includes providing a substrate; applying a silver-containing solution onto the substrate; and applying energy of activation to the silver-containing solution to form a silver catalyst layer over the substrate. The silver-containing solution includes silver ions, a diamine compound, a carboxylic acid compound, and a solvent. In addition, the substrate having the silver catalyst layer thereon can be immersed into a chemical plating solution to form a metal layer over the silver catalyst layer.

An oxide superconducting wire includes a superconducting laminate including an oxide superconducting layer disposed, either directly or indirectly, on a substrate, and a stabilization layer which is a Cu plating layer covering an outer periphery of the superconducting laminate. An average crystal grain size of the Cu plating layer is 3.30 μm or more and equal to or less than a thickness of the Cu plating layer.