A metal-plated carbon material includes: a carbon material; and a metal layer covering a surface of the carbon material, in which, in the metal layer, crystal grains forming the metal layer have an average crystal grain size of 110 nm or less. A method of manufacturing a metal-plated carbon material, includes: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal; and a first energization deposition step of energizing the metal-complex-fixed carbon material in an electroless plating solution containing a second metal.

An electroless copper plating bath for depositing a copper or copper alloy layer on a surface of a substrate, including copper ions; a reducing agent; a complexing agent for copper ions; wherein the bath further includes at least one compound according to formula (1):

##STR00001## in which Z.sup.1 and Z.sup.2 are independently selected from the group consisting of hydrogen; carboxylic acid; carboxylate; sulfonic acid; sulfonate; carboxamide; nitrile; nitro; trialkylammonium; 2-carboxyvinyl; 2-vinylcarboxylate; 2-(trialkylammonium)vinyl; hydroxamic acid; and oxime; provided at least one of Z.sup.1 and Z.sup.2 is not hydrogen; and in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are: i. R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are hydrogen; or ii. R.sup.1 with R.sup.2 form together an aromatic ring, R.sup.3 and R.sup.4 are hydrogen; or iii. R.sup.3 with R.sup.4 form together an aromatic ring, R.sup.1 and R.sup.2 are hydrogen; or iv. both R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 form together an aromatic ring, respectively.

A method of manufacturing a touch panel including providing a substrate having a display area and a peripheral area is provided. A metal layer and a metal nanowire layer are disposed, wherein a first portion of the metal nanowire layer is disposed in the display area, and a second portion of the metal nanowire layer and the metal layer are disposed in the peripheral area. A patterned layer with a pattern is disposed. A patterning step is performed according to the patterned layer, wherein the patterning step includes forming the metal layer into multiple peripheral wires and simultaneously forming the second portion of the metal nanowire layer into multiple etching layers by using an etching solution configured to etch the metal layer and the metal nanowire layer. A touch panel is further provided.

A method for fabricating a metallic wire mesh touch sensor with reduced visibility. A metallic wire mesh is formed on a transparent substrate such that the surface of the metallic wires is roughened or textured, so as to cause high scattering of incident light, thereby minimizing specularly reflected light towards the user. The metal lines are formed over patterned catalytic photoresist. The rough or textured surface of the metallic wires is achieved by roughening or texturing the catalytic photoresist, by selecting parameters of electronless plating of copper, or both. An RMS surface roughness of about 50 nm would scatter approximately 70% of incident cyan light incident at 30°.

Additive manufacturing compositions and methods for fabricating a conductive article with the same are provided. The additive manufacturing composition may include a 3D printable material and a metal precursor disposed in the 3D printable material. The metal precursor may include a metal salt, a metal particle, or combinations thereof. The method may include forming a first layer of the article on a substrate, where the first layer includes the additive manufacturing composition, forming a second layer of the article adjacent the first layer, and binding the first layer with the second layer to fabricate the article. The method may also include plating a metal on at least a portion of the article to fabricate the conductive article.

Proposed is a mobile device case that accommodates or covers a substrate and an electronic element located on the substrate. The case includes: a case frame made of a high molecular material including a resin and having a cover part for accommodating or covering the substrate and protrusions protruding from the cover part in such a manner as to be extended close to the electronic element; and a metal coating layer formed by coating a metal on a surface of the case frame including the protrusions to improve electromagnetic shielding ability.

Additive manufacturing compositions and methods for fabricating a conductive article with the same are provided. The additive manufacturing composition may include a 3D printable material, a plurality of porogens disposed in the 3D printable material, and a metal precursor disposed in the 3D printable material. The metal precursor may include a metal salt, a metal particle, or combinations thereof. The method may include forming a first layer of the article on a substrate, where the first layer includes the additive manufacturing composition, forming a second layer of the article adjacent the first layer, and binding the first layer with the second layer to fabricate the article. The method may also include plating a metal on the article to fabricate the conductive article.

The present disclosure discloses an etching solution, a touch panel, and a manufacturing method thereof. The manufacturing method of the touch panel includes the following operations. A substrate is provided, in which the substrate has a visual area and a peripheral area. A metal layer and a metal nanowire layer are disposed, in which a first portion of the metal nanowire layer is disposed in the visual area, and a second portion of the metal nanowire layer and the metal layer are disposed in the peripheral area. A patterning step is performed. The patterning step includes simultaneously forming multiple peripheral wires and the second portion of the metal nanowire layer by using the etching solution for etching the metal layer and the metal nanowire layer.

The present invention relates to a production of electro-conductive traces on the surface of polymeric articles using laser excitation for the areas to be metallised, followed by activation of the laser-treated areas with a metal salt solution, the article is later rinsed in distilled water, and the activated areas are metallised in the chemical plating bath. The aims of the invention are to produce cost-effective conductive traces of the circuits for the application in 3D moulded interconnect devices, to increase the quality of the circuit traces improving the selective metallization process. An irradiation dose and scanning parameters for the surface excitation are chosen experimentally, provided that a negative static charge appears on the surface of the laser-irradiated areas. The chosen parameters ensure that any surface degradation of the polymer is avoided. The activation solution used in the method is aqueous solution consisting of one chosen salt comprising: silver (Ag), copper (Cu), nickel (Ni), cobalt (Co), zinc (Zn), chrome (Cr), tin (Sn) salt.

Prior to electroless copper plating on substrates containing copper, an aqueous composition containing select six-membered heterocyclic nitrogen compounds is applied to the substrate. The aqueous composition containing the select six-membered heterocyclic nitrogen compounds counteract passivation of the copper on the substrate to improve the electroless copper plating process.