Enantiomers of butanediol diglycidyl ether (BDDE) are present in an enantiomerically enriched enantioenriched mixture of BDDE stereisomers or in an enantiomerically pure BDDE. Enantiomerically enriched or pure BDDE is useful as a cross-linking agent, such as in the preparation of a cross-linked hyaluronic acid product.

The present invention relates to a process for preparing a compound having the formula (I), said process comprising the following steps: a) the addition of an oxygen source into a solution of a compound of formula (II), in a water-miscible solvent, b) the addition of a laccase in the solution obtained after step a); and c) the possible recovering of the compound of formula (I) thus obtained.

##STR00001##

The present invention relates to a process for preparing a compound having the formula (I), said process comprising the following steps: a) the addition of an oxygen source into a solution of a compound of formula (II), in a water-miscible solvent, b) the addition of a laccase in the solution obtained after step a); and c) the possible recovering of the compound of formula (I) thus obtained.

##STR00001##

The present invention provides an epoxy compound which is 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene. Also, the present invention provides a method for producing [1,1′-binaphthalene]-2,2′,7,7′-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1′-binaphthalene]-2,2′,7,7′-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1′-binaphthalene]-2,2′,7,7′-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1′-binaphthalene]-2,2′,7,7′-tetraol or [1,1′-binaphthalene]-2,2′,7,7′-tetraol monohydrate with epihalohydrin.

The present invention provides an epoxy compound which is 2,2′,7,7′-tetraglycidyloxy-1,1′-binaphthalene. Also, the present invention provides a method for producing [1,1′-binaphthalene]-2,2′,7,7′-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1′-binaphthalene]-2,2′,7,7′-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1′-binaphthalene]-2,2′,7,7′-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1′-binaphthalene]-2,2′,7,7′-tetraol or [1,1′-binaphthalene]-2,2′,7,7′-tetraol monohydrate with epihalohydrin.

Disclosed herein are compositions and methods of making phenolic compounds, and resins comprising these phenolic compounds. The compounds include multifunctional epoxies, amino glycidyl derivatives, and multi-functional amines prepared from hydroxymethyl derivatives of phenols and bisphenols

Laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor using a composition having the following (a) to (c): (a) a first organic compound represented by Formula (1) below (R represents a hydrogen atom or a glycidyl group. A plurality of Rs may be identical to or different from each other, but each of at least two Rs is a glycidyl group), (b) a second organic compound represented by Formula (2) below, and (c) a photocationic polymerization initiator

##STR00001##

The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: ##STR00001##
wherein n represents an integer of 0 to 10.

The present invention relates to a tetramethylbiphenol epoxy resin represented by the following formula (1), which is an epoxy resin having excellent solvent solubility, a small hydrolyzable chlorine amount and further an appropriate melt viscosity and being effectively applicable, to a semiconductor sealing material and electrical or electronic components such as laminate sheet: ##STR00001##
wherein n represents an integer of 0 to 10.

High purity epoxide compounds methods for preparing the high purity epoxide compounds, and compositions derived from the epoxide compounds are provided. Also provided are materials and articles derived from the epoxide compounds.