C04B2235/326

OXIDE SINTERED BODY AND METHOD FOR MANUFACTURING THE SAME, SPUTTERING TARGET, AND SEMICONDUCTOR DEVICE
20170069474 · 2017-03-09 ·

There is provided an oxide sintered body including indium, tungsten and zinc, wherein the oxide sintered body includes a bixbite type crystal phase as a main component and has an apparent density of higher than 6.6 g/cm.sup.3 and equal to or lower than 7.5 g/cm.sup.3, a content rate of tungsten to a total of indium, tungsten and zinc in the oxide sintered body is higher than 0.5 atomic % and equal to or lower than 5.0 atomic %, a content rate of zinc to the total of indium, tungsten and zinc in the oxide sintered body is equal to or higher than 1.2 atomic % and equal to or lower than 19 atomic %, and an atomic ratio of zinc to tungsten is higher than 1.0 and lower than 60. There are also provided a sputtering target including this oxide sintered body, and a semiconductor device.

Composite ceramic which comprises a conversion phosphor and a material having a negative coefficient of thermal expansion

The present invention relates to a composite ceramic which comprises a conversion phosphor and a further material, characterized in that the further material has a negative coefficient of thermal expansion, and to a process for the preparation thereof. Furthermore, the present invention also relates to the use of the composite ceramic according to the invention as emission-converting material, preferably in a white light source, and to a light source, a lighting unit and a display device.

OXIDE SINTERED BODY AND SEMICONDUCTOR DEVICE

There is provided an oxide sintered body including indium, tungsten, and at least one of zinc and tin, wherein the oxide sintered body includes, as a crystal phase, a complex oxide crystal phase including tungsten and at least one of zinc and tin. There is also provided a semiconductor device including an oxide semiconductor film formed by a sputtering method by using the oxide sintered body as a target.

OXIDE SINTERED BODY AND METHOD FOR MANUFACTURING THE SAME, SPUTTERING TARGET, AND SEMICONDUCTOR DEVICE

There is provided an oxide sintered body including indium, tungsten and zinc, wherein the oxide sintered body includes a bixbite type crystal phase as a main component and has an apparent density of higher than 6.5 g/cm.sup.3 and equal to or lower than 7.1 g/cm.sup.3, a content rate of tungsten to a total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %, and a content rate of zinc to the total of indium, tungsten and zinc is higher than 1.2 atomic % and lower than 30 atomic %. There are also provided a sputtering target including this oxide sintered body, and a semiconductor device including an oxide semiconductor film formed by a sputtering method by using the sputtering target.

Tungsten suboxide ceramic target

A target for sputtering, use of the target and method of manufacture of the target is provided. The target has a single piece target material for sputter deposition, with at least 1 mm thickness of material for sputtering, having a lamellar structure and comprising a metal oxide with at least 50 wt. % or more of tungsten oxide. The atomic ratio of oxygen over tungsten results in a compound with oxygen deficiency with respect to the stoichiometric tungsten oxide. The method includes spraying metallic tungsten and/or tungsten oxide powder in amounts so as to provide a layer of material for sputtering being at least 1 mm thick and comprising non-stoichiometric tungsten oxide.

Ceramic material for capacitor
12518919 · 2026-01-06 · ·

The present invention relates to a ceramic material for a multilayer capacitor. The ceramic material has a composition according to the following general formula:
Pb.sub.(y1.5a0.5b+c+0.5d0.5ef)Ca.sub.aA.sub.b(Zr.sub.1xTi.sub.x).sub.(1cded)E.sub.cFe.sub.dNb.sub.eW.sub.fO.sub.3, where A is one or more of the group of Na, K and Ag; E is one or more of the group of Cu, Ni, Hf, Si and Mn; and 0